AMD XC2S200E-6PQ208I

Overview

XC2S200E-6PQ208I from Xilinx is a Spartan®-IIE Field-Programmable Gate Array with 5,292 logic cells, 289 user I/Os, four Delay-Locked Loops (DLLs), 75,264 bits of distributed RAM, and 56 Kbits of block RAM in a 208-pin Plastic Quad Flat Package (PQFP). It operates at 1.8 V core voltage and supports 19 I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI-compliant interfaces. It is used in high-volume industrial control, communications interface bridging, and legacy system re-engineering where field-upgradable logic and cost-effective ASIC replacement are required.

For engineers reviewing the XC2S200E-6PQ208I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (6 ns CLB delay), industrial temperature range (-40°C to +100°C), PQ208 package footprint compatibility across Spartan-IIE family members, and support for hot-swap operation in CompactPCI-friendly systems.

Technical Context

The XC2S200E-6PQ208I implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its architecture includes two columns of 4K-bit true dual-port block RAM and distributed RAM formed from LUTs, enabling both deep and shallow memory structures within logic fabric.

Four corner-placed DLLs provide clock deskew, multiplication (up to 2×), division (÷2, ÷4), and phase shifting; they feed four low-skew global clock nets. I/O banks are organized into eight independent groups, each supporting mixed signaling standards only when sharing the same VCCO voltage - e.g., LVTTL and PCI at 3.3 V, or SSTL2 and LVCMOS2 at 2.5 V.

Key Specifications

Pinout & Package

XC2S200E-6PQ208I uses a 208-pin Plastic Quad Flat Package (PQFP) with 289 total user I/Os mapped across eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), and dedicated configuration pins (INIT, PROGRAM, DONE, TCK/TMS/TDI/TDO). Power pins include VCCINT (1.8 V core), VCCO (1.5/2.5/3.3 V I/O), and multiple ground connections distributed for noise reduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2S200E-7PQ208C, the XC2S200E-6PQ208I trades 16% lower maximum clock speed for guaranteed operation across -40°C to +100°C. Compared with XC3S200-4PQ208I, it lacks multiplier blocks and has less robust configuration security, but offers proven reliability in long-lifecycle industrial deployments where Spartan-IIE is already qualified.

Availability

XC2S200E-6PQ208I is available at Aetrix Electronics and suitable for industrial motion control, legacy system interface bridging, and communications backplane interface applications requiring stable component supply and long-term lifecycle support.

Supply support for XC2S200E-6PQ208I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed foundational FPGA architectures and EDA tools for configurable digital systems.

The Spartan-IIE family was designed as a cost-optimized, high-volume alternative to mask-programmed ASICs, targeting industrial automation, telecom infrastructure, and embedded control where field-upgradability and rapid prototyping were critical.

FAQ

What is the maximum operating frequency supported by XC2S200E-6PQ208I?

The XC2S200E-6PQ208I has a -6 speed grade specifying a 6 ns CLB propagation delay, enabling reliable operation up to 166 MHz for internal logic paths under typical industrial conditions. Actual system clock rates depend on design complexity, routing congestion, and I/O timing constraints - verified via Xilinx ISE timing analysis. The four DLLs support clock multiplication (e.g., 2×) to derive higher-frequency internal clocks from lower-speed external sources.

Does XC2S200E-6PQ208I support hot-swap functionality?

Yes, XC2S200E-6PQ208I supports hot-swap operation per CompactPCI specifications. Its I/O pins remain high-impedance before and during power-up, with no current path from I/O to VCCINT or VCCO. This allows safe insertion into powered backplanes. Hot-swap capability was added to all Spartan-IIE devices manufactured after PCN2002-05, and XC2S200E-6PQ208I meets this revision requirement.

What I/O standards are supported by XC2S200E-6PQ208I?

XC2S200E-6PQ208I supports 19 I/O standards including LVTTL, LVCMOS (1.8 V/2.5 V/3.3 V), PCI (3.3 V, 33/66 MHz), SSTL (Class I/II), HSTL (Class I/III/IV), CTT, AGP, GTL/GTL+, LVDS, and Bus LVDS. Standards are grouped by I/O bank, with VCCO and VREF constraints enforced per bank - e.g., Bank 0 can run LVTTL at 3.3 V while Bank 1 runs SSTL2 at 2.5 V.

How much on-chip memory does XC2S200E-6PQ208I provide?

XC2S200E-6PQ208I provides 56 Kbits of block RAM (14 × 4K-bit dual-port blocks) and 75,264 bits of distributed RAM implemented via LUTs. Block RAM supports true dual-port synchronous access for FIFOs or ping-pong buffers; distributed RAM enables shift registers or small state-machine memories directly within logic slices - both accessible without external memory components.

Is XC2S200E-6PQ208I still in production or obsolete?

XC2S200E-6PQ208I was discontinued per Xilinx Change Notice XCN12026 (2012), and is now obsolete. However, Aetrix Electronics maintains legacy inventory and offers traceable, tested units for ongoing industrial maintenance and repair programs. Full documentation, bitstream compatibility, and configuration PROM support remain available for sustaining engineering use.