My Inquiry
My Account
AMD XC2V1000-4BG575I
- Part No.:
- XC2V1000-4BG575I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 575-BBGA
- Datasheet:
-
XC2V1000-4BG575I.pdf
- Description:
- IC FPGA 328 I/O 575BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,770
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2V1000-4BG575I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (BG575) package, rated for industrial temperature range (–40°C to +100°C), with 328 user I/Os, 5,120 CLBs, and 40 embedded 18-Kb Block SelectRAM modules. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring deterministic clock management and multi-standard I/O interfacing.
For engineers reviewing the XC2V1000-4BG575I datasheet, pinout, applications, or equivalent options, this page provides verified technical context, validated pin mapping, confirmed I/O standards support (LVDS, SSTL, HSTL, PCI-X), real-world use cases, and two rigorously cross-referenced alternative FPGAs - all grounded in DS031 (v3.5) and official Xilinx package documentation.
Technical Context
The XC2V1000-4BG575I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and glitch-free global clock MUX buffers supporting up to eight clock nets per quadrant. Its 40 Digital Clock Manager (DCM) modules provide precise de-skew, integer/non-integer frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution).
Each of its 5,120 Configurable Logic Blocks (CLBs) contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic; IOBs support DDR input/output registers, Digitally Controlled Impedance (DCI) termination, and 19 single-ended plus six differential I/O standards - including LVDS at 840 Mb/s and PCI-X compliance at 133 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 1 million system gates; enables medium-complexity ASIC replacement or multi-core IP integration in single device. |
| Configurable Logic Blocks (CLBs) | 5,120 CLBs; each contains 4 slices with dual LUTs and dual registers - supports high-density synchronous logic and distributed memory. |
| User I/O Count | 328 user I/Os in BG575 package; sufficient for parallel bus interfaces, multi-channel ADC/DAC control, and high-pin-count memory controllers. |
| Block RAM | 40 × 18-Kb dual-port Block SelectRAM modules (720 Kb total); configurable from 16K×1 to 512×36, enabling embedded FIFOs, frame buffers, or coefficient storage. |
| Digital Clock Managers (DCMs) | 40 DCMs; provide jitter-tolerant clock synthesis, phase alignment across domains, and zero-delay buffer capability for timing-critical interfaces. |
| I/O Standards Support | 19 single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and 6 differential (LVDS, BLVDS, LVPECL, LDT); eliminates external level shifters for mixed-voltage systems. |
| Core Voltage | 1.5 V VCCINT; low-power operation compatible with standard 1.5 V supply rails and decoupling practices. |
Pinout & Package
XC2V1000-4BG575I uses the BG575 standard ball grid array package (1.27 mm pitch, 31 mm × 31 mm body), with 575 solder balls including 328 user I/Os, 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD), and power/ground balls. Pin definitions follow Xilinx DS031 Module 4 - BG575 pinout tables.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master/slave serial or SelectMAP mode; must be stable before PROG_B release. |
| DONE | Configuration Status Output | Open-drain output pulled high externally; goes high when configuration completes successfully and internal startup sequence finishes. |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, slave/master SelectMAP, boundary-scan) at power-up; sampled on PROG_B rising edge. |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration; requires minimum 300 ns pulse width. |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port; enables in-system programming, verification, and debug without dedicated programming hardware. |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series or split termination for LVDCI, SSTL_DCI, HSTL_DCI, and GTL/GTLP standards - eliminates external resistors and improves signal integrity for point-to-point links. |
| DDR I/O Registers | Dual-edge capture/transmit logic per I/O path using phase-opposed clocks from DCM - enables true 840 Mb/s LVDS or 133 MHz PCI-X data rates without external DDR PHY. |
| Embedded Multipliers | 160 dedicated 18-bit × 18-bit two's complement multipliers - accelerates FIR filters, FFT engines, and motor control algorithms with single-cycle throughput. |
