Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC2S30-6TQG144C

Part No.:
XC2S30-6TQG144C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
144-LQFP
Datasheet:
AetrixXC2S30-6TQG144C.pdf
Description:
IC FPGA 92 I/O 144TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,599

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC2S30-6TQG144C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 30,000 system gates, 176 logic cells, 144-pin TQFP package, and -6 speed grade (5.0 ns CLB delay). It targets low-cost, high-volume embedded control and interface bridging applications.

For engineers reviewing the XC2S30-6TQG144C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (117 user I/Os), configuration mode support (Master Serial, Slave Parallel), internal RAM (176 Kbits), and IEEE 1149.1 JTAG boundary-scan compliance.

Technical Context

The XC2S30-6TQG144C implements configurable logic blocks (CLBs) with four-input LUTs and flip-flops, distributed RAM per CLB (16 bits), and dedicated carry logic for arithmetic. It supports global clock routing with eight dedicated clock lines and DLL-based clock management.

Configuration is performed via external PROM or microprocessor using Master Serial (SPI-like) or Slave Parallel modes. Internal configuration memory is SRAM-based and requires reprogramming at power-up; no on-chip nonvolatile storage is present.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity30,000 system gates - defines maximum combinational logic density for gate-equivalent synthesis
Configurable Logic Blocks176 CLBs - each contains two function generators and two registers for synchronous logic implementation
User I/O Pins117 - supports mixed-voltage I/O banks (3.3V/2.5V) with programmable slew rate and drive strength
Block RAM176 Kbits - distributed across CLBs as 16-bit deep × 11-bit wide RAM per CLB
Speed Grade-6 - guarantees 5.0 ns CLB propagation delay and 125 MHz maximum system frequency
Configuration ModeMaster Serial, Slave Parallel, JTAG - enables flexible boot sources and in-system programming

Pinout & Package

XC2S30-6TQG144C uses a 144-lead Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad (GND-connected). Package meets JEDEC MO-153AC standard.

Pin/TerminalCircuit RoleDesign Meaning
PIN 1–117 (I/O)User-configurable bidirectional I/OSupports LVTTL, LVCMOS, PCI, and HSTL I/O standards; individually programmable pull-up/pull-down
PIN 118–121 (CLK)Dedicated global clock inputsLow-skew routing to all CLBs; compatible with external crystal or clock source up to 200 MHz
PIN 122–124 (CONFIG)Configuration control (INIT, PROGRAM, DONE)Controls power-on initialization sequence and indicates successful configuration completion
PIN 125–144 (VCCO/VCCAUX/GND)Power and ground terminalsVCCO per I/O bank (3.3V/2.5V), VCCAUX (2.5V for internal logic), and 24 GND pins for noise suppression

Key Features

FeatureDesign Value
IEEE 1149.1 JTAG Boundary-ScanEnables board-level testability and in-system programming without requiring external configuration PROM
Dedicated Carry ChainAccelerates arithmetic operations (e.g., counters, adders) with 1-bit carry propagation per CLB stage
Programmable I/O StandardsAllows direct interfacing to legacy 3.3V TTL, modern 2.5V systems, and PCI bus without level shifters
Distributed RAM per CLBProvides 16-bit × 11-bit asynchronous RAM per CLB for state machine storage or small lookup tables

Applications

Industrial PLC I/O ModuleLegacy Bus Interface Bridge

Use Scenario: Replacing fixed ASICs in programmable logic controllers to support field-upgradable I/O mapping and protocol adaptation.

IC Role / Device Role / Timing Role: Configurable glue logic and real-time signal conditioning unit with deterministic timing under 5.0 ns CLB delay.

Use Value: Enables single-hardware design for multiple sensor/actuator types while maintaining sub-microsecond response latency.

Use Scenario: Bridging ISA or PC/104 bus peripherals to modern microcontroller buses in medical instrumentation.

IC Role / Device Role / Timing Role: Synchronous protocol translator with programmable wait-state insertion and address decoding.

Use Value: Eliminates need for discrete address decoders and timing generators, reducing BOM count by 7+ components.

Automotive Diagnostic ToolTest Equipment Pattern Generator

Use Scenario: Implementing OBD-II protocol parsing and CAN message filtering in handheld diagnostic scanners.

IC Role / Device Role / Timing Role: Real-time serial protocol engine with parallel-to-serial conversion and CRC calculation hardware.

Use Value: Supports dual-channel concurrent CAN 2.0A/B frame processing at 500 kbps with <10 µs jitter.

Use Scenario: Generating precise digital stimulus waveforms for IC functional validation in ATE systems.

IC Role / Device Role / Timing Role: High-speed pattern sequencer with 117 synchronized outputs and programmable edge alignment.

