AMD XC2S600E-6FG456Q

Overview

XC2S600E-6FG456Q from Xilinx is a 0.15 µm, 1.8 V core Spartan®-IIE Field-Programmable Gate Array with 15,552 logic cells, 514 user I/Os, six columns of block RAM (288 Kbits total), and four Delay-Locked Loops (DLLs); it targets high-volume embedded control, industrial interface bridging, and legacy bus protocol adaptation in cost-sensitive applications.

For engineers reviewing the XC2S600E-6FG456Q datasheet, pinout, applications, or equivalent options, key selection criteria include its 456-ball Fine-Pitch BGA (FG456) package, -6 speed grade (max 200 MHz system clock), hot-swap I/O support, dual-voltage I/O banks (1.5/2.5/3.3 V), and IEEE 1149.1 boundary scan compliance.

Technical Context

The XC2S600E-6FG456Q implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its architecture includes six columns of 4K-bit true dual-port block RAM - more than any other Spartan-IIE device - and distributed RAM up to 221,184 bits via LUT-based memory.

Four corner-placed DLLs provide clock deskew, multiplication (×2–×4), division (÷2–÷8), and phase shifting across four low-skew global clock nets. I/O is organized into eight independent voltage banks supporting 19 standards including LVDS, SSTL, HSTL, PCI, and LVTTL, with hot-swap capability enabled by high-impedance pre-configuration states and latch-up immunity.

Key Specifications

Pinout & Package

XC2S600E-6FG456Q uses a 456-ball Fine-Pitch Ball Grid Array (FG456) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and eight independent I/O banks. Pin definitions follow Xilinx DS077-4 (v3.0), with dedicated global clocks (GCLK0–GCLK3), configuration pins (INIT_B, PROGRAM_B, DONE), JTAG boundary scan (TCK/TMS/TDI/TDO), and bank-specific VCCO/VREF pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC2S600E-6FG456Q, XCV300E-6PQ240C delivers higher clock rates and deeper memory but lacks hot-swap and increases BOM cost, while XC3S1000-4FG320C improves power efficiency and tooling but mandates layout changes and forfeits CompactPCI compatibility.

Availability

XC2S600E-6FG456Q is available at Aetrix Electronics and suitable for industrial protocol bridging, legacy bus interface adaptation, and high-speed data acquisition requiring stable component supply and long-term obsolescence management.

Supply support for XC2S600E-6FG456Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a U.S.-based semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and tools for reconfigurable computing.

The Spartan-IIE product line was designed for cost-sensitive, high-volume applications demanding ASIC-like performance with field-upgradable logic - particularly in industrial automation, test equipment, and communications infrastructure.

FAQ

What is the maximum operating frequency of the XC2S600E-6FG456Q?

The XC2S600E-6FG456Q has a -6 speed grade, meaning its guaranteed maximum system clock frequency is 200 MHz under recommended operating conditions. This applies to internal logic paths; actual achievable frequency depends on design complexity, placement, and routing. The four DLLs can multiply this clock up to 800 MHz for internal use, but output I/O timing remains constrained by the -6 grade's pin-to-pin delay specifications.

Does the XC2S600E-6FG456Q support hot-swap functionality?

Yes, the XC2S600E-6FG456Q explicitly supports hot-swap per the Spartan-IIE family specification. It features high-impedance I/Os before and during configuration, no current path from I/O pins to VCCINT/VCCO, and latch-up immunity - making it CompactPCI-friendly per PCI Bus v2.2. This capability is built-in and requires no external circuitry or configuration bitstream settings.

How many block RAM columns does the XC2S600E-6FG456Q have, and what is their capacity?

The XC2S600E-6FG456Q contains six columns of block RAM, the highest count in the Spartan-IIE family. Each column comprises multiple 4K-bit true dual-port RAM blocks, totaling 288 Kbits of dedicated on-chip memory. This enables large FIFOs, frame buffers, or lookup tables without external memory, and exceeds the four-column configuration of the XC2S400E.

What I/O voltage standards are supported by the XC2S600E-6FG456Q?

The XC2S600E-6FG456Q supports 19 I/O standards including LVTTL, LVCMOS (1.8/2.5/3.3 V), PCI, SSTL, HSTL, GTL, LVDS, and LVPECL. These are implemented across eight independent I/O banks, each with dedicated VCCO and VREF pins. Compatibility within a bank follows Table 4 in DS077-2: e.g., 3.3 V banks support PCI/LVTTL/SSTL3, while 2.5 V banks support SSTL2/LVCMOS2/LVDS.

Is the XC2S600E-6FG456Q still in production, and what is its lifecycle status?

The XC2S600E-6FG456Q was discontinued per Xilinx Change Notice XCN12026 (2012), and its datasheet DS077 was marked obsolete as of August 9, 2013. However, Aetrix Electronics maintains traceable inventory with full lot documentation and offers lifecycle coordination support, including last-time-buy planning and cross-reference guidance for migration paths.