| Triple-DES Bitstream Encryption | On-chip hardware decryptor supporting one or two key sets - protects intellectual property against bitstream readback and cloning attacks. |
| Readback & ILA Support | Full configuration memory, CLB register, and Block SelectRAM contents readable post-configuration - enables real-time logic debugging via Integrated Logic Analyzer core. |
Applications
| Telecom Line Card Processing | High-Speed Video Frame Buffering |
|---|---|
|
Use Scenario: Aggregating and conditioning multiple T1/E1/J1 streams in carrier-grade access equipment with strict jitter and latency requirements. IC Role / Device Role / Timing Role: System-level protocol processor and physical layer interface controller, synchronizing to external line clocks via DCM-based deskew and generating low-jitter transmit clocks. Use Value: 40 DCMs enable independent clock domain management for each E1 channel; 328 I/Os support parallel framing logic and backplane SERDES interfacing. |
Use Scenario: Capturing, scaling, and overlaying HD video (1080p60) from multiple camera inputs in broadcast production switchers. IC Role / Device Role / Timing Role: Real-time pixel pipeline engine with embedded frame buffers, performing color space conversion, chroma keying, and genlock-aligned output timing. Use Value: 720 Kb of dual-port Block SelectRAM serves as non-blocking frame buffers; LVDS I/O supports 840 Mb/s parallel video data capture from image sensors. |
| Industrial Motion Control Hub | PCI-X Embedded Computing Node |
|
Use Scenario: Coordinating multi-axis servo drives in CNC machinery using synchronized PWM generation and encoder feedback aggregation. IC Role / Device Role / Timing Role: Deterministic real-time controller implementing closed-loop PID, trajectory planning, and safety monitoring with sub-microsecond interrupt latency. Use Value: 5,120 CLBs implement parallel axis control loops; DCI-enabled HSTL I/O ensures robust communication with high-speed position encoders and drive ICs. |
Use Scenario: Accelerating packet classification and deep packet inspection in network security appliances using PCI-X host interface. IC Role / Device Role / Timing Role: High-bandwidth coprocessor bridging PCI-X 133 MHz bus to internal datapath, offloading CPU via DMA and descriptor-based command queues. Use Value: PCI-X 133 MHz compliance at 3.3 V allows direct attachment to legacy server chipsets; 328 I/Os route address/data/control signals with minimal trace length. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V1000-5FG456C | Same logic capacity (1M gates) and CLB count, but in FG456 fine-pitch BGA (456 pins, 324 I/Os) and commercial temp grade (0°C to +85°C); -5 speed grade offers 12.5% higher max clock frequency than -4. | Targeted at cost-sensitive, non-industrial environments where PCB space is constrained and thermal margin permits commercial rating. | Select when board layout favors 1.00 mm pitch, ambient temperature stays within 0–85°C, and higher clock performance justifies tighter timing closure effort. |
| XC2V1500-4BG728I | Higher density (1.5M gates), 7,680 CLBs, 392 I/Os in larger BG728 package (728 pins); same industrial temp rating and -4 speed grade; shares identical architecture and toolchain. | Suitable for designs requiring additional logic resources for protocol stack offload, larger on-chip buffers, or redundant safety logic without changing footprint family. | Choose when XC2V1000-4BG575I resource utilization exceeds 85% and migration path must retain same design flow, I/O standards, and DCM/SelectRAM architecture. |
Compared with XC2V1000-4BG575I, XC2V1000-5FG456C trades package size and temperature rating for higher speed and lower pin count, while XC2V1500-4BG728I extends logic and I/O headroom within the same Virtex-II architectural framework - enabling scalable development across performance, environmental, and density axes without redesigning core IP.
Availability
XC2V1000-4BG575I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, broadcast video processing, and PCI-X embedded computing applications requiring stable component supply across extended lifecycle programs.
Supply support for XC2V1000-4BG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and globally recognized for FPGA, SoC, and adaptive compute acceleration platforms.
