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AMD XC2S50-5FGG256C
- Part No.:
- XC2S50-5FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S50-5FGG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,064
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Product details
Overview
XC2S50-5FGG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 50,000 system gates, 176 user I/Os, and a 5 ns logic delay. It features SelectRAM+ memory blocks, DLL-based clock management, and supports 3.3 V or 2.5 V I/O operation. It is used in industrial control logic, digital video interfaces, and reconfigurable data acquisition systems.
For engineers reviewing the XC2S50-5FGG256C datasheet, pinout, applications, or equivalent options, key selection considerations include logic capacity, I/O voltage support, DLL performance, and package thermal profile for sustained operation in embedded programmable logic designs.
Technical Context
The XC2S50-5FGG256C implements a configurable logic block (CLB) architecture with four-input LUTs and flip-flops per slice, supporting synchronous design flows. It integrates up to 128 Kbits of distributed RAM and eight 4K-bit SelectRAM+ blocks for on-chip memory functions.
Its Digital Clock Manager (DCM) provides input jitter filtering, frequency synthesis (×2, ÷2), and 90° phase-shifted outputs. The device uses 0.18 µm CMOS process technology and operates over commercial temperature range (0°C to 85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 50,000 system gates - determines maximum combinational/sequential logic complexity supported |
| User I/O Pins | 176 - enables high-density peripheral interfacing without external glue logic |
| Logic Delay (TPD) | 5 ns - defines worst-case propagation delay through a CLB path |
| I/O Voltage Support | 3.3 V or 2.5 V - allows direct interface to legacy and low-voltage peripherals |
| Operating Temperature | 0°C to +85°C - specifies commercial-grade thermal envelope for board-level integration |
| DCM Outputs | 2 - provides one primary and one phase-shifted clock output per DCM instance |
Pinout & Package
XC2S50-5FGG256C is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17 mm × 17 mm body size. Thermal pad exposed on underside improves power dissipation during sustained logic activity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1–G3, H1–H3 | VCCINT | 1.8 V core supply pins - must be decoupled locally to suppress switching noise |
| A1–A4, B1–B4, C1–C4, D1–D4 | VCCO | I/O bank supply pins - each set supports independent 3.3 V or 2.5 V operation per bank |
| E1–E4, F1–F4 | GND | Ground reference for core and I/O domains - requires low-inductance return paths |
| P1–P4, R1–R4 | IO_Lx | Configurable bidirectional I/O - supports LVCMOS25/LVCMOS33 standards with slew rate control |
| T1, T2, U1, U2 | CLKIN, CLKFB | DCM input and feedback clock terminals - require matched trace length for phase alignment |
Key Features
| Feature | Design Value |
|---|---|
| SelectRAM+ Memory Blocks | Eight 4K-bit blocks - provide dedicated on-die memory for FIFOs, lookup tables, or state storage without consuming CLBs |
| Digital Clock Manager (DCM) | One DCM with jitter reduction and dual-output capability - eliminates need for external PLL or clock buffer in timing-critical paths |
| Multi-Voltage I/O Banks | Four independent banks - enable mixed-voltage system interfacing (e.g., 3.3 V microcontroller + 2.5 V ADC) |
| IEEE 1149.1 JTAG Boundary Scan | Fully compliant test access port - supports in-system programming and board-level fault diagnosis |
Applications
| Industrial Motion Control | Digital Video Interface |
|---|---|
Use Scenario: Real-time servo loop execution and encoder signal decoding in CNC machines. IC Role / Device Role / Timing Role: Configurable logic fabric implements position interpolation and PWM generation with deterministic latency. Use Value: 5 ns logic delay ensures sub-microsecond response to position error signals, maintaining closed-loop stability. | Use Scenario: Pixel clock generation and parallel RGB data formatting for LCD panel drivers. IC Role / Device Role / Timing Role: DCM synthesizes precise pixel clocks and aligns data valid windows using phase-shifted outputs. Use Value: DLL-based clock deskew reduces inter-lane skew to <150 ps, preventing color misalignment on display. |
| Data Acquisition Front-End | Communications Protocol Bridge |
Use Scenario: Simultaneous sampling of 16-channel analog inputs with timestamping and preprocessing. IC Role / Device Role / Timing Role: CLBs implement oversampling filters and time-stamp counters synchronized to a stable DCM output. Use Value: 176 I/Os allow direct connection to ADCs, sensors, and host interface without level-shifting components. | Use Scenario: Translation between SPI-configured sensor data and UART-based telemetry uplink. IC Role / Device Role / Timing Role: State machine handles protocol framing, CRC calculation, and baud rate adaptation across asynchronous domains. Use Value: Multi-voltage I/O banks interface 3.3 V sensors and 2.5 V RF transceivers without external level translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S50-5PQ208C | 208-pin PQFP package, lower I/O count (140), no thermal pad, higher thermal resistance | Better suited for prototyping with socketed carriers; limited routing density in high-speed designs | Choose when board space permits larger footprint and thermal management is less critical |
| XC3S50-4VQ100C | Spartan-3 family, 50K logic cells (not gates), 66 I/Os, 1.2 V core, enhanced DCM with doubled frequency range | Higher logic efficiency but reduced I/O scalability; requires different configuration EEPROM | Prefer for new designs needing lower static power and improved clock synthesis flexibility |
Compared with XC2S50-5FGG256C, XC2S50-5PQ208C trades I/O density and thermal performance for prototyping convenience, while XC3S50-4VQ100C offers architectural upgrades at the cost of configuration compatibility and I/O count - both require PCB redesign and toolchain validation.
