AMD XC2S600E-6FGG456C

Overview

XC2S600E-6FGG456C from Xilinx is a second-generation Spartan-IIE Field-Programmable Gate Array with 15,552 logic cells, 600,000 system gates, six columns of block RAM (288 Kbits total), and four Delay-Locked Loops (DLLs) for clock domain control. It operates at 1.8 V core voltage and supports 3.3 V/2.5 V/1.5 V I/O banks, enabling PCI-compliant 66 MHz interfaces and LVDS differential signaling in industrial control and communications infrastructure.

For engineers reviewing the XC2S600E-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include its 456-ball Fine-Pitch BGA (FGG456) package, -6 speed grade (guaranteed 200+ MHz system performance), commercial temperature range (0°C to +85°C), and support for 19 I/O standards including LVTTL, LVCMOS, SSTL, HSTL, and LVDS.

Technical Context

The XC2S600E-6FGG456C implements a hierarchical architecture with 48 × 72 CLB array (3,456 CLBs), distributed RAM (221,184 bits via LUT-based 16×1/16×2/32×1 RAM), and six dedicated block RAM columns-more than any other Spartan-IIE device. Its four corner-placed DLLs provide zero-delay clock distribution, phase shifting, multiplication, and division across four low-skew global clock nets.

I/O functionality is organized into eight independent voltage banks, each supporting mixed signaling standards under shared VCCO (e.g., 3.3 V enables PCI/LVTTL/SSTL3/CTT). Hot-swap capability is built-in, allowing safe insertion into powered CompactPCI backplanes without latch-up risk or external protection circuitry.

Key Specifications

Pinout & Package

XC2S600E-6FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 0.8 mm ball pitch, 27 mm × 27 mm body size, and eight independent I/O banks. Each bank has dedicated VCCO and VREF pins; banks 0–7 are arranged per FPGA edge (two per side).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2S600E-6FGG456C, XCV300E-6FG456C delivers higher gate count and Virtex-class features at greater cost and power, while XC3S1000-4FGG456C provides modern tooling and scalability but replaces DLLs with DCMs-reducing deterministic jitter control for precision timing applications.

Availability

XC2S600E-6FGG456C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging acquisition, communications baseband processing, and test & measurement instrumentation requiring stable component supply and long-term obsolescence management.

Supply support for XC2S600E-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms.

The Spartan-IIE family was designed for cost-sensitive, high-volume applications demanding ASIC-like performance with field-upgradable flexibility-targeting industrial automation, telecom infrastructure, and medical equipment where rapid prototyping and design iteration are critical.

FAQ

What is the maximum operating frequency supported by XC2S600E-6FGG456C?

The XC2S600E-6FGG456C is rated for system performance beyond 200 MHz, with the -6 speed grade guaranteeing timing closure for designs meeting specified setup/hold constraints under commercial temperature and voltage conditions. Actual achievable frequency depends on logic depth, routing congestion, and clock domain architecture-but the four integrated DLLs enable reliable clock distribution at these rates.

Does XC2S600E-6FGG456C support hot-swap functionality?

Yes, XC2S600E-6FGG456C includes built-in hot-swap support per CompactPCI v2.2 compliance. Its I/O pins remain high-impedance before and during configuration, eliminating latch-up risk when inserted into a powered backplane. This feature is factory-integrated and requires no external circuitry or configuration bits to activate.

How many block RAM columns does XC2S600E-6FGG456C have, and what is their capacity?

XC2S600E-6FGG456C contains six columns of block RAM-more than any other Spartan-IIE device. Each column comprises multiple 4K-bit true dual-port RAM blocks totaling 288 Kbits, supporting simultaneous read/write operations for applications like video frame buffering and protocol stack memory.

What I/O standards are supported by XC2S600E-6FGG456C, and how are they configured?

XC2S600E-6FGG456C supports 19 I/O standards-including LVTTL, LVCMOS, SSTL, HSTL, CTT, AGP, GTL, LVDS, and LVPECL-configured per eight independent I/O banks. Each bank uses dedicated VCCO and VREF pins; standards sharing the same VCCO (e.g., 3.3 V for PCI/LVTTL/SSTL3) may be mixed within one bank.

Is XC2S600E-6FGG456C still in active production, and what is its obsolescence status?

XC2S600E-6FGG456C was discontinued per Xilinx Change Notice XCN12026 (2012), making it an obsolete part. However, Aetrix Electronics maintains verified legacy inventory with full traceability and offers lifecycle management services-including cross-reference support, last-time-buy coordination, and engineering consultation for migration paths.