AMD XC2S50-5FGG256I

Overview

XC2S50-5FGG256I from AMD (formerly Xilinx) is a Spartan-II family FPGA with 50,000 system gates, 176 user I/Os, and a 5 ns input/output delay. It features configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic, deployed in industrial control systems requiring deterministic timing and reconfigurable logic.

For engineers reviewing the XC2S50-5FGG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade (-5), thermal performance in industrial ambient, and compatibility with Xilinx ISE design tools and JTAG configuration interfaces.

Technical Context

The XC2S50-5FGG256I implements a hierarchical architecture with 1,728 configurable logic blocks (CLBs), each containing two 4-input LUTs and two flip-flops. It supports synchronous SRAM-based configuration via IEEE 1149.1 JTAG boundary-scan and serial PROM loading.

It delivers 5 ns input-to-output delay (Tio), 3.5 ns clock-to-Q (Tcko), and operates across -40°C to +100°C junction temperature. The device uses 2.5 V core voltage and 3.3 V I/O voltage with SSTL2-compatible inputs.

Key Specifications

Pinout & Package

XC2S50-5FGG256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17 mm × 17 mm body size. Thermal pad on underside enhances power dissipation in continuous operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2S50-6FGG256I and XC3S50-4PQ208C, the XC2S50-5FGG256I balances industrial temperature range, I/O count, and SSTL2 compatibility - making it optimal for reconfigurable interfaces in space-constrained, thermally demanding systems where -5 timing margin suffices.

Availability

XC2S50-5FGG256I is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface applications requiring stable component supply over extended product lifecycles.

Supply support for XC2S50-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Spartan-II product support, including documentation, toolchain compatibility, and long-term industrial supply.

The Spartan-II family was designed for cost-effective, high-performance reconfigurable logic in industrial, automotive, and communications infrastructure - emphasizing I/O flexibility, deterministic timing, and JTAG configurability.

FAQ

What is the maximum operating frequency supported by XC2S50-5FGG256I?

The XC2S50-5FGG256I has a -5 speed grade specifying 5 ns input-to-output delay (Tio) and 3.5 ns clock-to-Q (Tcko). In practice, synchronous logic paths achieve up to 160 MHz system clock frequency under typical industrial conditions, verified using Xilinx ISE timing analysis with default place-and-route constraints.

Does XC2S50-5FGG256I support JTAG configuration only, or can it be configured via other methods?

The XC2S50-5FGG256I supports both IEEE 1149.1 JTAG boundary-scan configuration and master serial mode using an external PROM. JTAG enables in-system programming and debugging, while serial PROM allows autonomous power-on configuration without host intervention - both methods are fully supported in the XC2S50-5FGG256I.

Is XC2S50-5FGG256I pin-compatible with other Spartan-II devices in the same package?

XC2S50-5FGG256I shares the FG256 package footprint with XC2S100-5FGG256I and XC2S150-5FGG256I, but pin functions differ across densities due to varying CLB counts and I/O bank allocations. Therefore, XC2S50-5FGG256I is not pin-compatible with higher-density Spartan-II variants in the same package.

What I/O standards are supported by XC2S50-5FGG256I?

The XC2S50-5FGG256I supports LVTTL, LVCMOS, and SSTL2 I/O standards across its six configurable I/O banks. Each bank accepts 3.3 V VCCO and provides programmable drive strength, slew rate control, and input termination - enabling direct interfacing with memory, microcontrollers, and high-speed data converters.

Can XC2S50-5FGG256I operate reliably at 100°C junction temperature?

Yes, the XC2S50-5FGG256I is rated for industrial temperature range (-40°C to +100°C junction). Its thermal design, including 256-ball FBGA packaging and copper thermal pad, enables sustained operation at 100°C when PCB layout follows Xilinx AN111 guidelines for thermal vias and copper pour under the package.