AMD XC2S300E-6FTG256C

Overview

XC2S300E-6FTG256C from Xilinx is a 300K-system-gate Spartan®-IIE Field-Programmable Gate Array featuring 6,912 logic cells, 329 user I/Os in a 256-ball fine-pitch BGA (FTG256) package, and four Delay-Locked Loops (DLLs) for clock deskew and phase control. It operates at 1.8V core voltage with configurable I/O banks supporting LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI standards - deployed in industrial control interfaces and high-volume embedded data acquisition systems.

For engineers reviewing the XC2S300E-6FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include DLL timing parameters, I/O bank voltage partitioning (VCCO/VREF), CLB switching characteristics, block RAM configuration (4K-bit dual-port), and hot-swap capability per CompactPCI v2.2 compliance.

Technical Context

The XC2S300E-6FTG256C implements a hierarchical architecture with 1,536 Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flop slices. Its four corner-placed DLLs support zero-hold-time input capture, clock multiplication/division, and phase shifting - critical for synchronous interface timing closure.

I/O functionality is organized across eight independent voltage banks in the FTG256 package, enabling mixed-standard operation (e.g., 3.3V LVTTL and 2.5V SSTL2 on adjacent pins) provided VCCO and VREF are isolated per bank. Each IOB includes three registers (input/output/3-state), programmable slew rate, drive strength up to 24 mA, and weak-keeper circuitry activated post-configuration.

Key Specifications

Pinout & Package

XC2S300E-6FTG256C uses a 256-ball fine-pitch ball grid array (FTG256) package with 0.8 mm pitch, 17 × 17 array, and eight independent I/O banks. Ball A1 is marked with a laser-etched dot; thermal pad is exposed on underside for PCB heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Compared with XC2S300E-6FTG256C, XCV300E-6PQ240C offers higher performance but lacks hot-swap and consumes ~40% more static power, while XC3S200-4PQ240C delivers better timing precision and lower voltage operation but requires redesign for I/O protection in live-insertion environments.

Availability

XC2S300E-6FTG256C is available at Aetrix Electronics and suitable for industrial control interfaces, medical imaging subsystems, automated test equipment, and legacy bus protocol conversion requiring stable component supply across extended product lifecycles.

Supply support for XC2S300E-6FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, now part of AMD, specializing in FPGAs, adaptive SoCs, and AI inference platforms.

The Spartan-IIE family was designed for cost-sensitive, high-volume applications requiring ASIC-like performance with field-upgradable logic - targeting industrial automation, communications infrastructure, and embedded vision systems.

FAQ

What is the maximum operating frequency of the XC2S300E-6FTG256C DLL?

The XC2S300E-6FTG256C DLL supports input frequencies from 10 MHz to 200 MHz and can multiply clock frequencies up to 240 MHz. Its phase-shift resolution is 1/16 of the input period, and it achieves ±50 ps jitter over temperature and voltage ranges per DS077-3 switching characteristics. This specification applies directly to the -6 speed grade under commercial temperature conditions (0°C to +85°C).

Does the XC2S300E-6FTG256C support boundary scan testing?

Yes, the XC2S300E-6FTG256C fully complies with IEEE 1149.1 (JTAG) boundary scan architecture. It includes dedicated TAP controller, instruction register, and boundary scan cells for all user I/Os and key internal nodes. The JTAG port supports INTEST, SAMPLE/PRELOAD, and EXTEST instructions, enabling board-level fault detection and in-system programming verification.

Can the XC2S300E-6FTG256C operate with mixed I/O voltages on the same package?

Yes - the XC2S300E-6FTG256C supports mixed I/O standards across its eight independent banks. For example, Bank 0 may be configured for 3.3V LVTTL while Bank 1 uses 2.5V SSTL2, provided each bank's VCCO and VREF are independently supplied and isolated. Table 4 in DS077-2 confirms compatibility matrices per VCCO level, and pinout tables in DS077-4 assign each ball to a specific bank.

Is hot-swap functionality guaranteed for the XC2S300E-6FTG256C?

Yes, hot-swap capability is built into every XC2S300E device, including the XC2S300E-6FTG256C, per Product Change Notice PCN2002-05. The I/O pins remain high-impedance before and during configuration, tolerate applied signals prior to VCCINT/VCCO ramp-up, and exhibit no latch-up risk - satisfying CompactPCI v2.2 hot-insertion requirements without external protection components.

What configuration modes does the XC2S300E-6FTG256C support?

The XC2S300E-6FTG256C supports master serial, slave serial, slave parallel, and JTAG (boundary scan) configuration modes. In master serial mode, it drives an external PROM; in slave modes, it accepts configuration data from a microprocessor or host controller. All modes use the same 1-bit-wide bitstream format defined in DS077-2, with CRC validation performed automatically upon completion.