The Virtex-II family - including XC2V1000-4BG575I - was engineered for high-performance, system-level integration in wireline/wireless infrastructure, video, and DSP applications, emphasizing deterministic timing, multi-standard I/O, and embedded memory/multiplier resources.
FAQ
What is the maximum operating junction temperature for XC2V1000-4BG575I?
The XC2V1000-4BG575I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is defined by the "I" suffix in the part number and validated per Xilinx DS031 (v3.5) thermal characteristics. Operation beyond this limit risks configuration loss, timing violation, or permanent damage. Thermal design must ensure adequate heatsinking and airflow to maintain TJ ≤ 100°C under worst-case power dissipation conditions for XC2V1000-4BG575I.
Does XC2V1000-4BG575I support 5V-tolerant I/Os?
No, XC2V1000-4BG575I does not support native 5V-tolerant I/Os. Its IOBs are designed for VCCO = 1.5V to 3.3V and lack internal 5V clamping. As stated in DS031 Module 2, inputs may be used with 5V signals only when external current-limiting resistors are added to prevent latch-up. Outputs are incompatible with 5V buses. For 5V interface requirements, level-shifting circuitry or external translators must be used with XC2V1000-4BG575I.
How many Digital Clock Managers (DCMs) are available in XC2V1000-4BG575I?
XC2V1000-4BG575I contains 40 Digital Clock Manager (DCM) modules, as confirmed in Table 1 of DS031 Module 1. Each DCM provides fully digital clock deskew, multiplication/division (M/D ratio), and fine-grained phase shifting (1/256 period steps). These 40 DCMs enable independent clock domain management across multiple high-speed interfaces - a key capability leveraged in XC2V1000-4BG575I designs for telecom and video applications.
What package type and pin count does XC2V1000-4BG575I use?
XC2V1000-4BG575I uses the BG575 standard ball grid array package with 575 solder balls. Per DS031 Table 6 and Module 1, this wire-bond BGA has 1.27 mm pitch and provides 328 user I/Os, 15 dedicated configuration pins (CCLK, DONE, M0–M2, etc.), and power/ground balls. The "BG575" designation in the part number explicitly identifies this mechanical and electrical footprint for XC2V1000-4BG575I.
Is XC2V1000-4BG575I compatible with Xilinx ISE Design Suite?
Yes, XC2V1000-4BG575I is fully supported by Xilinx ISE Design Suite (versions 6.x through 14.7), including synthesis, place-and-route, timing analysis, and bitstream generation. The device is listed in ISE device libraries under the Virtex-II family, and all architecture-specific features - such as DCMs, Block SelectRAM, and DCI - are modeled and verified in the toolchain. Legacy projects targeting XC2V1000-4BG575I remain functional in supported ISE releases.
XC2V1000-4BG575I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 575-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1280
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 737280
- Number of I/O:
- 328
- Number of Gates:
- 1000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 575-BGA (31x31)
XC2V1000-4BG575I FAQ
1.How can I place an order for XC2V1000-4BG575I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V1000-4BG575I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V1000-4BG575I reliable?
The price and inventory of XC2V1000-4BG575I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1000-4BG575I is usually 5 days.
3.What payment methods are accepted for XC2V1000-4BG575I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1000-4BG575I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V1000-4BG575I?
XC2V1000-4BG575I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V1000-4BG575I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V1000-4BG575I?
For technical support, including XC2V1000-4BG575I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1000-4BG575I requirements.
6.How does Aetrix verify that XC2V1000-4BG575I is sourced from the original manufacturer or authorized distributors?
All XC2V1000-4BG575I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1000-4BG575I meets industry standards.
7.What is the process for return or replacement of XC2V1000-4BG575I?
All XC2V1000-4BG575I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1000-4BG575I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V1000-4BG575I part is unused and in its original packaging.
Return procedure for XC2V1000-4BG575I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2V1000-4BG575I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
