AMD XC2V1000-4BGG575C

Overview

XC2V1000-4BGG575C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (1.27 mm pitch) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 5,120 Configurable Logic Blocks (CLBs), 40 Digital Clock Managers (DCMs), 40 18-Kb Block SelectRAM™ modules (totaling 720 Kb RAM), and supports up to 328 user I/Os. It is used in high-speed networking line cards requiring DDR SDRAM interfaces and LVDS-based backplane interconnects.

For engineers reviewing the XC2V1000-4BGG575C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (including LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource mapping, and real-world deployment context for telecom and video processing systems.

Technical Context

The XC2V1000-4BGG575C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and dedicated global clock networks - enabling predictable timing closure independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, fast carry chains, and horizontal cascade logic; each Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with three read-during-write modes and direct association to a dedicated 18×18 multiplier block.

Key Specifications

Pinout & Package

XC2V1000-4BGG575C uses a 575-ball standard BGA package (BGG575) with 1.27 mm pitch, 31 mm × 31 mm body size, and Pb-free construction. The package supports wire-bond interconnect and includes 15 dedicated configuration/control pins (e.g., CCLK, DONE, M0–M2, PROG_B, TCK/TMS/TDI/TDO) excluded from user I/O count.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1000-4BGG575C, the -5 speed grade offers measurable timing margin improvement without altering I/O count or memory resources, while the XC2V1500-4BGG575C delivers scalable logic capacity in the same BGG575 footprint - both alternatives maintain identical thermal profile and power delivery requirements.

Availability

XC2V1000-4BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial motion control, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2V1000-4BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, historically known for FPGA and SoC architectures enabling high-performance, customizable hardware acceleration.

The Virtex-II family was designed for high-bandwidth, low-latency applications in telecommunications, wireless infrastructure, and video processing - emphasizing I/O flexibility, embedded memory, and deterministic clock management.

FAQ

What is the maximum number of user I/Os supported by XC2V1000-4BGG575C?

XC2V1000-4BGG575C supports 328 user I/Os in the BGG575 package, as confirmed in Table 6 of DS031 Module 1. This count excludes 15 dedicated configuration and JTAG pins (CCLK, DONE, M0–M2, PROG_B, TCK/TMS/TDI/TDO, etc.) and VBATT. The I/Os are fully programmable for single-ended or differential signaling standards.

Does XC2V1000-4BGG575C support DDR memory interfaces?

Yes, XC2V1000-4BGG575C supports DDR SDRAM interfaces through its SelectIO™-Ultra I/O architecture. Its IOBs include built-in DDR input and output registers, and it supports SSTL2 and SSTL3 I/O standards required for DDR/DDR2 operation. The DCMs provide precise clock deskew and phase alignment essential for DDR timing closure.

What clock management resources does XC2V1000-4BGG575C include?

XC2V1000-4BGG575C includes 40 Digital Clock Manager (DCM) modules. Each DCM provides fully digital clock deskew, frequency synthesis (M/D ratio), coarse and fine phase shifting (down to 1/256 of clock period), and jitter reduction - eliminating need for external PLLs in most high-speed clock distribution scenarios.

Is XC2V1000-4BGG575C compatible with LVDS signaling?

Yes, XC2V1000-4BGG575C supports LVDS signaling at up to 840 Mb/s per differential pair, as specified in the Virtex-II SelectIO™-Ultra feature set. It implements LVDS_25 and LVDS_33 standards with current-mode drivers and supports termination via external 100 Ω resistors or on-chip DCI for compatible configurations.

What configuration modes are supported by XC2V1000-4BGG575C?

XC2V1000-4BGG575C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is SRAM-based and reprogrammable; bitstream encryption via Triple-DES is optional for IP protection.