AMD XC2S50-6FG256C
- Part No.:
- XC2S50-6FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2S50-6FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,683
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Product details
Overview
XC2S50-6FG256C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 50,000 system gates, 176 logic cells, 28 I/O pins, and a 6 ns maximum input-to-output delay. It integrates configurable logic blocks, distributed RAM, and global clock networks for digital logic implementation in industrial control and communication interface designs.
For engineers reviewing the XC2S50-6FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade (-6), package footprint (FBGA256), configuration mode support, and embedded RAM capacity.
Technical Context
The XC2S50-6FG256C implements synchronous digital logic using 4-input LUTs and flip-flops per CLB, with dedicated carry chains for arithmetic functions. It supports JTAG boundary-scan testing and in-system programmability via SelectMAP or slave serial configuration modes.
Configuration is loaded from external PROM or processor-controlled interface; no on-chip nonvolatile memory is integrated. The -6 speed grade specifies guaranteed timing performance up to 166 MHz for internal register-to-register paths under commercial temperature conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 50,000 system gates - defines maximum combinational logic complexity supported |
| CLBs | 176 configurable logic blocks - each contains two 4-LUTs and two registers for sequential logic |
| I/O Pins | 28 user I/O pins - supports parallel bus interfaces and multi-signal control channels |
| Speed Grade | -6 - guarantees 6 ns input-to-output delay and 166 MHz register-to-register frequency |
| Package | FBGA256 - 17×17 mm fine-pitch ball grid array with 256 solder balls |
| Operating Temp | 0°C to 85°C - commercial temperature range suitable for non-automotive indoor applications |
Pinout & Package
XC2S50-6FG256C uses a 256-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17×17 ball array. Pin assignment follows Xilinx Spartan-II pinout standard for FG256 package.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank power supply | Supplies 3.3 V to Bank 0 I/Os; must be decoupled locally |
| GND | Ground reference | Provides signal return path; multiple balls assigned for low-inductance grounding |
| PROGRAM_B | Active-low configuration initiator | Pulls low to reset configuration logic and reload bitstream from external source |
| DONE | Configuration status indicator | Open-drain output goes high when configuration completes successfully |
| TCK/TMS/TDI/TDO | JTAG test interface | Enables IEEE 1149.1 boundary-scan testing and programming without dedicated programmer |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | 176 CLBs each with dual 4-LUTs and flip-flops enable efficient state machine and datapath implementation |
| Distributed RAM | 176 × 16-bit synchronous RAM per CLB allows small FIFOs and register files without block RAM |
| Global Clock Networks | Four low-skew global clock buffers support synchronous design across large logic regions |
| Multi-Voltage I/O Support | Supports 3.3 V LVTTL/LVCMOS I/O standards with programmable drive strength and slew rate |
Applications
| Industrial PLC Interface | Serial Protocol Bridge |
|---|---|
Use Scenario: Real-time I/O expansion module in programmable logic controller cabinets interfacing with sensors and actuators. IC Role / Device Role / Timing Role: FPGA fabric implements custom timing-critical GPIO controllers and debounce logic with deterministic latency. Use Value: 28 I/O pins and -6 speed grade ensure sub-microsecond response to fieldbus interrupt signals. | Use Scenario: UART-to-SPI protocol converter in legacy equipment retrofitting where RS-232 devices connect to SPI-based peripherals. IC Role / Device Role / Timing Role: Configurable logic maps asynchronous UART framing to synchronous SPI clock domains with precise bit alignment. Use Value: Distributed RAM and CLB resources allow dual-port buffering of 64-byte frames without external memory. |
| Motor Control Encoder Preprocessor | Test Equipment Pattern Generator |
Use Scenario: Quadrature encoder signal conditioning unit in servo drive subsystems counting position pulses and detecting direction changes. IC Role / Device Role / Timing Role: Dedicated counter logic runs at 166 MHz to resolve high-resolution encoder edges without CPU overhead. Use Value: Register-to-register timing guarantee ensures accurate 100 kpps pulse capture with zero missed counts. | Use Scenario: Digital stimulus generator in automated test equipment producing synchronized multi-channel digital waveforms. IC Role / Device Role / Timing Role: FPGA fabric generates precise timing sequences using internal clock networks and counters. Use Value: Four global clocks and deterministic routing enable <1 ns skew between 8-bit parallel output channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S50-5FG256C | Slower -5 speed grade (7 ns delay, 140 MHz max); identical logic resources and package | Suitable for lower-frequency control loops where timing margin is relaxed | Select XC2S50-5FG256C only if design meets timing at reduced clock rates to lower cost |
| XC3S50-4PQ208C | Spartan-3 family; 50K gates, -4 speed, PQ208 package (208-pin PQFP); higher logic density per CLB | Requires PCB redesign due to different package and pinout; supports enhanced features like DSP slices | XC3S50-4PQ208C offers better future scalability but mandates layout change and toolchain update |
Compared with XC2S50-5FG256C, the XC2S50-6FG256C delivers tighter timing closure for high-speed I/O; versus XC3S50-4PQ208C, it retains legacy board compatibility but lacks advanced routing and embedded multipliers.
