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AMD XC2S200E-6FG456C
- Part No.:
- XC2S200E-6FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S200E-6FG456C.pdf
- Description:
- IC FPGA 289 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC2S200E-6FG456C from Xilinx is a 200,000-system-gate Spartan®-IIE Field-Programmable Gate Array featuring 5,292 logic cells, 289 user I/Os in a 456-ball Fine-Pitch BGA (FG456) package, and four Delay-Locked Loops (DLLs) for clock domain control. It operates at 1.8V core voltage with configurable I/O banks supporting LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI standards - deployed in industrial control logic, legacy interface bridging, and reconfigurable data acquisition systems.
For engineers reviewing the XC2S200E-6FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include DLL-supported clock multiplication/phase shifting, dual-voltage I/O bank isolation (VCCO/VREF), distributed RAM per LUT (16 bits), block RAM capacity (56 Kbits), and hot-swap capability compliant with CompactPCI v2.2.
Technical Context
The XC2S200E-6FG456C implements a hierarchical FPGA architecture with 1,176 Configurable Logic Blocks (CLBs), each containing two slices of four 4-input LUTs with integrated flip-flops, dedicated carry chains, and F5/F6 multiplexers enabling up to 19-input logic functions. Its routing fabric supports predictable timing closure beyond 200 MHz.
Four corner-located DLLs provide zero-delay clock distribution, programmable phase shift, frequency multiplication (×2, ×4), and division (÷2, ÷4); all I/O banks are independently configurable for VCCO (1.5V/1.8V/2.5V/3.3V) and VREF (0.75V–1.5V), enabling mixed-standard interfaces on a single device without level-shifting components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 5,292 - provides ~200K system gate capacity for medium-complexity digital logic implementation |
| User I/O Count | 289 - supports high-pin-count parallel buses, multi-channel ADC/DAC interfaces, and multi-protocol I/O expansion |
| Block RAM | 56 Kbits (14 × 4K-bit dual-port blocks) - enables on-chip FIFOs, buffer memory, or small lookup tables without external SRAM |
| Distributed RAM | 75,264 bits (16 bits per LUT) - delivers fast, low-latency register-based memory for state machines and pipeline registers |
| DLLs | 4 independent Delay-Locked Loops - eliminates clock skew, enables phase-aligned clock domains, and supports jitter-tolerant synchronous design |
| I/O Standards | 19 supported (LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI, GTL+) - allows direct interfacing to DDR SDRAM, PCI slots, and differential serial links |
| Hot-Swap Support | Yes - permits live insertion into powered backplanes per CompactPCI v2.2; no external protection circuitry required |
Pinout & Package
XC2S200E-6FG456C is housed in a 456-ball Fine-Pitch Ball Grid Array (FG456) package with 0.8 mm ball pitch, 27 mm × 27 mm body size, and eight independent I/O banks. Each bank has dedicated VCCO and VREF pins; global clocks (GCLK0–GCLK3) occupy corner positions for minimal skew.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew dedicated clock inputs routed to all CLBs and DLLs; used for primary clock domain synchronization |
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset that clears configuration memory and forces reinitialization from external PROM or host controller |
| DONE | Configuration Completion Indicator | Open-drain output pulled High when bitstream loading completes and internal logic is released from reset |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and board-level interconnect verification |
| VCCINT | Core Supply Voltage | 1.8V ± 3% supply powering CLBs, DLLs, and internal routing; requires low-noise decoupling near package corners |
| VCCO_0–VCCO_7 | Bank-Specific I/O Output Voltage | Eight independent VCCO supplies (1.5V/1.8V/2.5V/3.3V selectable per bank) setting output swing and input threshold levels |
| VREF_0–VREF_7 | Bank-Specific Input Reference Voltage | Eight independent VREF inputs (0.75V–1.5V) enabling mixed-signaling standards (e.g., SSTL and HSTL) within same bank |
Key Features
| Feature | Design Value |
|---|---|
| SelectRAM™ Hierarchical Memory | Combines 56 Kbits of true dual-port block RAM with 75,264 bits of distributed RAM per LUT - enables pipelined memory access and concurrent read/write operations |
