AMD XC2S50E-6TQ144C

Overview

XC2S50E-6TQ144C from Xilinx is a 1.8V-core, 3.3V/2.5V/1.8V I/O Spartan-IIE Field-Programmable Gate Array with 1,728 logic cells, 384 Configurable Logic Blocks (CLBs), 24,576 bits of distributed RAM, and 32 Kbits of true dual-port block RAM. It features four Delay-Locked Loops (DLLs) for clock multiplication, phase shifting, and skew elimination, and supports up to 102 user I/O pins in the 144-pin Thin Quad Flat Package (TQFP). It is used in cost-sensitive, high-volume embedded control and interface bridging applications requiring field-upgradable logic.

For engineers reviewing the XC2S50E-6TQ144C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (guaranteed 125 MHz system clock), TQ144 package footprint compatibility across Spartan-IIE densities, support for 19 I/O standards including LVTTL, LVCMOS, and PCI, and hot-swap capability compliant with CompactPCI v2.2.

Technical Context

The XC2S50E-6TQ144C implements a hierarchical architecture with CLBs containing four logic cells each, two per slice, with 4-input LUTs that double as 16×1-bit synchronous RAM. Its four corner-placed DLLs provide deterministic clock deskew and programmable multiplication/division ratios without external components.

I/O functionality is organized into eight voltage-isolated banks; in the TQ144 package, all VCCO pins are internally interconnected, permitting only one I/O supply voltage (e.g., 3.3V), while supporting independent VREF per bank for mixed-input standards like SSTL3 and HSTL. Each IOB includes three registers with shared CLK but independent CE and configurable SR/BY polarity.

Key Specifications

Pinout & Package

XC2S50E-6TQ144C is housed in a 144-pin Plastic Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad. Pinout follows Xilinx DS077-4 (v3.0) Module 4, with 102 user I/O pins distributed across eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), and dedicated configuration pins (INIT, PROGRAM, DONE, CCLK, DIN, M0–M2).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and interface applications.

Compared with XC2S50E-6TQ144C, XC2S50-6TQ144C omits DLLs and thus cannot meet PCI timing without external delay compensation, while XC3S50A-4VQG100C offers superior clock management via DCM and higher I/O count but mandates layout and toolchain changes.

Availability

XC2S50E-6TQ144C is available at Aetrix Electronics and suitable for industrial PLC expansion, legacy bus bridging, CompactPCI hot-swap control, and low-cost video buffering requiring stable component supply and long-term obsolescence mitigation strategies.

Supply support for XC2S50E-6TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms targeting aerospace, industrial, and communications markets.

The Spartan-IIE family was designed for cost-sensitive, high-volume applications requiring field-upgradable logic, PCI compliance, and low-power 1.8V core operation-positioned as an ASIC alternative with rapid time-to-market.

FAQ

What is the maximum guaranteed operating frequency of the XC2S50E-6TQ144C?

The XC2S50E-6TQ144C carries a -6 speed grade, guaranteeing full functionality at 125 MHz system clock frequency under commercial temperature conditions (0°C to +85°C) per DS077-3 switching characteristics. This applies to internal CLB paths and DLL-controlled I/O timing; actual achievable frequency depends on design complexity and placement.

Does the XC2S50E-6TQ144C support hot-swap operation?

Yes, the XC2S50E-6TQ144C supports hot-swap per CompactPCI v2.2 specifications. Its I/O pins remain in high-impedance state before and during configuration, with no current path to VCCINT or VCCO, and immunity to latch-up-enabling safe insertion into powered backplanes without system disruption.

Can the XC2S50E-6TQ144C operate with mixed I/O voltage standards on the same device?

In the TQ144 package, all VCCO pins are internally interconnected, so only one I/O supply voltage (e.g., 3.3V) may be used. However, multiple input standards requiring different VREF voltages (e.g., SSTL3 and HSTL) can coexist across separate I/O banks, provided each bank's VREF is independently supplied per DS077-2 Table 4 and Table 5.

How many block RAM blocks does the XC2S50E-6TQ144C contain?

The XC2S50E-6TQ144C contains eight 4,096-bit true dual-port block RAMs, totaling 32,768 bits (32 Kbits). Each block supports independent read/write addresses on two ports, enabling simultaneous access for applications such as ping-pong buffering or FIFO implementation without external memory.

Is the XC2S50E-6TQ144C still in active production?

No-the XC2S50E-6TQ144C was discontinued per Xilinx Product Change Notice XCN12026 (2012), and DS077 v3.0 (2013) explicitly marks the Spartan-IIE family as obsolete. Aetrix Electronics supplies remaining authorized inventory with full traceability and supports lifecycle management for legacy program continuity.