AMD XC2S50E-6PQ208C

Overview

XC2S50E-6PQ208C from Xilinx is a 50,000-system-gate Spartan®-IIE Field-Programmable Gate Array with 1,728 logic cells, 384 Configurable Logic Blocks (CLBs), and 182 user I/O pins in a 208-pin Plastic Quad Flat Package (PQFP). It integrates four Delay-Locked Loops (DLLs) for clock deskew and phase control, 32 Kbits of block RAM, and 24,576 bits of distributed RAM. It operates at 1.8 V core voltage and supports 3.3 V, 2.5 V, or 1.5 V I/O standards - used in industrial control logic, legacy PCI interface bridging, and reconfigurable data acquisition systems.

For engineers reviewing the XC2S50E-6PQ208C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (guaranteed 125 MHz system clock), PQ208 package footprint compatibility across Spartan-IIE family members, dual-voltage I/O banking architecture, and support for hot-swap insertion in CompactPCI-compliant backplanes.

Technical Context

The XC2S50E-6PQ208C implements a hierarchical FPGA architecture with CLBs arranged in a 16 × 24 array, surrounded by programmable IOBs and flanked by two columns of 4K-bit true dual-port block RAM. Its four corner-located DLLs provide deterministic clock deskew, multiplication (×2–×4), division (/2–/8), and phase shift (±90°, ±180°) without external components.

Each IOB supports 19 selectable I/O standards-including LVTTL, LVCMOS, SSTL, HSTL, and LVDS-with independent VCCO per bank and shared VREF within bank. The device uses static memory cells for configuration, enabling unlimited in-system reprogramming via master serial, slave serial, slave parallel, or JTAG boundary scan modes.

Key Specifications

Pinout & Package

XC2S50E-6PQ208C is housed in a 208-pin Plastic Quad Flat Package (PQFP) with 0.5 mm pitch, 28 × 28 mm body size, and exposed thermal pad. Pinout follows Xilinx DS077-4 module: 182 user I/O pins distributed across eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), dedicated JTAG TDI/TDO/TMS/TCK, and configuration pins (INIT_B, PROGRAM_B, DONE, CCLK, DIN).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.

Compared with XC2S50-6PQ208C, the XC2S50E-6PQ208C delivers higher I/O count, hot-swap capability, and four DLLs - enabling more complex timing architectures. Against XCR3256XL-10TQ144I, it offers scalable logic density, embedded memory, and clock management essential for reconfigurable systems.

Availability

XC2S50E-6PQ208C is available at Aetrix Electronics and suitable for industrial motion controllers, legacy PCI bridge adapters, and reconfigurable data loggers requiring stable component supply through extended production lifecycles.

Supply support for XC2S50E-6PQ208C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for adaptive computing.

The Spartan-IIE family was designed for cost-sensitive, high-volume applications requiring ASIC-like performance with FPGA flexibility - targeting industrial automation, communications infrastructure, and legacy system upgrades.

FAQ

What is the maximum guaranteed operating frequency of the XC2S50E-6PQ208C?

The XC2S50E-6PQ208C carries a -6 speed grade, guaranteeing 125 MHz system clock operation under commercial temperature conditions (0°C to +85°C) with worst-case voltage and process corners. This rating applies to internal CLB paths; actual achievable frequency depends on design topology, placement, and routing - verified via Xilinx ISE timing analysis using the -6 speed model.

Does the XC2S50E-6PQ208C support hot-swap functionality?

Yes, the XC2S50E-6PQ208C supports hot-swap insertion per CompactPCI v2.2 requirements. Its I/O pins remain high-impedance before and during configuration, with no current path to VCCINT or VCCO. This allows safe plugging into powered backplanes - confirmed for all Spartan-IIE devices manufactured after PCN2002-05, including XC2S50E-6PQ208C.

How many block RAM blocks does the XC2S50E-6PQ208C contain?

The XC2S50E-6PQ208C contains eight 4K-bit synchronous block RAMs, totaling 32 Kbits. Each block supports true dual-port operation (independent read/write addresses), byte-write enable, and programmable parity - usable as FIFOs, frame buffers, or small instruction memories without external SRAM.

What I/O standards are supported by the XC2S50E-6PQ208C?

The XC2S50E-6PQ208C supports 19 I/O standards including LVTTL, LVCMOS (1.8 V/2.5 V/3.3 V), PCI (3.3 V, 33/66 MHz), SSTL, HSTL, GTL, LVDS, and LVPECL. Standards are grouped by VCCO bank; mixing standards within a bank requires shared VCCO and compatible VREF - detailed in Table 4 of DS077-2.

Is the XC2S50E-6PQ208C still in active production?

No - the XC2S50E-6PQ208C was discontinued per Xilinx Change Notice XCN12026 (2012). However, Aetrix Electronics maintains legacy inventory with traceable sourcing and provides lifecycle coordination support, including obsolescence forecasting and last-time-buy planning for ongoing industrial deployments.