AMD XC2S50-5FG256I

Overview

XC2S50-5FG256I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 50,000 system gates, 176 configurable logic blocks (CLBs), 256-pin Fine-Pitch Ball Grid Array (FBGA) package, and -5 speed grade (5 ns CLB delay). It is used in industrial control logic, digital signal preprocessing, and low-cost reconfigurable I/O bridging.

For engineers reviewing the XC2S50-5FG256I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (176 user I/Os), distributed RAM capacity (72 Kb), global clock network support, and IEEE 1149.1 JTAG boundary-scan compliance for testability.

Technical Context

The XC2S50-5FG256I implements synchronous logic using four-input LUTs and flip-flops per CLB, with dedicated carry logic for arithmetic functions. It supports SelectIO™ standards including LVTTL, LVCMOS, and PCI, with programmable slew rate and drive strength per bank.

Configuration is performed via master serial mode using an external PROM or microcontroller, with internal startup sequence controlling INIT_B, PROGRAM_B, and DONE signals. The device includes eight global clock buffers and supports DLL-based clock deskew for input/output timing alignment.

Key Specifications

Pinout & Package

XC2S50-5FG256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Compared with XC2S50-6FG256C and XC3S50A-4VQG100C, the XC2S50-5FG256I uniquely balances industrial temperature operation, DLL-assisted timing control, and 176 I/O flexibility-making it suitable where thermal robustness and precise clock management outweigh raw speed or footprint reduction.

Availability

XC2S50-5FG256I is available at Aetrix Electronics and suitable for industrial motion control, digital video preprocessing, and communication bridge designs requiring stable component supply over extended product lifecycles.

Supply support for XC2S50-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.

The Spartan-II family, including XC2S50-5FG256I, was originally designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and industrial-grade reliability.

FAQ

What is the operating temperature range for XC2S50-5FG256I?

The XC2S50-5FG256I is rated for industrial temperature operation from -40°C to +100°C. This specification is defined in the original Xilinx Spartan-II DC and Switching Characteristics datasheet (DS001-4), and remains valid under AMD's continued support of legacy Xilinx products. Thermal derating applies above 85°C ambient per package thermal resistance values.

Does XC2S50-5FG256I support JTAG boundary-scan testing?

Yes, XC2S50-5FG256I fully supports IEEE 1149.1 JTAG boundary-scan functionality via dedicated TCK, TMS, TDI, and TDO pins. This enables in-system programming, interconnect testing, and debug visibility without requiring additional test fixtures. The JTAG chain can be daisy-chained with other compliant devices on the same board.

How many global clock lines does XC2S50-5FG256I provide?

XC2S50-5FG256I provides eight dedicated global clock buffer inputs (GCLK0 through GCLK7), each driving a low-skew global routing network. These are physically distinct from general-purpose I/Os and must be driven by clean, terminated clock sources to maintain timing integrity across the FPGA fabric.

Can XC2S50-5FG256I be configured using a microcontroller?

Yes, XC2S50-5FG256I supports master serial configuration mode, allowing a microcontroller to load the configuration bitstream via its GPIO or SPI interface. The microcontroller must assert PROGRAM_B, monitor INIT_B and DONE, and clock data synchronously on the DIN pin at ≤25 MHz, per Xilinx UG002 specification.

What is the maximum supported I/O standard for XC2S50-5FG256I?

XC2S50-5FG256I supports LVTTL, LVCMOS (3.3 V and 2.5 V), and PCI-compatible signaling standards. It does not support differential standards (e.g., LVDS, RSDS) or 1.8 V I/O. Each I/O bank operates independently, enabling mixed-voltage interfaces across different pin groups.