My Inquiry
My Account
AMD XC2S200E-6FGG456C
- Part No.:
- XC2S200E-6FGG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S200E-6FGG456C.pdf
- Description:
- IC FPGA 289 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,517
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2S200E-6FGG456C from Xilinx is a second-generation Spartan-IIE Field-Programmable Gate Array with 5,292 logic cells, 289 user I/Os, and four Delay-Locked Loops (DLLs) for clock domain control. It operates at 1.8V core voltage and supports 19 I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI-compliant 3.3V interfaces. It is used in high-volume embedded control, industrial interface bridging, and legacy system re-engineering where ASIC replacement with field-upgradable logic is required.
For engineers reviewing the XC2S200E-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include its 456-ball Fine-Pitch BGA (FGG456) package, -6 speed grade (guaranteed 200 MHz system performance), commercial temperature range (0°C to +85°C), and support for hot-swap insertion in CompactPCI systems.
Technical Context
The XC2S200E-6FGG456C implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its architecture includes two columns of block RAM (56 Kbits total), distributed RAM (75,264 bits via LUTs), and four corner-placed DLLs enabling zero-delay clock distribution, phase shifting, and frequency multiplication/division.
I/O functionality is organized into eight independent banks, each supporting mixed signaling standards under shared VCCO (e.g., 3.3V for LVTTL/PCI/SSTL3, 2.5V for SSTL2/LVCMOS2). Each IOB provides three registers (input/output/3-state), programmable polarity, weak-keeper circuits, and IEEE 1149.1 boundary scan - all configurable via bitstream loaded at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 5,292 - defines maximum combinational and sequential logic capacity; enables implementation of medium-complexity controllers or protocol engines. |
| User I/O Pins | 289 - supports dense peripheral interfacing; includes four global clock/user input pins. |
| Block RAM | 56 Kbits - configured as true dual-port 4K-bit blocks; suitable for FIFOs, buffers, or small lookup tables without external memory. |
| DLLs | 4 - located at die corners; eliminate clock skew, enable phase alignment across large designs, and support jitter-tolerant clock domain crossing. |
| Speed Grade | -6 - guarantees timing closure up to 200 MHz system clock frequency under commercial conditions. |
| Core Voltage | 1.8V - reduces dynamic power vs. older 2.5V FPGAs; requires dedicated low-noise regulation. |
| I/O Standards | 19 - includes LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI; enables direct connection to DDR SDRAM, PCI buses, and differential serial links. |
Pinout & Package
XC2S200E-6FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 289 user I/Os distributed across eight independent I/O banks. Each bank has dedicated VCCO and VREF pins; ball pitch is 0.8 mm. The package supports Pb-free assembly and hot-swap insertion.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Four dedicated low-skew clock inputs routed to all CLBs; essential for synchronous design partitioning and timing-critical paths. |
| PROGRAM_B | Configuration Initiation | Active-low signal that resets configuration logic and clears internal SRAM; must be pulled high after power-up for normal operation. |
| DONE | Configuration Completion | Open-drain output indicating successful bitstream loading; drives external pull-up; used to enable downstream logic post-configuration. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; enables in-system programming, debugging, and structural verification without dedicated test fixtures. |
| VCCINT | Core Power Supply | 1.8V supply for CLBs, DLLs, and internal routing; requires tight regulation (±3%) and local decoupling. |
| VCCO_0–VCCO_7 | I/O Bank Power | Eight independent VCCO supplies - each powers one I/O bank; allows mixed-voltage I/O (e.g., 3.3V on Bank 0, 2.5V on Bank 1). |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltages for SSTL/HSTL/LVDS input thresholds; must be externally supplied and stable within ±1%. |
Key Features
| Feature | Design Value |
|---|---|
| SelectRAM™ Hierarchical Memory | Combines 56 Kbits block RAM (dual-port, 4K-bit blocks) and 75,264 bits distributed RAM (LUT-based); eliminates need for external SRAM in many control applications. |
| Four Dedicated DLLs | Enable clock deskewing, multiplication (×2, ×4), division (/2, /4), and phase adjustment (0°–360° in 90° steps); critical for DDR interface timing and multi-clock domain synchronization. |
| Hot-Swap I/O Support | Allows safe insertion into powered CompactPCI backplanes; no latch-up risk; I/Os remain high-Z until configuration completes - verified per PCN2002-05. |
| 19 Programmable I/O Standards | Includes PCI 3.3V/66 MHz, LVDS, SSTL2/3, HSTL Class I/III/IV; enables direct interfacing to memory, processors, and high-speed buses without level-shifting ICs. |
| Unlimited In-System Reprogrammability | Configuration stored in SRAM; reloaded via JTAG, master/slave serial, or slave parallel mode; supports field firmware updates without hardware change. |
Applications
| Industrial Motion Controller | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop motor control in CNC machines using encoder feedback and PWM outputs. IC Role / Device Role / Timing Role: FPGA fabric implements PID computation, quadrature decoding, and deterministic PWM generation; DLLs synchronize encoder sampling and output update cycles. Use Value: Replaces aging ASICs with field-upgradable logic; 289 I/Os directly drive 16-axis step/direction signals and analog monitoring lines without glue logic. | Use Scenario: Bridging ISA or VME bus peripherals to modern microprocessor subsystems in test equipment. IC Role / Device Role / Timing Role: Protocol translator implementing address decoding, data buffering, and handshaking conversion between asynchronous legacy and synchronous CPU buses. Use Value: Leverages 56 Kbits block RAM for FIFO buffering and 19 I/O standards to match both ISA (TTL) and host processor (LVCMOS25) voltage domains in one device. |
