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AMD XC2S50-6FG256C

Part No.:
XC2S50-6FG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXC2S50-6FG256C.pdf
Description:
IC FPGA 176 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,683

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Product details

Overview

XC2S50-6FG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 50,000 system gates, 176 logic cells, 28 I/O pins, and a 6 ns maximum input-to-output delay. It integrates configurable logic blocks, distributed RAM, and global clock networks for digital logic implementation in industrial control and communication interface designs.

For engineers reviewing the XC2S50-6FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade (-6), package footprint (FBGA256), configuration mode support, and embedded RAM capacity.

Technical Context

The XC2S50-6FG256C implements synchronous digital logic using 4-input LUTs and flip-flops per CLB, with dedicated carry chains for arithmetic functions. It supports JTAG boundary-scan testing and in-system programmability via SelectMAP or slave serial configuration modes.

Configuration is loaded from external PROM or processor-controlled interface; no on-chip nonvolatile memory is integrated. The -6 speed grade specifies guaranteed timing performance up to 166 MHz for internal register-to-register paths under commercial temperature conditions.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity50,000 system gates - defines maximum combinational logic complexity supported
CLBs176 configurable logic blocks - each contains two 4-LUTs and two registers for sequential logic
I/O Pins28 user I/O pins - supports parallel bus interfaces and multi-signal control channels
Speed Grade-6 - guarantees 6 ns input-to-output delay and 166 MHz register-to-register frequency
PackageFBGA256 - 17×17 mm fine-pitch ball grid array with 256 solder balls
Operating Temp0°C to 85°C - commercial temperature range suitable for non-automotive indoor applications

Pinout & Package

XC2S50-6FG256C uses a 256-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17×17 ball array. Pin assignment follows Xilinx Spartan-II pinout standard for FG256 package.

Pin/TerminalCircuit RoleDesign Meaning
VCCO_0I/O bank power supplySupplies 3.3 V to Bank 0 I/Os; must be decoupled locally
GNDGround referenceProvides signal return path; multiple balls assigned for low-inductance grounding
PROGRAM_BActive-low configuration initiatorPulls low to reset configuration logic and reload bitstream from external source
DONEConfiguration status indicatorOpen-drain output goes high when configuration completes successfully
TCK/TMS/TDI/TDOJTAG test interfaceEnables IEEE 1149.1 boundary-scan testing and programming without dedicated programmer

Key Features

FeatureDesign Value
Configurable Logic Blocks (CLBs)176 CLBs each with dual 4-LUTs and flip-flops enable efficient state machine and datapath implementation
Distributed RAM176 × 16-bit synchronous RAM per CLB allows small FIFOs and register files without block RAM
Global Clock NetworksFour low-skew global clock buffers support synchronous design across large logic regions
Multi-Voltage I/O SupportSupports 3.3 V LVTTL/LVCMOS I/O standards with programmable drive strength and slew rate

Applications

Industrial PLC InterfaceSerial Protocol Bridge

Use Scenario: Real-time I/O expansion module in programmable logic controller cabinets interfacing with sensors and actuators.

IC Role / Device Role / Timing Role: FPGA fabric implements custom timing-critical GPIO controllers and debounce logic with deterministic latency.

Use Value: 28 I/O pins and -6 speed grade ensure sub-microsecond response to fieldbus interrupt signals.

Use Scenario: UART-to-SPI protocol converter in legacy equipment retrofitting where RS-232 devices connect to SPI-based peripherals.

IC Role / Device Role / Timing Role: Configurable logic maps asynchronous UART framing to synchronous SPI clock domains with precise bit alignment.

Use Value: Distributed RAM and CLB resources allow dual-port buffering of 64-byte frames without external memory.

Motor Control Encoder PreprocessorTest Equipment Pattern Generator

Use Scenario: Quadrature encoder signal conditioning unit in servo drive subsystems counting position pulses and detecting direction changes.

IC Role / Device Role / Timing Role: Dedicated counter logic runs at 166 MHz to resolve high-resolution encoder edges without CPU overhead.

Use Value: Register-to-register timing guarantee ensures accurate 100 kpps pulse capture with zero missed counts.

Use Scenario: Digital stimulus generator in automated test equipment producing synchronized multi-channel digital waveforms.

IC Role / Device Role / Timing Role: FPGA fabric generates precise timing sequences using internal clock networks and counters.

