My Inquiry
My Account
AMD XC2S50-6TQG144C
- Part No.:
- XC2S50-6TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC2S50-6TQG144C.pdf
- Description:
- IC FPGA 92 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,746
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2S50-6TQG144C from AMD (formerly Xilinx) is a Spartan-II family FPGA with 50,000 system gates, 144-pin TQFP package, 2.5 V core voltage, and -6 speed grade. It integrates configurable logic blocks, distributed RAM, and global clock networks for digital logic implementation in industrial control and communication interface designs.
For engineers reviewing the XC2S50-6TQG144C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (117 user I/Os), configuration mode support (Master Serial, Slave Parallel), and IEEE 1149.1 JTAG boundary-scan compliance for testability.
Technical Context
The XC2S50-6TQG144C implements a fine-grain, SRAM-based architecture with 1728 configurable logic blocks (CLBs), each containing two 4-input LUTs and flip-flops. It supports synchronous design with four global clock lines and DLL-based clock delay control.
Configuration is performed via external PROM or microprocessor using Master Serial (SPI-like) or Slave Parallel modes. The device includes internal pull-up resistors on dedicated configuration pins and supports multi-voltage I/O banks (3.3 V, 2.5 V, 1.8 V) with programmable slew rate and drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 50,000 system gates - defines maximum combinational logic density for gate-equivalent synthesis |
| Configurable Logic Blocks | 1728 CLBs - each provides dual 4-LUTs + flip-flops for synchronous logic implementation |
| User I/O Pins | 117 - supports multi-bank I/O with independent voltage and standard assignment per bank |
| Core Voltage | 2.5 V ± 0.1 V - determines power delivery network design and decoupling requirements |
| Speed Grade | -6 - specifies worst-case propagation delay (e.g., tPD ≤ 6.0 ns for CLB-to-CLB paths) |
| Configuration Mode | Master Serial, Slave Parallel, JTAG - defines boot source interface and programming flexibility |
| Distributed RAM | 72 Kb - implemented as shift registers or small memory arrays within CLBs |
Pinout & Package
XC2S50-6TQG144C is housed in a 144-lead Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad (non-electrical). Package meets JEDEC MS-026 standard and supports reflow soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK3 | Global Clock Input | Dedicated low-skew inputs feeding global clock networks for synchronous timing domains |
| TCK, TMS, TDI, TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming and debug |
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset that clears configuration memory and restarts boot sequence |
| DONE | Configuration Status Output | Open-drain signal indicating successful configuration completion |
| HSWAP_EN | Hot-Swap Enable | Enables weak pull-up on I/O pins during power-up to prevent floating states |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Four independent banks supporting 3.3 V, 2.5 V, or 1.8 V signaling - enables mixed-voltage system interfacing without level shifters |
| Dedicated Carry Chain | Fast arithmetic path across CLBs - reduces propagation delay in counters and adders |
| Internal 4-Bit Wide Distributed RAM | Per-CLB RAM blocks up to 16 bits deep - used for small FIFOs or register files without block RAM resources |
| Programmable Slew Rate & Drive Strength | Configurable per I/O - mitigates EMI and signal integrity issues in high-speed routing |
| IEEE 1149.1 JTAG Support | Fully compliant boundary-scan - enables in-circuit testing and ISP without external programmers |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Adapter |
|---|---|
Use Scenario: Real-time digital I/O expansion for programmable logic controllers with fieldbus connectivity. IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for input debouncing, output latching, and protocol translation between Modbus RTU and local parallel bus. Use Value: 117 user I/Os and multi-voltage support allow direct connection to 24 V DC sensors and 5 V/3.3 V controller buses without external level shifters. | Use Scenario: Bridging ISA or PCI legacy peripherals to modern microcontroller-based systems. IC Role / Device Role / Timing Role: Configurable glue logic maps asynchronous ISA timing windows to synchronous APB or AHB bus cycles. Use Value: -6 speed grade ensures setup/hold timing margins for 8 MHz ISA read/write cycles; distributed RAM stores handshake state machines. |
| Motor Control Encoder Interface | Test Equipment Pattern Generator |
Use Scenario: High-resolution quadrature decoding and PWM generation for servo motor drives. IC Role / Device Role / Timing Role: Dedicated carry chain accelerates 32-bit position counters; global clocks synchronize PWM edges with encoder zero-crossing detection. Use Value: 1728 CLBs provide sufficient logic for dual-channel 24-bit quadrature counters plus dead-time insertion logic in single device. | Use Scenario: Generating deterministic digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: FPGA implements pattern sequencer with programmable depth, trigger latency, and output skew calibration. Use Value: Internal distributed RAM stores 256-word stimulus patterns; JTAG interface enables real-time pattern update during test execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2S50-5TQ144C | Slower -5 speed grade (tPD ≤ 7.0 ns); identical logic capacity, I/O count, and package | Suitable for lower-frequency control loops where timing margin is relaxed | Select when target clock frequency ≤ 80 MHz and cost sensitivity outweighs performance headroom |
| XC3S50-4PQ208C | Spartan-3 family; 50K logic cells, 208-pin PQFP, 1.2 V core, higher I/O count (161), no distributed RAM but added block RAM (72 Kb) | Better suited for data buffering or embedded soft-core use, not drop-in replacement due to different pinout and configuration scheme | Choose for new designs requiring larger memory or higher clock rates; requires PCB redesign and toolchain migration |
Compared with XC2S50-6TQG144C, the XC2S50-5TQ144C trades speed for cost in legacy-compatible layouts, while the XC3S50-4PQ208C offers architectural upgrades at the expense of pin compatibility and configuration infrastructure changes.
