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AMD XC2S300E-6PQG208C

Part No.:
XC2S300E-6PQG208C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
208-BFQFP
Datasheet:
AetrixXC2S300E-6PQG208C.pdf
Description:
IC FPGA 146 I/O 208QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,836

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Product details

Overview

XC2S300E-6PQG208C from Xilinx is a Spartan®-IIE Field-Programmable Gate Array with 6,912 logic cells, 329 user I/Os, and four Delay-Locked Loops (DLLs), operating at 1.8V core voltage and supporting 3.3V/2.5V/1.8V I/O standards. It delivers up to 300,000 system gates and targets high-volume embedded control, industrial interface bridging, and legacy bus protocol adaptation.

For engineers reviewing the XC2S300E-6PQG208C datasheet, pinout, applications, or equivalent options, key selection criteria include DLL-based clock deskew for synchronous I/O timing, hot-swap-capable I/O banks compliant with CompactPCI v2.2, and dual-port block RAM for FIFO buffering in real-time data acquisition systems.

Technical Context

The XC2S300E-6PQG208C implements a hierarchical architecture with Configurable Logic Blocks (CLBs) containing four logic cells each, distributed 16×1-bit LUT RAM, and dedicated carry chains for arithmetic acceleration. Its four corner-placed DLLs provide zero-delay clock distribution, phase shifting, and frequency multiplication - critical for PCI 66 MHz compliance and LVDS source-synchronous interfaces.

I/O functionality is organized into eight independent voltage-banked IOBs, each supporting 19 selectable standards including LVTTL, LVCMOS, SSTL, HSTL, and LVDS. The PQG208 package enables 182 user I/Os with VCCO shared across all banks, requiring single-supply I/O configuration while permitting per-bank VREF assignment for mixed-input thresholds.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells6,912 - defines maximum combinational and sequential logic capacity for custom digital state machines or protocol engines
User I/O Count182 - number of configurable bidirectional pins available in PQG208 package, excluding dedicated global clocks
Block RAM64 Kbits - implemented as sixteen 4K-bit true dual-port RAM blocks, enabling simultaneous read/write for buffering or lookup tables
DLLs4 - corner-located delay-locked loops for eliminating clock skew, generating phase-aligned clocks, and meeting setup/hold timing in high-speed interfaces
Core Voltage (VCCINT)1.8 V - determines static power consumption and thermal profile; requires low-noise regulation and decoupling near die center
I/O Voltage (VCCO)3.3 V / 2.5 V / 1.8 V - selectable per bank; sets output drive strength, input threshold, and compatibility with external memory or bus transceivers
Max System Gates300,000 - aggregate logic density metric derived from CLB count and routing resources, used for ASIC replacement cost estimation

Pinout & Package

PQG208 is a 208-pin Plastic Quad Flat Package with Gull-wing leads, RoHS-compliant (Pb-free), 28 × 28 mm body size, and 0.5 mm pitch. Pin assignments follow JEDEC MO-137AC standard with corner-indexed pin 1 marker.

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK3Global Clock InputFour dedicated low-skew clock inputs routed directly to DLLs; required for synchronous domain partitioning and jitter-sensitive timing paths
PROGRAM_BConfiguration InitiateActive-low asynchronous reset that clears configuration memory and forces reinitialization from external PROM or host controller
DONEConfiguration StatusOpen-drain output indicating successful bitstream loading; must be pulled up externally to enable subsequent device operation
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1-compliant test interface for in-circuit verification, programming, and debug access without dedicated programming hardware
VCCINTCore Power Supply1.8 V supply for internal logic and CLBs; requires local ceramic decoupling and separate plane from I/O supplies to minimize noise coupling
VCCO_0–VCCO_7I/O Bank PowerEight VCCO pins - one per I/O bank - must be tied to same voltage within each bank; in PQG208, all are internally connected to single VCCO net

Key Features

FeatureDesign Value
Hot-swap I/O capabilityEnables safe insertion into powered CompactPCI backplanes without latch-up risk or system disruption; verified per PCI Bus v2.2 specification
SelectRAM™ hierarchical memoryCombines 98,304 bits of distributed LUT RAM (16×1-bit per LUT) with 64 Kbits of true dual-port block RAM for flexible on-chip data storage and buffering
Four DLLs with phase shiftProvides deterministic clock deskew, 0°–360° programmable phase adjustment, and integer frequency multiplication (×2, ×4) for precise timing alignment
19 I/O standards supportIncludes LVTTL, LVCMOS, SSTL, HSTL, LVDS, and GTL+ - allowing direct interfacing to DDR SDRAM, PCI, and differential serial links without level-shifting ICs
Unlimited in-system reprogrammabilityConfiguration stored in SRAM allows full functional updates via JTAG or serial PROM without physical replacement or soldering changes

Applications

Industrial Motion ControlLegacy Bus Protocol Bridge

Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs.

IC Role / Device Role / Timing Role: FPGA fabric implements custom PID controllers, quadrature decoder logic, and synchronized PWM generation with sub-microsecond jitter control via DLL-managed clocks.

Use Value: Eliminates need for discrete logic and microcontroller co-processing; achieves deterministic latency under 200 ns between encoder capture and PWM update.

Use Scenario: Bridging ISA or VME bus peripherals to modern PCIe-based host systems in test equipment upgrades.

IC Role / Device Role / Timing Role: Acts as protocol translator and address decoder, managing burst transfers, wait-state insertion, and signal-level translation between incompatible bus timing domains.

