My Inquiry
My Account
AMD XC2S400E-6FGG456C
- Part No.:
- XC2S400E-6FGG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2S400E-6FGG456C.pdf
- Description:
- IC FPGA 329 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,115
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2S400E-6FGG456C from Xilinx is a 400K-system-gate Spartan®-IIE Field-Programmable Gate Array featuring 10,800 logic cells, 410 user I/Os in a 456-ball Fine-Pitch BGA (FGG456) package, four Delay-Locked Loops (DLLs), and dual-port block RAM up to 160 Kbits - deployed in industrial control logic, PCI-compliant interface bridging, and reconfigurable digital signal processing subsystems.
For engineers reviewing the XC2S400E-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include DLL-supported clock multiplication/phase shift, hot-swap I/O capability, VCCINT = 1.8V core voltage with configurable VCCO per I/O bank, and compatibility with LVTTL/LVCMOS/SSTL/HSTL/PCI/LVDS signaling standards.
Technical Context
The XC2S400E-6FGG456C implements a hierarchical architecture with 2,400 Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flop/latch storage per slice. It integrates two columns of block RAM (4K-bit true dual-port per block) and supports distributed RAM via LUTs (153,600 bits total).
Its I/O subsystem comprises eight independent voltage banks, each supporting up to 19 signaling standards including 3.3V PCI compliance at 66 MHz, LVDS differential pairs (up to 172 differential I/O pairs), and hot-swap operation per CompactPCI v2.2 - all controlled by static configuration memory loaded at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 10,800 - defines maximum combinational and sequential logic capacity for custom RTL implementation |
| System Gates | 145,000–400,000 - indicates scalable logic density range validated under typical synthesis conditions |
| User I/O Pins | 410 - provides high pin count for multi-bus interfacing (e.g., parallel data paths, address/data multiplexing) |
| Block RAM Capacity | 160 Kbits - enables on-chip dual-port memory for FIFOs, buffers, or coefficient storage without external SRAM |
| DLLs | 4 - delivers zero-delay clock distribution, programmable multiplication/division, and phase alignment across domains |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5V predecessors while maintaining timing closure at >200 MHz system performance |
| I/O Voltage (VCCO) | Configurable per bank (1.5V/1.8V/2.5V/3.3V) - allows mixed-voltage interface coexistence (e.g., SSTL-2 DDR + LVTTL control) |
| Speed Grade | -6 - guarantees timing performance meeting worst-case setup/hold requirements at 1.8V/85°C commercial temp range |
Pinout & Package
XC2S400E-6FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 0.8 mm ball pitch, 27 × 27 array, and eight independent I/O banks. Pin functions are defined per DS077-4 (v3.0), with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary scan (TCK/TMS/TDI/TDO), and bank-specific VCCO/VREF supply connections.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew primary clock nets driving all DLLs and CLB/IOB registers synchronously |
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset of configuration logic; forces reload from external PROM or host controller |
| INIT_B | Configuration Status Output | Open-drain indicator asserting Low during bitstream loading and error detection |
| DONE | Configuration Completion | Open-drain output pulled High when configuration succeeds and device enters user mode |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan Interface | IEEE 1149.1-compliant test access port enabling in-circuit verification and programming |
| VCCINT | Core Power Supply | 1.8 V supply for CLBs, DLLs, and internal routing; decoupling required within 1 cm of balls |
| VCCO_0–VCCO_7 | I/O Bank Power | Independent 1.5/1.8/2.5/3.3 V supplies per bank - determines compatible I/O standards (e.g., VCCO_0 = 3.3 V → LVTTL/PCI) |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific input reference voltage (e.g., 0.75 V for HSTL Class I); required only for standards using threshold sensing |
Key Features
| Feature | Design Value |
|---|---|
| Hot-swap I/O support | Enables safe insertion into powered backplanes (CompactPCI v2.2 compliant); no latch-up risk during VCCINT/VCCO ramp-up |
| SelectRAM™ memory hierarchy | Combines 160 Kbits block RAM (dual-port, 4K-bit per block) with 153,600 bits distributed RAM (LUT-based) for flexible memory mapping |
| Dedicated carry logic | Two independent carry chains per CLB enable high-speed arithmetic (e.g., 32-bit adders with < 5 ns propagation) |
| Four DLLs | Each eliminates clock skew, supports 2×–16× multiplication, ±90° phase shift, and jitter reduction for synchronous interfaces |
| 19 I/O standards | Includes LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS, and LVPECL - enabling direct connection to DDR SDRAM, PCI slots, and differential buses |
| Unlimited in-system reprogrammability | Configuration stored in SRAM cells; supports field updates via JTAG, slave serial, or master PROM without hardware change |
Applications
| Industrial Motion Controller | PCI-to-Parallel Bridge |
|---|---|
|
Use Scenario: Real-time servo loop execution with encoder feedback decoding, PWM generation, and safety interlock monitoring in CNC machinery. IC Role / Device Role / Timing Role: Configurable logic fabric implementing closed-loop control algorithms, synchronized to 50 MHz encoder clock via DLL-managed domain crossing. Use Value: 410 I/Os accommodate 24-channel PWM outputs, 32-bit position bus, and isolated fault signals; 160 Kbits block RAM stores motion profiles without external memory. |
Use Scenario: Transparent translation between 32-bit/33 MHz PCI bus and legacy 8/16-bit parallel peripheral interfaces (e.g., printers, scanners). IC Role / Device Role / Timing Role: Protocol converter with PCI target endpoint logic and parallel I/O state machine, timed by DLL-synchronized 33 MHz PCI clock. Use Value: Native PCI compliance eliminates level-shifting ICs; hot-swap I/O allows field-replaceable daughter cards without system shutdown. |
| Reconfigurable DSP Subsystem | Multi-Standard Communication Interface |
|
