AMD XC2S50E-6TQG144C

Overview

XC2S50E-6TQG144C from Xilinx is a 1.8V-core, 3.3V-I/O Spartan®-IIE Field-Programmable Gate Array with 1,728 logic cells, 384 Configurable Logic Blocks (CLBs), 24,576 bits of distributed RAM, and 32 Kbits of true dual-port block RAM. It features four Delay-Locked Loops (DLLs) for clock multiplication, phase shifting, and skew elimination, and supports up to 146 user I/O pins in the 144-pin TQFP package with Pb-free finish. It is used in cost-sensitive, high-volume embedded control and interface bridging applications requiring reprogrammable logic at sub-200 MHz system performance.

For engineers reviewing the XC2S50E-6TQG144C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing parameters, CLB switching characteristics, and hot-swap compatibility - all specific to the -6 speed grade, commercial temperature range (0°C to +85°C), and TQG144 package.

Technical Context

The XC2S50E-6TQG144C implements a regular array of CLBs surrounded by programmable IOBs, with two columns of 4K-bit block RAM placed between CLBs and IOBs. Its four corner-located DLLs provide deterministic clock deskew and support multiplication (×2–×4), division (/2–/8), and fine phase adjustment (±90° steps).

Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice; LUTs double as 16×1-bit synchronous RAM or combine into 16×2-bit/32×1-bit RAM. I/O banks are fixed per package: in TQG144, all eight VCCO pins are internally interconnected, permitting only one I/O voltage (e.g., 3.3V) across all banks, though independent VREF voltages are allowed per bank.

Key Specifications

Pinout & Package

The XC2S50E-6TQG144C is housed in a 144-pin Thin Quad Flat Package (TQFP) with Pb-free finish (G suffix), 0.5 mm pitch, and 20 mm × 20 mm body size. Pin functions follow Xilinx DS077-4 (v3.0) pin definitions, with I/O banks assigned per edge (Bank 0–7), four global clock inputs (GCLK0–GCLK3), and dedicated configuration pins (INIT, PROGRAM, DONE, CCLK, DIN, DOUT, M0–M2).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2S50E-6TQG144C, the XC3S50A-4VQG100C offers newer process technology and lower core voltage but sacrifices DLL precision for DCM-based clock management, while the XC2S50-6TQ144C provides identical functionality without RoHS compliance - making the E/G variant the only option for environmentally regulated deployments.

Availability

XC2S50E-6TQG144C is available at Aetrix Electronics and suitable for industrial motor control interfaces, legacy bus protocol bridges, CompactPCI hot-swap modules, low-cost video timing generators, and FPGA-based test instrumentation requiring stable component supply and long-term lifecycle support.

Supply support for XC2S50E-6TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures widely adopted in communications, aerospace, and industrial systems.

The Spartan-IIE family was designed for cost-sensitive, high-volume applications requiring reprogrammable logic with integrated clock management and memory - targeting industrial control, protocol bridging, and embedded interface consolidation.

FAQ

What is the maximum operating frequency of the XC2S50E-6TQG144C?

The XC2S50E-6TQG144C supports system clock rates beyond 200 MHz, with the -6 speed grade guaranteeing timing closure for designs meeting its specified DLL and CLB switching characteristics. Actual achievable frequency depends on design topology, routing congestion, and I/O standard selection - for example, LVTTL outputs achieve ≤125 MHz sustained toggle rate, while LVDS I/O supports >200 MHz differential signaling when properly terminated.

Does the XC2S50E-6TQG144C support hot-swap functionality?

Yes, the XC2S50E-6TQG144C supports hot-swap per CompactPCI v2.2 specifications. Its I/O pins remain high-impedance before and during configuration, and it is latch-up immune. This capability was added to all Spartan-IIE devices manufactured after PCN2002-05, and the XC2S50E-6TQG144C meets these requirements with verified IHSPO and IL leakage specs per DS077-3.

Can multiple I/O standards be used simultaneously on the XC2S50E-6TQG144C?

In the TQG144 package, only one VCCO voltage is permitted across all eight I/O banks due to internal interconnection - limiting simultaneous use to standards sharing that voltage (e.g., LVTTL, PCI, SSTL3). VREF may differ per bank, enabling mixed input thresholds, but output standards must match the single VCCO (e.g., 3.3 V). Mixing 2.5 V LVCMOS and 3.3 V LVTTL outputs is electrically prohibited in this package.

What configuration modes does the XC2S50E-6TQG144C support?

The XC2S50E-6TQG144C supports Master Serial, Slave Serial, Slave Parallel, and Boundary Scan (JTAG) configuration modes, selected via M0–M2 pins at power-up or PROGRAM_B assertion. Master Serial uses an external Platform Flash PROM; Slave Parallel allows fast loading from microcontroller GPIO; JTAG enables in-circuit debugging and partial reconfiguration without interrupting operation.

Is the XC2S50E-6TQG144C still in production?

No - the XC2S50E-6TQG144C was discontinued per Xilinx Change Notice XCN12026 (2012), and its datasheet was marked obsolete as of August 9, 2013. However, Aetrix Electronics maintains legacy inventory with full traceability, offering last-time-buy support, extended lifecycle coordination, and verified functional replacements for ongoing industrial deployments.