Use Value: Four global clocks and deterministic routing enable <1 ns skew between 8-bit parallel output channels.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2S50-5FG256CSlower -5 speed grade (7 ns delay, 140 MHz max); identical logic resources and packageSuitable for lower-frequency control loops where timing margin is relaxedSelect XC2S50-5FG256C only if design meets timing at reduced clock rates to lower cost
XC3S50-4PQ208CSpartan-3 family; 50K gates, -4 speed, PQ208 package (208-pin PQFP); higher logic density per CLBRequires PCB redesign due to different package and pinout; supports enhanced features like DSP slicesXC3S50-4PQ208C offers better future scalability but mandates layout change and toolchain update

Compared with XC2S50-5FG256C, the XC2S50-6FG256C delivers tighter timing closure for high-speed I/O; versus XC3S50-4PQ208C, it retains legacy board compatibility but lacks advanced routing and embedded multipliers.

Availability

XC2S50-6FG256C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and legacy communication interface designs requiring stable component supply and long-term obsolescence management.

Supply support for XC2S50-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now oversees the Spartan FPGA product line. Xilinx originally developed the Spartan series as cost-optimized FPGAs for high-volume embedded applications.

The Spartan-II family, including XC2S50-6FG256C, was designed for logic replacement and glue-logic integration in cost-sensitive industrial and communications systems with moderate performance requirements.

FAQ

What is the configuration method supported by XC2S50-6FG256C?

The XC2S50-6FG256C supports master serial, slave serial, and SelectMAP configuration modes using external PROM or microprocessor. It does not include on-chip flash; configuration bitstream must be loaded at power-up. JTAG is available for programming and debugging. XC2S50-6FG256C requires external memory or host controller to store and deliver configuration data.

Does XC2S50-6FG256C include embedded block RAM?

No, XC2S50-6FG256C does not contain dedicated block RAM resources. It provides only distributed RAM within CLBs - 16 bits per CLB - suitable for small shift registers or lookup tables. Larger memory functions require external SRAM or use of multiple CLBs, limiting depth to ~176×16 bits. XC2S50-6FG256C relies on external memory for frame buffers or FIFOs exceeding this capacity.

What voltage levels are supported on XC2S50-6FG256C I/O banks?

XC2S50-6FG256C supports 3.3 V LVTTL and LVCMOS I/O standards exclusively. Each I/O bank requires a dedicated VCCO supply at 3.3 V; mixed-voltage operation across banks is not supported. Input thresholds and drive strength are fixed per bank and cannot be reconfigured to 2.5 V or 1.8 V. XC2S50-6FG256C is incompatible with lower-voltage interfaces without level-shifting circuitry.

Is XC2S50-6FG256C RoHS compliant?

Yes, XC2S50-6FG256C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU. The FBGA256 package uses matte tin finish on solder balls. This applies to all currently distributed lots. XC2S50-6FG256C meets environmental compliance requirements for industrial and commercial end equipment without exemption requests.

Can XC2S50-6FG256C operate in extended temperature ranges?

No, XC2S50-6FG256C is rated only for commercial temperature range (0°C to +85°C). It is not qualified for industrial (-40°C to +100°C) or automotive temperature grades. Operation outside 0–85°C may result in timing violations or configuration loss. XC2S50-6FG256C requires thermal management in enclosed enclosures to maintain ambient within specification.

XC2S50-6FG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-II
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
176
Number of Gates:
50000
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XC2S50-6FG256C FAQ

1.How can I place an order for XC2S50-6FG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S50-6FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S50-6FG256C reliable?

The price and inventory of XC2S50-6FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S50-6FG256C is usually 5 days.

3.What payment methods are accepted for XC2S50-6FG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S50-6FG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S50-6FG256C?

XC2S50-6FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S50-6FG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S50-6FG256C?

For technical support, including XC2S50-6FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S50-6FG256C requirements.

6.How does Aetrix verify that XC2S50-6FG256C is sourced from the original manufacturer or authorized distributors?

All XC2S50-6FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S50-6FG256C meets industry standards.

7.What is the process for return or replacement of XC2S50-6FG256C?

All XC2S50-6FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S50-6FG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S50-6FG256C part is unused and in its original packaging.

Return procedure for XC2S50-6FG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2S50-6FG256C Tags

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  • XC2S50-6FG256C Images
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