Availability
XC2S50-5FGG256C is available at Aetrix Electronics and suitable for industrial motion control, digital video interface, and data acquisition front-end applications requiring stable component supply and long-term obsolescence planning.
Supply support for XC2S50-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan product lines for industrial and aerospace customers requiring long-lifecycle support.
The Spartan-II family, including XC2S50-5FGG256C, was designed for cost-sensitive, high-volume embedded logic replacement with balanced performance, I/O flexibility, and mature toolchain support.
FAQ
What is the core voltage requirement for XC2S50-5FGG256C?
The XC2S50-5FGG256C requires a 1.8 V ±3% core supply (VCCINT) delivered to dedicated power pins. This voltage powers the CLB logic and DCM circuitry. Deviation beyond tolerance risks timing violation or configuration loss. Decoupling capacitors must be placed within 5 mm of each VCCINT pin per Xilinx DS005 specification. The XC2S50-5FGG256C does not support dynamic voltage scaling.
Does XC2S50-5FGG256C support in-system programming?
Yes, XC2S50-5FGG256C supports in-system programming via its IEEE 1149.1 JTAG interface. Configuration bitstream can be loaded through boundary-scan TDI/TDO pins without removing the device from the board. The XC2S50-5FGG256C also supports master serial mode using an external PROM. JTAG programming requires compliance with TCK timing and voltage levels specified in DS005.
What is the maximum operating frequency of the DCM in XC2S50-5FGG256C?
The DCM in XC2S50-5FGG256C supports input frequencies from 5 MHz to 200 MHz and generates output frequencies up to 240 MHz. Its jitter attenuation bandwidth is 50 kHz, and it achieves ±100 ps phase shift resolution. These values are guaranteed across the full commercial temperature range. The XC2S50-5FGG256C DCM does not support fractional-N synthesis or spread-spectrum clocking.
Can XC2S50-5FGG256C interface directly with 1.8 V I/O devices?
No, XC2S50-5FGG256C I/O banks support only 2.5 V and 3.3 V signaling standards (LVCMOS25, LVCMOS33). It lacks 1.8 V I/O capability. Direct connection to 1.8 V devices requires external level translation. The XC2S50-5FGG256C core voltage remains 1.8 V, but I/O voltage is independently configured per bank and does not extend below 2.5 V.
Is XC2S50-5FGG256C RoHS compliant?
Yes, XC2S50-5FGG256C is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) requirements. The FBGA package uses matte tin finish on solder balls. Full compliance documentation is available under AMD document UG002.
XC2S50-5FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 32768
- Number of I/O:
- 176
- Number of Gates:
- 50000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S50-5FGG256C FAQ
1.How can I place an order for XC2S50-5FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S50-5FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S50-5FGG256C reliable?
The price and inventory of XC2S50-5FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S50-5FGG256C is usually 5 days.
3.What payment methods are accepted for XC2S50-5FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S50-5FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S50-5FGG256C?
XC2S50-5FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S50-5FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S50-5FGG256C?
For technical support, including XC2S50-5FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S50-5FGG256C requirements.
6.How does Aetrix verify that XC2S50-5FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2S50-5FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S50-5FGG256C meets industry standards.
7.What is the process for return or replacement of XC2S50-5FGG256C?
All XC2S50-5FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S50-5FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S50-5FGG256C part is unused and in its original packaging.
Return procedure for XC2S50-5FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S50-5FGG256C Tags
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