Availability
XC2S50-6TQG144C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and legacy system upgrade programs requiring stable component supply over extended production lifecycles.
Supply support for XC2S50-6TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the legacy Spartan FPGA product lines. Xilinx originally developed these devices for cost-sensitive, high-volume embedded logic applications.
The Spartan-II family, including XC2S50-6TQG144C, was designed for non-volatile configuration-less operation in industrial control, communications infrastructure, and peripheral interface applications where gate density and I/O flexibility outweigh advanced features like embedded processors.
FAQ
What is the configuration method supported by XC2S50-6TQG144C?
The XC2S50-6TQG144C supports Master Serial (via external PROM), Slave Parallel (via microprocessor data bus), and IEEE 1149.1 JTAG modes. Configuration bitstream is loaded into on-chip SRAM, requiring persistent storage or reprogramming at power-up. XC2S50-6TQG144C does not include on-die flash memory.
Does XC2S50-6TQG144C support hot-swap I/O operation?
Yes, XC2S50-6TQG144C includes HSWAP_EN pin functionality that enables weak pull-ups on all I/O pins during power-up, preventing floating states when boards are inserted into live backplanes. This feature is configurable and requires external pull-down on HSWAP_EN to disable.
What is the maximum operating frequency for XC2S50-6TQG144C logic paths?
The -6 speed grade guarantees worst-case CLB-to-CLB propagation delay of ≤6.0 ns, enabling reliable operation up to approximately 125 MHz for fully registered paths. Actual achievable frequency depends on routing, logic depth, and clock network usage. XC2S50-6TQG144C does not specify a hard maximum clock frequency in datasheets.
Can XC2S50-6TQG144C be used with 3.3 V I/O standards?
Yes, XC2S50-6TQG144C supports 3.3 V LVTTL and LVCMOS I/O standards in designated I/O banks. Each bank is independently configurable for 3.3 V, 2.5 V, or 1.8 V operation, allowing mixed-voltage interfaces. Core voltage remains fixed at 2.5 V regardless of I/O bank settings.
Is XC2S50-6TQG144C pin-compatible with other Spartan-II devices in the same package?
XC2S50-6TQG144C shares the same 144-pin TQFP footprint and pinout with other Spartan-II devices rated for the TQG144 package, including XC2S15, XC2S30, and XC2S100 variants. Power, ground, configuration, and global clock pins are identical; only usable CLB count and associated routing resources differ.
XC2S50-6TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-II
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 32768
- Number of I/O:
- 92
- Number of Gates:
- 50000
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC2S50-6TQG144C FAQ
1.How can I place an order for XC2S50-6TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2S50-6TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2S50-6TQG144C reliable?
The price and inventory of XC2S50-6TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S50-6TQG144C is usually 5 days.
3.What payment methods are accepted for XC2S50-6TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S50-6TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2S50-6TQG144C?
XC2S50-6TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2S50-6TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2S50-6TQG144C?
For technical support, including XC2S50-6TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S50-6TQG144C requirements.
6.How does Aetrix verify that XC2S50-6TQG144C is sourced from the original manufacturer or authorized distributors?
All XC2S50-6TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S50-6TQG144C meets industry standards.
7.What is the process for return or replacement of XC2S50-6TQG144C?
All XC2S50-6TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC2S50-6TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2S50-6TQG144C part is unused and in its original packaging.
Return procedure for XC2S50-6TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2S50-6TQG144C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