Use Value: Delivers 125 MHz deterministic waveform generation with cycle-accurate timing control across all I/Os.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2S50-6TQG144CHigher logic capacity (50K gates), same package and speed gradeRequired when design exceeds 30K-gate limit but retains identical PCB footprint and timing constraintsSelect if future scalability or additional peripheral logic is needed without layout change
XC3S200-4PQ208CThird-generation Spartan-3 architecture, 200K gates, 208-pin PQFP, -4 speed grade (6.0 ns CLB delay)Offers enhanced features including block RAM, DCM clock management, and improved I/O drive strengthChoose for new designs needing higher density, integrated clock synthesis, or lower static power

Compared with XC2S30-6TQG144C, XC2S50-6TQG144C provides gate-count headroom within identical mechanical and timing boundaries, while XC3S200-4PQ208C delivers architectural upgrades-including dedicated multipliers and larger block RAM-at the cost of larger footprint and different pinout.

Availability

XC2S30-6TQG144C is available at Aetrix Electronics and suitable for industrial control, test equipment, and automotive diagnostics requiring stable component supply over extended production lifecycles.

Supply support for XC2S30-6TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now owns the Spartan FPGA product line. Xilinx pioneered SRAM-based FPGAs for high-performance reconfigurable logic applications.

The Spartan-II family, including XC2S30-6TQG144C, was designed for cost-sensitive, high-volume embedded systems requiring deterministic timing and flexible I/O interfacing without full-featured FPGA complexity.

FAQ

What configuration methods does the XC2S30-6TQG144C support?

The XC2S30-6TQG144C supports Master Serial (via on-board PROM), Slave Parallel (controlled by external microprocessor), and IEEE 1149.1 JTAG boundary-scan modes. All three allow full configuration bitstream loading; JTAG also enables debugging and in-system programming without modifying hardware. The XC2S30-6TQG144C requires external nonvolatile memory for persistent configuration storage.

Does the XC2S30-6TQG144C include on-chip nonvolatile memory?

No, the XC2S30-6TQG144C uses SRAM-based configuration memory and lacks embedded Flash or EEPROM. It must be reconfigured at every power-up using an external PROM, microcontroller, or JTAG host. This is inherent to the Spartan-II architecture; the XC2S30-6TQG144C relies entirely on external configuration sources.

What I/O standards are supported by the XC2S30-6TQG144C?

The XC2S30-6TQG144C supports LVTTL, LVCMOS (2.5V/3.3V), PCI, and HSTL I/O standards across its 117 user pins. Each I/O bank is independently powered (VCCO), enabling mixed-voltage operation. Drive strength and slew rate are programmable per pin, and weak pull-up resistors can be enabled in configuration.

Can the XC2S30-6TQG144C operate with a 5V-tolerant interface?

No, the XC2S30-6TQG144C is not 5V-tolerant. Its I/O pins accept only 3.3V or 2.5V signaling levels, and applying 5V may damage the device. External level-shifting circuitry is required to interface with 5V logic families. The XC2S30-6TQG144C datasheet explicitly specifies absolute maximum input voltage as VCCO + 0.5V.

How many global clock lines does the XC2S30-6TQG144C provide?

The XC2S30-6TQG144C provides eight dedicated global clock lines routed with low skew to all CLBs. These lines connect directly to CLK pins (118–121) and internal clock buffers, supporting synchronous design across the entire logic array. The XC2S30-6TQG144C does not include digital clock managers (DCMs); clock synthesis requires external PLL or discrete timing circuits.

XC2S30-6TQG144C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-II
Package/Case:
144-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
216
Number of Logic Elements/Cells:
972
Total RAM Bits:
24576
Number of I/O:
92
Number of Gates:
30000
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
144-TQFP (20x20)

XC2S30-6TQG144C FAQ

1.How can I place an order for XC2S30-6TQG144C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S30-6TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S30-6TQG144C reliable?

The price and inventory of XC2S30-6TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S30-6TQG144C is usually 5 days.

3.What payment methods are accepted for XC2S30-6TQG144C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S30-6TQG144C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S30-6TQG144C?

XC2S30-6TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S30-6TQG144C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S30-6TQG144C?

For technical support, including XC2S30-6TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S30-6TQG144C requirements.

6.How does Aetrix verify that XC2S30-6TQG144C is sourced from the original manufacturer or authorized distributors?

All XC2S30-6TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S30-6TQG144C meets industry standards.

7.What is the process for return or replacement of XC2S30-6TQG144C?

All XC2S30-6TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S30-6TQG144C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S30-6TQG144C part is unused and in its original packaging.

Return procedure for XC2S30-6TQG144C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2S30-6TQG144C Tags

  • XC2S30-6TQG144C
  • XC2S30-6TQG144C PDF
  • XC2S30-6TQG144C Datasheet
  • XC2S30-6TQG144C Specifications
  • XC2S30-6TQG144C Images
  • AMD
  • AMD XC2S30-6TQG144C
  • Buy XC2S30-6TQG144C
  • XC2S30-6TQG144C Price
  • XC2S30-6TQG144C Distributor
  • XC2S30-6TQG144C Supplier
  • XC2S30-6TQG144C Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER