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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XC2S50E-6PQ208I

Name: XC2S50E-6PQ208I
Brand: AMD
SKU: XC2S50E-6PQ208I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XC2S50E-6PQ208I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 208-BFQFP

Datasheet:: XC2S50E-6PQ208I.pdf

Description:: IC FPGA 146 I/O 208QFP

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Product details

Overview

XC2S50E-6PQ208I from Xilinx is a Spartan®-IIE Field-Programmable Gate Array with 1,728 logic cells, 384 Configurable Logic Blocks (CLBs), and 182 user I/O pins in a 208-pin Plastic Quad Flat Package (PQFP). It operates at -40°C to +100°C industrial temperature range, features four Delay-Locked Loops (DLLs) for clock management, and supports 19 I/O standards including LVTTL, LVCMOS, SSTL, and LVDS. It is used in reprogrammable digital logic control systems requiring deterministic timing and low-cost high-volume deployment.

For engineers reviewing the XC2S50E-6PQ208I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing parameters, CLB switching characteristics, and package-specific differential pair allocation - all confirmed against DS077-4 (v3.0) pinout tables and DS077-3 DC/switching specifications.

Technical Context

The XC2S50E-6PQ208I implements a regular array of CLBs surrounded by programmable IOBs, with two columns of 4K-bit true dual-port block RAM placed adjacent to CLB rows. Its four corner-located DLLs provide phase alignment, multiplication (up to ×2), and division (÷2, ÷4) of input clocks without external components.

IOBs are grouped into eight voltage-isolated banks; in the PQ208 package, all VCCO pins are interconnected, permitting only one I/O supply voltage (e.g., 3.3V or 2.5V), while up to eight independent VREF voltages may be applied per bank for mixed-input standards like SSTL2 and HSTL Class I.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	1,728 - defines maximum combinational logic capacity; each cell includes 4-LUT, carry chain, and flip-flop.
User I/O Pins	182 - total configurable bidirectional pins; includes four global clock/user input pins per DS077-1 Table 2.
Block RAM	32 Kbits - implemented as sixteen 4K-bit true dual-port RAM blocks; enables synchronous read/write on independent ports.
DLLs	4 - dedicated delay-locked loops per corner; eliminate clock skew, support ×2/÷2/÷4 frequency synthesis, and phase shift.
Operating Temperature	-40°C to +100°C - industrial grade; validated for sustained operation under thermal cycling in embedded control environments.
I/O Standards	19 - includes LVTTL, LVCMOS2/LVCMOS18, SSTL3/SSTL2, HSTL Class I/III/IV, LVDS, and PCI-compliant 3.3V 66 MHz interfaces.
Core Voltage (VCCINT)	1.8 V ± 0.1 V - powers CLBs and internal routing; enables lower dynamic power vs. 2.5V Spartan-II core.

Pinout & Package

XC2S50E-6PQ208I uses a 208-pin Plastic Quad Flat Package (PQFP) with 28×28 mm body size, 0.5 mm lead pitch, and exposed thermal pad. Pinout follows DS077-4 (v3.0) PQ208 pin definitions, with eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), and dedicated JTAG boundary-scan pins (TCK/TMS/TDI/TDO).

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Four dedicated low-skew clock distribution nets; each connects directly to DLL inputs and CLB clock trees.
TCK, TMS, TDI, TDO	JTAG Boundary Scan	IEEE 1149.1-compliant test interface; enables in-system programming and post-configuration verification.
PROGRAM_B, INIT_B, DONE	Configuration Control	Active-low PROGRAM_B initiates configuration reset; INIT_B signals readiness; DONE goes high when configuration completes.
VCCINT	Core Power Supply	1.8 V supply for CLBs, RAM, and routing; requires local 0.1 µF ceramic decoupling per DS077-3 Section 3.2.
VCCO_0–VCCO_7	I/O Bank Power	In PQ208, all VCCO pins tied together; single 3.3 V or 2.5 V supply powers all eight I/O banks simultaneously.
VREF_0–VREF_7	Input Threshold Reference	Eight independent VREF inputs; each assigned to one bank; required for SSTL/HSTL input standards.

Key Features

Feature	Design Value
Unlimited In-System Reprogrammability	Configuration stored in SRAM cells; supports field updates via JTAG or serial PROM without hardware change.
SelectRAM™ Hierarchical Memory	Combines 24,576 bits distributed RAM (LUT-based) + 32 Kbits block RAM; enables mixed-depth memory architectures.
Hot-Swap I/O Support	Validated per CompactPCI v2.2; pins remain high-Z before VCCINT/VCCO ramp; immune to latch-up during live insertion.
Dedicated Carry Logic	Two independent carry chains per CLB; supports ripple-carry adders up to 72 bits with predictable propagation delay.
Configurable IOB Registers	Each IOB contains three D-type flip-flops with independent CE, SR, and polarity control; enables precise input/output timing alignment.

Applications

Industrial Motion Controller	PCI Interface Bridge
Use Scenario: Real-time servo loop execution with synchronized encoder capture and PWM output generation in factory automation PLCs. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines, position interpolators, and jitter-free 200 kHz PWM generators; DLLs lock to 50 MHz reference for sub-5 ns timing closure. Use Value: Replaces ASIC with zero NRE cost; achieves <100 ns input-to-output latency using dedicated carry chains and BUFT-driven local busses.	Use Scenario: Bridging legacy parallel bus peripherals to 32-bit 33/66 MHz PCI slots in test instrumentation chassis. IC Role / Device Role / Timing Role: Implements PCI target interface with full compliance to PCI Local Bus Specification v2.2; uses LVTTL I/O banks and DLL-synchronized sampling. Use Value: Delivers 264 MB/s peak throughput using 182 I/Os configured as multiplexed AD[31:0], C/BE[3:0]#, and PAR; meets setup/hold timing across -40°C to +100°C.
Communications Backplane Interface	Medical Imaging Data Aggregator
Use Scenario: Aggregating LVDS data streams from multiple ultrasound transducer modules into a unified DDR2 memory controller interface. IC Role / Device Role / Timing Role: XC2S50E-6PQ208I terminates 83 differential I/O pairs; implements deserializers, channel alignment FIFOs, and burst-mode address translation. Use Value: Leverages 32 Kbits block RAM for 128-deep × 256-bit channel buffers; DLL phase-shift mode aligns 100 MHz LVDS RX clocks to internal memory clock domain.	Use Scenario: Synchronizing time-of-flight sensor arrays and compressing raw pixel data prior to Ethernet transmission in portable MRI subsystems. IC Role / Device Role / Timing Role: Configurable logic processes 12-bit ADC samples at 40 MSPS; distributed RAM stores 2D convolution kernels; block RAM holds compressed frame buffers. Use Value: Achieves real-time 2D median filtering using 24,576 bits of LUT RAM; 1.8 V core reduces thermal load in sealed medical enclosures.

Industrial Motion Controller

PCI Interface Bridge

Use Scenario: Real-time servo loop execution with synchronized encoder capture and PWM output generation in factory automation PLCs.

IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines, position interpolators, and jitter-free 200 kHz PWM generators; DLLs lock to 50 MHz reference for sub-5 ns timing closure.

Use Value: Replaces ASIC with zero NRE cost; achieves <100 ns input-to-output latency using dedicated carry chains and BUFT-driven local busses.

Use Scenario: Bridging legacy parallel bus peripherals to 32-bit 33/66 MHz PCI slots in test instrumentation chassis.

IC Role / Device Role / Timing Role: Implements PCI target interface with full compliance to PCI Local Bus Specification v2.2; uses LVTTL I/O banks and DLL-synchronized sampling.

Use Value: Delivers 264 MB/s peak throughput using 182 I/Os configured as multiplexed AD[31:0], C/BE[3:0]#, and PAR; meets setup/hold timing across -40°C to +100°C.

Communications Backplane Interface

Medical Imaging Data Aggregator

Use Scenario: Aggregating LVDS data streams from multiple ultrasound transducer modules into a unified DDR2 memory controller interface.

IC Role / Device Role / Timing Role: XC2S50E-6PQ208I terminates 83 differential I/O pairs; implements deserializers, channel alignment FIFOs, and burst-mode address translation.

Use Value: Leverages 32 Kbits block RAM for 128-deep × 256-bit channel buffers; DLL phase-shift mode aligns 100 MHz LVDS RX clocks to internal memory clock domain.

Use Scenario: Synchronizing time-of-flight sensor arrays and compressing raw pixel data prior to Ethernet transmission in portable MRI subsystems.

IC Role / Device Role / Timing Role: Configurable logic processes 12-bit ADC samples at 40 MSPS; distributed RAM stores 2D convolution kernels; block RAM holds compressed frame buffers.

Use Value: Achieves real-time 2D median filtering using 24,576 bits of LUT RAM; 1.8 V core reduces thermal load in sealed medical enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XC2S50-6PQ208C	Commercial temperature range (0°C to +85°C); identical logic density, I/O count, and DLL count but lacks industrial-grade qualification.	Suitable for lab prototypes or non-ruggedized consumer electronics; not rated for extended thermal cycling.	Select XC2S50-6PQ208C only if operating environment remains within commercial limits and cost sensitivity outweighs reliability requirements.
XC3S50A-4VQG100C	Spartan-3A family; 50K system gates, 100-pin VQFP, 1.2 V core, no DLLs (uses DCM instead), 64 user I/Os.	Lacks DLL-based clock deskew and phase shifting; lower I/O count restricts multi-standard interface designs.	Choose XC3S50A-4VQG100C only when migrating to smaller footprint and lower power is prioritized over clock precision and I/O flexibility.