| Dedicated Carry Logic | Two independent carry chains per CLB (2-bit height) - accelerates arithmetic pipelines, counters, and accumulator designs without LUT resource penalty |
| Configurable I/O Banking | Eight isolated banks with independent VCCO/VREF - supports simultaneous PCI (3.3V), SSTL2 (2.5V), and LVDS (2.5V) signaling on one device |
| Hot-Swap I/O Protection | No latch-up risk during live insertion; I/O pins remain high-Z until configuration completes - eliminates need for hot-swap controllers or series resistors |
| Unlimited In-System Reprogrammability | SRAM-based configuration allows field updates via JTAG or slave serial mode - supports firmware patches and protocol adaptation without hardware change |
Applications
| Industrial PLC Logic Controller | Legacy Bus Interface Bridge |
|---|---|
|
Use Scenario: Replacing ASIC-based motion control sequencers in CNC machine tool cabinets where space, heat, and long-term obsolescence risk constrain redesign cycles. IC Role / Device Role / Timing Role: Configurable state-machine engine implementing real-time axis coordination, encoder feedback parsing, and safety interlock monitoring with sub-microsecond response latency. Use Value: Enables firmware-driven logic updates for new motor profiles or safety protocols without PCB respin; DLL-synchronized timers ensure deterministic I/O sampling aligned to servo clock domains. |
Use Scenario: Bridging ISA or PCI bus peripherals (e.g., analog I/O cards, relay modules) to modern ARM-based supervisory controllers in factory automation retrofit projects. IC Role / Device Role / Timing Role: Protocol translator mapping legacy parallel address/data strobes to AXI or APB transactions while managing wait-state insertion and burst-length negotiation. Use Value: Supports mixed-voltage operation (3.3V PCI + 5V-tolerant inputs via external resistor) and hot-swap insertion - allowing card replacement without shutting down production line controllers. |
| Reconfigurable Data Acquisition Node | Communications Protocol Accelerator |
|
Use Scenario: Modular sensor aggregation unit in environmental monitoring systems requiring flexible sampling rates, channel counts, and trigger conditions across diverse transducer types. IC Role / Device Role / Timing Role: Time-multiplexed ADC interface controller with on-chip FIFO buffering, timestamp generation, and packet framing logic before Ethernet transmission. Use Value: 56 Kbits block RAM stores >1,000 samples at 1 MSPS; distributed RAM implements real-time FIR filters; DLL-stabilized sampling clocks reduce jitter-induced SNR degradation. |
Use Scenario: Offloading CRC calculation, HDLC framing, and Manchester encoding/decoding from microcontrollers in industrial wireless sensor networks (e.g., ISA100.11a edge nodes). IC Role / Device Role / Timing Role: Dedicated coprocessor handling bit-level protocol processing at line rate, freeing host MCU for application-layer tasks and power management. Use Value: LUT-based shift registers capture burst-mode serial streams; carry chains accelerate polynomial division; LVDS I/O supports 100+ Mbps differential links to RF transceivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfiguration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC2S300E-6FG456C | Higher density (6,912 logic cells, 329 I/Os, 64 Kbits block RAM); identical FG456 package and -6 speed grade | Supports larger state machines and deeper memory buffers; suitable when XC2S200E-6FG456C resources approach 90% utilization | Select if future scalability or additional peripheral integration (e.g., dual CAN, extra UARTs) is anticipated without changing PCB layout |
| Xilinx XC3S200-4PQ240C | Spartan-3 generation; 200K system gates but 240-pin PQFP package, 1.2V core, no native LVDS, only 2 DLLs | Lacks differential I/O support and hot-swap capability; requires board redesign due to different footprint and voltage rails | Consider only for cost-sensitive, non-differential, non-hot-swap applications where legacy PQFP assembly infrastructure exists |
Compared with XC2S200E-6FG456C, XC2S300E-6FG456C offers direct pin-compatible upgrade path with higher logic and memory resources, while XC3S200-4PQ240C represents a generational shift requiring PCB revision and losing key features like LVDS and hot-swap - making it unsuitable for drop-in replacement.