| CompactPCI Hot-Swap Module | Low-Cost Video Frame Buffer |
Use Scenario: Modular I/O card for industrial automation racks requiring live insertion/removal without system shutdown. IC Role / Device Role / Timing Role: Manages hot-swap sequencing, status reporting, and isolation of peripheral signals; uses PROGRAM_B and DONE to coordinate with backplane controller. Use Value: Built-in hot-swap compliance eliminates need for external protection ICs; eight I/O banks allow mixed 3.3V (PCI) and 2.5V (FPGA logic) signaling on same board. | Use Scenario: Embedded display subsystem capturing VGA-resolution video for medical imaging preview. IC Role / Device Role / Timing Role: Captures 640×480@60Hz pixel stream via LVDS receivers; stores frames in dual-port block RAM; outputs to RGB DAC via LUT-based timing generator. Use Value: 75,264 bits distributed RAM stores line buffers; 56 Kbits block RAM holds full frame (307,200 bytes); avoids external video RAM and reduces BOM cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S200-6FGG456C | No hot-swap support; lacks PCN2002-05 enhancement; otherwise identical logic resources and pinout. | Not suitable for CompactPCI live-insertion; acceptable for fixed-installation industrial controllers. | Select only if hot-swap is not required and legacy stock is available. |
| XC3S200-4FGG456C | Third-generation Spartan-3; higher density (5,760 logic cells), 1.2V core, improved DLL specs, but different bitstream format and toolchain. | Requires Xilinx ISE 7.x+ and new constraints; offers better power efficiency and larger block RAM (72 Kbits), but no backward compatibility. | Choose for new designs needing lower power or future-proofing; not a drop-in replacement. |
Compared with XC2S200E-6FGG456C, XC2S200-6FGG456C omits hot-swap capability while retaining identical logic and I/O resources, whereas XC3S200-4FGG456C delivers enhanced performance and power efficiency but mandates full redesign due to architectural and toolchain incompatibility.
Availability
XC2S200E-6FGG456C is available at Aetrix Electronics and suitable for industrial motion control, legacy bus bridging, and CompactPCI modular I/O applications requiring stable component supply and long-term obsolescence management.
Supply support for XC2S200E-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and developed industry-standard design tools and IP libraries.
The Spartan-IIE family was designed for cost-sensitive, high-volume applications requiring ASIC-like performance with field-reprogrammable flexibility - targeting industrial automation, communications infrastructure, and embedded vision systems.
FAQ
What is the maximum operating frequency supported by XC2S200E-6FGG456C?
The XC2S200E-6FGG456C is rated for system performance beyond 200 MHz, with the -6 speed grade guaranteeing timing closure under commercial conditions (0°C to +85°C) when implemented per Xilinx ISE design rules. Actual achievable frequency depends on design complexity, routing congestion, and clock domain structure - verified via static timing analysis in ISE 6.3i or later.
Does XC2S200E-6FGG456C support hot-swap insertion?
Yes, XC2S200E-6FGG456C supports hot-swap insertion per CompactPCI specifications and PCN2002-05. Its I/O pins remain high-impedance before and during configuration, with no current path to VCCINT/VCCO, and immunity to latch-up - enabling safe insertion into powered backplanes without system disruption.
What I/O standards does XC2S200E-6FGG456C support?
XC2S200E-6FGG456C supports 19 I/O standards including LVTTL, LVCMOS (1.8V/2.5V/3.3V), PCI 3.3V/66 MHz, SSTL2/3, HSTL Class I/III/IV, CTT, AGP, LVDS, Bus LVDS, and LVPECL. Standards are grouped by I/O bank and require matching VCCO and optional VREF per bank - detailed in Table 3 of DS077-2.
How much block RAM and distributed RAM does XC2S200E-6FGG456C provide?
XC2S200E-6FGG456C provides 56 Kbits of block RAM (configured as sixteen 4K-bit true dual-port blocks) and 75,264 bits of distributed RAM (implemented via 4-input LUTs). Block RAM supports independent read/write clocks; distributed RAM enables shift registers, small FIFOs, or pipeline stages without consuming CLB logic.
Is XC2S200E-6FGG456C still in production?
No, XC2S200E-6FGG456C was discontinued per Xilinx Change Notice XCN12026 (2012). Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle coordination support, including cross-reference guidance and obsolescence mitigation planning for ongoing production programs.
XC2S200E-6FGG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-IIE
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 289
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S200E-6FGG456C FAQ
1.How can I place an order for XC2S200E-6FGG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S200E-6FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S200E-6FGG456C reliable?
The price and inventory of XC2S200E-6FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S200E-6FGG456C is usually 5 days.
3.What payment methods are accepted for XC2S200E-6FGG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S200E-6FGG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S200E-6FGG456C?
XC2S200E-6FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S200E-6FGG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S200E-6FGG456C?
For technical support, including XC2S200E-6FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S200E-6FGG456C requirements.
6.How does Aetrix verify that XC2S200E-6FGG456C is sourced from the original manufacturer or authorized distributors?
All XC2S200E-6FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S200E-6FGG456C meets industry standards.
7.What is the process for return or replacement of XC2S200E-6FGG456C?
All XC2S200E-6FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S200E-6FGG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S200E-6FGG456C part is unused and in its original packaging.
Return procedure for XC2S200E-6FGG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S200E-6FGG456C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