Compared with XC2S50E-6PQ208I, XC2S50-6PQ208C trades industrial temperature tolerance for lower acquisition cost, while XC3S50A-4VQG100C sacrifices DLL capability and I/O scalability to reduce package size and core voltage - making XC2S50E-6PQ208I the sole option supporting hot-swap, multi-voltage I/O banking, and deterministic clock synthesis in PQ208 form factor.

Availability

XC2S50E-6PQ208I is available at Aetrix Electronics and suitable for industrial motion controllers, PCI interface bridges, communications backplane interfaces, and medical imaging data aggregators requiring stable component supply across extended lifecycle windows.

Supply support for XC2S50E-6PQ208I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for customizable digital logic implementation.

The Spartan-IIE family was designed for cost-sensitive, high-volume applications requiring reprogrammable logic with integrated clock management and multi-standard I/O - targeting industrial control, communications infrastructure, and medical equipment.

FAQ

What is the maximum system gate count supported by XC2S50E-6PQ208I?

The XC2S50E-6PQ208I supports a typical system gate range of 23,000 to 50,000 gates, as specified in DS077-1 Table 1. This reflects combined logic and RAM resources; actual usable gates depend on design utilization of CLBs, block RAM, and routing resources. The 1,728 logic cells provide deterministic capacity for synthesizable RTL.

Does XC2S50E-6PQ208I support LVDS signaling, and how many differential pairs are available?

Yes, XC2S50E-6PQ208I supports LVDS signaling and provides up to 83 differential I/O pairs, as confirmed in DS077-1 Table 1. These are allocated across eight I/O banks; in PQ208 packaging, LVDS pairs must share common VCCO and adhere to bank-specific VREF rules for proper termination.

What clock management resources does XC2S50E-6PQ208I include?

XC2S50E-6PQ208I integrates four dedicated Delay-Locked Loops (DLLs), one at each die corner. Each DLL supports clock delay elimination, frequency multiplication (×2), division (÷2, ÷4), and fine phase shifting - enabling precise clock domain crossing and jitter reduction without external PLL components.

Is XC2S50E-6PQ208I compatible with hot-swap insertion in powered backplanes?

Yes, XC2S50E-6PQ208I supports hot swap per CompactPCI v2.2. Its I/O pins remain high-impedance before VCCINT/VCCO ramp-up, with no current path to internal supplies and latch-up immunity. This functionality is enabled in all Spartan-IIE devices manufactured after PCN2002-05.

What is the core voltage requirement for XC2S50E-6PQ208I, and what decoupling is recommended?

XC2S50E-6PQ208I requires a 1.8 V ± 0.1 V core supply (VCCINT). Per DS077-3 Section 3.2, each VCCINT pin must be decoupled with a minimum 0.1 µF ceramic capacitor placed within 10 mm of the pin; bulk capacitance (e.g., 10 µF tantalum) is also recommended near the PQ208 package edge.

XC2S50E-6PQ208I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Spartan®-IIE

Package/Case:: 208-BFQFP

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 384

Number of Logic Elements/Cells:: 1728

Total RAM Bits:: 32768

Number of I/O:: 146

Number of Gates:: 50000

Voltage - Supply:: 1.71V ~ 1.89V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 208-PQFP (28x28)

XC2S50E-6PQ208I FAQ

1.How can I place an order for XC2S50E-6PQ208I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2S50E-6PQ208I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2S50E-6PQ208I reliable?

The price and inventory of XC2S50E-6PQ208I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2S50E-6PQ208I is usually 5 days.

3.What payment methods are accepted for XC2S50E-6PQ208I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2S50E-6PQ208I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2S50E-6PQ208I?

XC2S50E-6PQ208I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2S50E-6PQ208I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2S50E-6PQ208I?

For technical support, including XC2S50E-6PQ208I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2S50E-6PQ208I requirements.

6.How does Aetrix verify that XC2S50E-6PQ208I is sourced from the original manufacturer or authorized distributors?

All XC2S50E-6PQ208I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2S50E-6PQ208I meets industry standards.

7.What is the process for return or replacement of XC2S50E-6PQ208I?

All XC2S50E-6PQ208I units undergo pre-shipment inspection (PSI). If there is an issue with XC2S50E-6PQ208I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2S50E-6PQ208I part is unused and in its original packaging.

Return procedure for XC2S50E-6PQ208I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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