Use Value: Preserves investment in legacy sensors/actuators while enabling integration with current-generation controllers via single-chip glue logic.

CompactPCI Hot-Swap ModuleLow-Cost Video Frame Buffer

Use Scenario: Field-replaceable I/O module in ruggedized telecom chassis requiring zero-downtime maintenance.

IC Role / Device Role / Timing Role: Manages hot-insertion sequencing, I/O isolation during power ramp, and boundary-scan diagnostics for post-insertion validation.

Use Value: Meets CompactPCI v2.2 hot-swap requirements without external supervisors; reduces BOM count by integrating power sequencing and test logic.

Use Scenario: Capturing and displaying NTSC/PAL video streams in medical imaging devices with minimal external memory.

IC Role / Device Role / Timing Role: Implements line-synchronized video capture engine, chroma/luma separation, and dual-port frame buffer using integrated block RAM.

Use Value: Reduces external DRAM footprint by 64 Kbits; enables pixel-accurate overlay generation and real-time scaling using distributed LUT RAM.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2S300E-6PQ208CNo "G" suffix - leaded (non-RoHS) package; identical electrical and functional specsSame pinout and configuration interface; differs only in Pb-free compliance and moisture sensitivity levelSelect when legacy assembly lines require SnPb solder compatibility or when RoHS exemption applies
XC3S200-4PQ208CSpartan-3 generation; 5,292 logic cells, 289 I/Os, 180 Kbits block RAM, 1.2 V coreHigher density RAM and lower core voltage; lacks native LVDS but adds Digital Clock Manager (DCM)Choose for new designs needing greater memory bandwidth or lower power; not drop-in due to different configuration scheme and DCM-based clocking

Compared with XC2S300E-6PQG208C, the leaded XC2S300E-6PQ208C offers identical functionality with legacy solder process support, while the XC3S200-4PQ208C provides higher memory capacity and lower core voltage at the cost of non-compatible configuration and clock management architecture.

Availability

XC2S300E-6PQG208C is available at Aetrix Electronics and suitable for industrial motion control, CompactPCI hot-swap modules, and legacy bus protocol bridging requiring stable component supply through extended lifecycle management.

Supply support for XC2S300E-6PQG208C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures widely adopted in communications, aerospace, and industrial automation.

The Spartan-IIE product line was engineered for cost-sensitive, high-volume applications requiring ASIC-like performance with field-upgradable logic - particularly targeting industrial control, test equipment, and embedded interface consolidation.

FAQ

What is the maximum operating frequency supported by XC2S300E-6PQG208C?

The XC2S300E-6PQG208C supports system clock rates beyond 200 MHz, with timing closure dependent on design complexity and placement. Its -6 speed grade guarantees performance up to 166 MHz for critical paths in worst-case commercial temperature conditions, validated by Xilinx ISE tools using DS077-3 switching characteristics.

Does XC2S300E-6PQG208C support LVDS signaling natively?

Yes, XC2S300E-6PQG208C supports LVDS differential I/O natively through its IOBs, requiring no external resistors for termination. Each differential pair consumes two adjacent I/O pins within the same bank and operates at 2.5 V VCCO with internal 100 Ω differential termination enabled via configuration bitstream.

How many block RAM units does XC2S300E-6PQG208C contain?

The XC2S300E-6PQG208C contains sixteen 4K-bit block RAMs, totaling 64 Kbits of true dual-port synchronous memory. These are physically arranged in two columns flanking the CLB array and can be configured as single-port, dual-port, or shift-register memory depending on synthesis constraints.

Is XC2S300E-6PQG208C still in active production?

No, XC2S300E-6PQG208C was discontinued per Xilinx Change Notice XCN12026 (2012). Aetrix Electronics maintains legacy inventory and provides last-time-buy support, with full traceability and extended lifecycle coordination for ongoing production programs.

Can XC2S300E-6PQG208C be configured via JTAG interface?

Yes, XC2S300E-6PQG208C supports IEEE 1149.1 boundary scan configuration in slave serial mode, enabling full bitstream loading and verification through TCK/TMS/TDI/TDO pins. This eliminates need for external PROM and simplifies in-system programming during development and field updates.

XC2S300E-6PQG208C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-IIE
Package/Case:
208-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
65536
Number of I/O:
146
Number of Gates:
300000
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
208-PQFP (28x28)

XC2S300E-6PQG208C FAQ

1.How can I place an order for XC2S300E-6PQG208C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S300E-6PQG208C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S300E-6PQG208C reliable?

The price and inventory of XC2S300E-6PQG208C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S300E-6PQG208C is usually 5 days.

3.What payment methods are accepted for XC2S300E-6PQG208C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S300E-6PQG208C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S300E-6PQG208C?

XC2S300E-6PQG208C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S300E-6PQG208C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S300E-6PQG208C?

For technical support, including XC2S300E-6PQG208C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S300E-6PQG208C requirements.

6.How does Aetrix verify that XC2S300E-6PQG208C is sourced from the original manufacturer or authorized distributors?

All XC2S300E-6PQG208C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S300E-6PQG208C meets industry standards.

7.What is the process for return or replacement of XC2S300E-6PQG208C?

All XC2S300E-6PQG208C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S300E-6PQG208C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S300E-6PQG208C part is unused and in its original packaging.

Return procedure for XC2S300E-6PQG208C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2S300E-6PQG208C Tags

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