Use Scenario: Adaptive filtering and modulation/demodulation in software-defined radio baseband processing. IC Role / Device Role / Timing Role: Programmable datapath executing FIR filters and QAM mappers, with block RAM buffering IQ samples at 40 MSPS. Use Value: Distributed RAM (153,600 bits) implements shift registers for sample delay lines; DLL phase alignment ensures coherent sampling across ADC/DAC channels. |
Use Scenario: Single-board support for RS-485, CAN, and Ethernet PHY interfaces in building automation controllers. IC Role / Device Role / Timing Role: I/O agnostic glue logic managing voltage-level translation, protocol framing, and interrupt arbitration between heterogeneous buses. Use Value: Eight independent I/O banks allow simultaneous 3.3V RS-485, 5V-tolerant CAN (with external resistor), and 2.5V MII Ethernet - all on one die. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300E-6PQ240C | Virtex-E family; 300K gates, 240-pin PQFP, 2.5V core, no hot-swap I/O | Lacks hot-swap support and DLL phase-shift capability; higher static power due to 2.5V VCCINT | Choose only if legacy PQFP footprint reuse is mandatory and hot-swap is unnecessary |
| XC3S400-4PQ240C | Spartan-3 family; 400K gates, 240-pin PQFP, 1.2V core, improved DLL jitter spec | Lower power but incompatible pinout and configuration protocol; requires PCB redesign | Prefer for new designs needing lower power and newer toolchain support, accepting layout change |
Compared with XC2S400E-6FGG456C, XCV300E-6PQ240C offers higher speed grade margin but sacrifices hot-swap reliability and DLL flexibility, while XC3S400-4PQ240C delivers better power efficiency and jitter performance at the cost of complete package and configuration incompatibility.
Availability
XC2S400E-6FGG456C is available at Aetrix Electronics and suitable for industrial motion control, PCI bridge modules, and reconfigurable DSP subsystems requiring stable component supply amid long-lifecycle embedded deployments.
Supply support for XC2S400E-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA architectures enable customizable digital systems without ASIC development cycles.
The Spartan-IIE product line was engineered for cost-sensitive, high-volume applications demanding robust I/O flexibility, hot-swap readiness, and predictable timing - targeting industrial automation, communications infrastructure, and embedded vision systems.
FAQ
What is the maximum operating frequency supported by XC2S400E-6FGG456C?
The XC2S400E-6FGG456C is rated for system clock rates beyond 200 MHz under typical conditions. Its -6 speed grade guarantees timing closure for critical paths at 1.8 V and 85°C, with actual achievable frequency dependent on design complexity, routing congestion, and DLL usage for clock deskewing. Measured pin-to-pin delays in DS077-3 confirm sub-5 ns CLB propagation for optimized paths.
Does XC2S400E-6FGG456C support hot-swap functionality, and how is it implemented?
Yes, XC2S400E-6FGG456C supports hot-swap per CompactPCI v2.2. Implementation includes high-impedance I/O pins before and during configuration, no current path from I/O to VCCINT/VCCO, and immunity to latch-up. Weak-keeper circuits activate only in the final configuration frame and disable upon DONE assertion - ensuring safe insertion into live backplanes without system disruption.
How many block RAM blocks does XC2S400E-6FGG456C contain, and what are their configurations?
The XC2S400E-6FGG456C contains 40 block RAM units, each configurable as 4K-bit true dual-port memory (2K × 16 or 4K × 9), single-port RAM, or ROM. Total capacity is 160 Kbits. These blocks are distributed across two columns flanking the CLB array and support independent read/write clocks, byte-write enables, and asynchronous resets - essential for FIFO and buffer applications.
Can XC2S400E-6FGG456C interface directly with 3.3V PCI buses, and what electrical requirements apply?
Yes, XC2S400E-6FGG456C is fully 3.3V PCI compliant up to 66 MHz. This requires setting VCCO = 3.3 V for the relevant I/O bank, using LVTTL-compatible drive strength (12 mA default), and connecting VTT = 3.3 V termination for open-collector signaling. All PCI timing parameters (setup/hold, skew) are met per DS077-3 switching characteristics tables.
What configuration modes are supported by XC2S400E-6FGG456C, and which is recommended for production systems?
XC2S400E-6FGG456C supports master serial (via Platform Flash PROM), slave serial, slave parallel, and JTAG boundary scan configuration. For production, master serial mode is recommended: it enables autonomous boot after power-on, supports encrypted bitstreams, and integrates seamlessly with Xilinx's Platform Flash solutions - reducing host processor dependency and improving startup reliability.
XC2S400E-6FGG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-IIE
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 10800
- Total RAM Bits:
- 163840
- Number of I/O:
- 329
- Number of Gates:
- 400000
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2S400E-6FGG456C FAQ
1.How can I place an order for XC2S400E-6FGG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S400E-6FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S400E-6FGG456C reliable?
The price and inventory of XC2S400E-6FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S400E-6FGG456C is usually 5 days.
3.What payment methods are accepted for XC2S400E-6FGG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S400E-6FGG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S400E-6FGG456C?
XC2S400E-6FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S400E-6FGG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S400E-6FGG456C?
For technical support, including XC2S400E-6FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S400E-6FGG456C requirements.
6.How does Aetrix verify that XC2S400E-6FGG456C is sourced from the original manufacturer or authorized distributors?
All XC2S400E-6FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S400E-6FGG456C meets industry standards.
7.What is the process for return or replacement of XC2S400E-6FGG456C?
All XC2S400E-6FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S400E-6FGG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S400E-6FGG456C part is unused and in its original packaging.
Return procedure for XC2S400E-6FGG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S400E-6FGG456C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