Availability
XC2S200E-6FG456C is available at Aetrix Electronics and suitable for industrial control logic, legacy interface bridging, and reconfigurable data acquisition systems requiring stable component supply throughout extended product lifecycles.
Supply support for XC2S200E-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA technology enables customizable digital hardware implementation without ASIC development costs.
The Spartan-IIE family was designed for cost-sensitive, high-volume applications demanding reprogrammability, mixed-voltage I/O, and deterministic timing - targeting industrial automation, communications infrastructure, and test equipment markets.
FAQ
What is the maximum operating frequency of the XC2S200E-6FG456C?
The XC2S200E-6FG456C is rated for system performance beyond 200 MHz, with the "-6" speed grade specifying guaranteed timing closure for critical paths under worst-case commercial temperature (0°C to +85°C) and voltage (1.8V ±3%) conditions. Actual achievable frequency depends on design topology, placement, and routing - verified via Xilinx ISE timing analysis using the -6 speed file.
Does the XC2S200E-6FG456C support LVDS I/O natively?
Yes, the XC2S200E-6FG456C supports LVDS I/O natively across up to 120 differential I/O pairs. It requires VCCO = 2.5V and no external termination resistors for point-to-point connections; common-mode voltage is internally biased to 1.25V, meeting ANSI TIA/EIA-644-A specifications for low-power differential signaling.
How many DLLs does the XC2S200E-6FG456C include, and what functions do they support?
The XC2S200E-6FG456C includes four independent Delay-Locked Loops (DLLs), one located at each die corner. Each DLL supports clock delay elimination, frequency multiplication (×2, ×4), division (÷2, ÷4), and fine phase shifting (±90° in 12.5% increments), enabling precise clock domain alignment for high-speed I/O and internal logic synchronization.
Is the XC2S200E-6FG456C compatible with hot-swap insertion in powered backplanes?
Yes, the XC2S200E-6FG456C supports hot-swap insertion per CompactPCI v2.2 requirements. Its I/O pins remain high-impedance until configuration completes, with no current path to VCCINT/VCCO during insertion, and immunity to latch-up - confirmed in DS077-1 Section "Hot Swap, Hot Insertion, Hot Socketing Support".
What configuration modes are supported by the XC2S200E-6FG456C?
The XC2S200E-6FG456C supports master serial (via on-chip oscillator and external PROM), slave serial, slave parallel, and IEEE 1149.1 boundary scan configuration modes. Configuration bitstream is loaded into SRAM cells; full reprogramming is possible in-system without power cycle, using Xilinx Platform Flash PROMs or host processor control.
XC2S200E-6FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-IIE
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 289
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S200E-6FG456C FAQ
1.How can I place an order for XC2S200E-6FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S200E-6FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S200E-6FG456C reliable?
The price and inventory of XC2S200E-6FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200E-6FG456C is usually 5 days.
3.What payment methods are accepted for XC2S200E-6FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200E-6FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S200E-6FG456C?
XC2S200E-6FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S200E-6FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S200E-6FG456C?
For technical support, including XC2S200E-6FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200E-6FG456C requirements.
6.How does Aetrix verify that XC2S200E-6FG456C is sourced from the original manufacturer or authorized distributors?
All XC2S200E-6FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200E-6FG456C meets industry standards.
7.What is the process for return or replacement of XC2S200E-6FG456C?
All XC2S200E-6FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200E-6FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S200E-6FG456C part is unused and in its original packaging.
Return procedure for XC2S200E-6FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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