AMD XC2S200E-6PQG208C

Overview

XC2S200E-6PQG208C from Xilinx is a second-generation Spartan-IIE Field-Programmable Gate Array with 5,292 logic cells, 289 user I/Os, four Delay-Locked Loops (DLLs), 75,264 bits of distributed RAM, and 56 Kbits of block RAM in a 208-pin PQFP package. It operates at 1.8 V core voltage and supports 19 I/O standards including LVTTL, LVCMOS, HSTL, SSTL, LVDS, and PCI-compliant interfaces. It is used in high-volume embedded control, industrial interface bridging, and legacy system re-engineering where ASIC replacement and field-upgradable logic are required.

For engineers reviewing the XC2S200E-6PQG208C datasheet, pinout, applications, or equivalent options, key selection criteria include DLL-based clock deskew for synchronous bus interfacing, hot-swap–capable I/O banks for CompactPCI systems, dual-voltage I/O support (1.5V/2.5V/3.3V), 208-pin PQFP mechanical compatibility across Spartan-IIE density grades, and verified boundary-scan compliance per IEEE 1149.1.

Technical Context

The XC2S200E-6PQG208C implements a regular array architecture with Configurable Logic Blocks (CLBs) arranged in a 28 × 42 grid (1,176 CLBs), surrounded by programmable Input/Output Blocks (IOBs) grouped into eight independent I/O banks. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops with synchronous set/reset.

It integrates four corner-located DLLs supporting clock multiplication, division, and phase shifting - critical for eliminating clock skew in high-speed parallel interfaces. Its memory subsystem combines 56 Kbits of true dual-port 4K-bit block RAM and 75,264 bits of distributed RAM (16×1, 16×2, or 32×1 configurations), enabling efficient FIFO, buffer, and DSP data-path implementation without external memory.

Key Specifications

Pinout & Package

XC2S200E-6PQG208C is housed in a 208-pin Plastic Quad Flat Package (PQG208), measuring 28 mm × 28 mm with 0.5 mm pitch. The package supports Pb-free assembly and features eight independent I/O banks (Bank 0–7), each with dedicated VCCO and VREF pins. Pin functions are defined per DS077-4 (v3.0), with global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary-scan (TCK/TMS/TDI/TDO), and configurable I/Os mapped to physical pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC2S200E-6PQG208C, the XC2S200E-6PQ208C offers identical functionality in a non-Pb-free package, while the XC3S200-4PQ208C delivers greater logic density and memory bandwidth at the cost of incompatible power delivery and pin mapping - making it a next-generation upgrade path rather than a direct substitute.

Availability

XC2S200E-6PQG208C is available at Aetrix Electronics and suitable for industrial control systems, legacy bus interface modules, and CompactPCI peripheral designs requiring stable component supply and long-term obsolescence mitigation strategies.

Supply support for XC2S200E-6PQG208C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures widely adopted in communications, aerospace, and industrial automation.

The Spartan-IIE family was designed as a cost-optimized, high-volume alternative to ASICs - targeting applications demanding field-upgradability, short time-to-market, and mixed-signal interface flexibility without premium pricing.

FAQ

Is XC2S200E-6PQG208C still in production or considered obsolete?

XC2S200E-6PQG208C is officially obsolete per Xilinx Change Notice XCN12026 (2012). However, Aetrix Electronics maintains a controlled inventory of tested, traceable units sourced from authorized legacy channels. Full datasheets, pinout diagrams, and configuration guidelines remain accessible for design continuity and repair programs.

What configuration modes does XC2S200E-6PQG208C support?

XC2S200E-6PQG208C supports Master Serial (from Xilinx Platform Flash PROM), Slave Serial, Slave Parallel, and IEEE 1149.1 JTAG Boundary Scan configuration modes. The PROGRAM_B, INIT_B, and DONE pins coordinate startup sequence, and configuration bitstream is loaded into volatile SRAM - requiring reload on each power cycle.

Can XC2S200E-6PQG208C interface directly with 3.3 V PCI buses?

Yes, XC2S200E-6PQG208C is fully 3.3 V PCI-compliant up to 66 MHz. Its I/O banks support LVTTL and PCI signaling standards with appropriate VCCO = 3.3 V and termination; DLLs ensure setup/hold timing margins are met for synchronous PCI reads/writes without external delay elements.

Does XC2S200E-6PQG208C support differential I/O standards like LVDS?

Yes, XC2S200E-6PQG208C supports LVDS and Bus LVDS on dedicated differential I/O pairs. Up to 120 differential I/O pairs are available, each configurable as input, output, or bidirectional. Termination resistors must be externally placed, as internal termination is not provided.

What is the maximum operating junction temperature for XC2S200E-6PQG208C?

The XC2S200E-6PQG208C is rated for Commercial temperature range (0°C to +85°C ambient), with a maximum junction temperature of +100°C under specified thermal conditions. Thermal design must account for 1.8 V core power dissipation and I/O switching activity - typical power consumption ranges from 0.5 W to 1.8 W depending on utilization.