Availability
XC2S50-6FG256C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and legacy communication interface designs requiring stable component supply and long-term obsolescence management.
Supply support for XC2S50-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the Spartan FPGA product line. Xilinx originally developed the Spartan series as cost-optimized FPGAs for high-volume embedded applications.
The Spartan-II family, including XC2S50-6FG256C, was designed for logic replacement and glue-logic integration in cost-sensitive industrial and communications systems with moderate performance requirements.
FAQ
What is the configuration method supported by XC2S50-6FG256C?
The XC2S50-6FG256C supports master serial, slave serial, and SelectMAP configuration modes using external PROM or microprocessor. It does not include on-chip flash; configuration bitstream must be loaded at power-up. JTAG is available for programming and debugging. XC2S50-6FG256C requires external memory or host controller to store and deliver configuration data.
Does XC2S50-6FG256C include embedded block RAM?
No, XC2S50-6FG256C does not contain dedicated block RAM resources. It provides only distributed RAM within CLBs - 16 bits per CLB - suitable for small shift registers or lookup tables. Larger memory functions require external SRAM or use of multiple CLBs, limiting depth to ~176×16 bits. XC2S50-6FG256C relies on external memory for frame buffers or FIFOs exceeding this capacity.
What voltage levels are supported on XC2S50-6FG256C I/O banks?
XC2S50-6FG256C supports 3.3 V LVTTL and LVCMOS I/O standards exclusively. Each I/O bank requires a dedicated VCCO supply at 3.3 V; mixed-voltage operation across banks is not supported. Input thresholds and drive strength are fixed per bank and cannot be reconfigured to 2.5 V or 1.8 V. XC2S50-6FG256C is incompatible with lower-voltage interfaces without level-shifting circuitry.
Is XC2S50-6FG256C RoHS compliant?
Yes, XC2S50-6FG256C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU. The FBGA256 package uses matte tin finish on solder balls. This applies to all currently distributed lots. XC2S50-6FG256C meets environmental compliance requirements for industrial and commercial end equipment without exemption requests.
Can XC2S50-6FG256C operate in extended temperature ranges?
No, XC2S50-6FG256C is rated only for commercial temperature range (0°C to +85°C). It is not qualified for industrial (-40°C to +100°C) or automotive temperature grades. Operation outside 0–85°C may result in timing violations or configuration loss. XC2S50-6FG256C requires thermal management in enclosed enclosures to maintain ambient within specification.
XC2S50-6FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 32768
- Number of I/O:
- 176
- Number of Gates:
- 50000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2S50-6FG256C FAQ
1.How can I place an order for XC2S50-6FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S50-6FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S50-6FG256C reliable?
The price and inventory of XC2S50-6FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S50-6FG256C is usually 5 days.
3.What payment methods are accepted for XC2S50-6FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S50-6FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S50-6FG256C?
XC2S50-6FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S50-6FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S50-6FG256C?
For technical support, including XC2S50-6FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S50-6FG256C requirements.
6.How does Aetrix verify that XC2S50-6FG256C is sourced from the original manufacturer or authorized distributors?
All XC2S50-6FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S50-6FG256C meets industry standards.
7.What is the process for return or replacement of XC2S50-6FG256C?
All XC2S50-6FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S50-6FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S50-6FG256C part is unused and in its original packaging.
Return procedure for XC2S50-6FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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