AMD XC2V1000-4BGG575I

Overview

XC2V1000-4BGG575I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, rated for industrial temperature range (–40°C to +100°C), with 328 user I/Os, 5,120 CLBs, and eight Digital Clock Managers (DCMs). It implements high-speed logic, embedded memory, and DSP functions for telecom infrastructure, video processing, and network switching systems.

For engineers reviewing the XC2V1000-4BGG575I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DC/switching characteristics, and validated alternative FPGAs - all aligned to DS031 (v3.5) November 2007 specification.

Technical Context

The XC2V1000-4BGG575I integrates 5,120 Configurable Logic Blocks (CLBs), each containing four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and cascade logic. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

It includes 40 Block SelectRAM™ modules (18 Kb each, configurable as 16K×1 to 512×36), 160 dedicated 18×18 multipliers, and eight DCMs supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period). All I/Os support Digitally Controlled Impedance (DCI) for on-chip termination.

Key Specifications

Pinout & Package

XC2V1000-4BGG575I uses a Pb-free 575-ball standard BGA (BGG575) package with 1.27 mm pitch, 31 mm × 31 mm body size, and 408 total balls - of which 328 are user I/Os, plus dedicated configuration, clock, and supply pins. Control pins include CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, and RSVD.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC2V1000-4BGG575I, XC2V1000-5FG456C trades I/O count and industrial qualification for compactness and lower cost, while XC2V1500-4FF896I extends gate count and I/O bandwidth at the expense of larger package size and higher power - making each viable only within its specific system-level constraints.

Availability

XC2V1000-4BGG575I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging subsystems, and industrial network switches requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-4BGG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architectures for high-performance digital systems.

The Virtex-II family was designed for high-speed, high-density logic implementation in telecom, video, and networking applications - emphasizing I/O flexibility, embedded memory, and deterministic clock management.

FAQ

What is the maximum operating junction temperature for XC2V1000-4BGG575I?

The XC2V1000-4BGG575I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification ensures reliable operation in harsh environments such as base station cabinets or factory-floor controllers where ambient temperatures exceed commercial limits. Thermal design must maintain junction temperature below this threshold using appropriate heatsinking and airflow per Xilinx Application Note XAPP138.

Does XC2V1000-4BGG575I support DDR2 memory interfaces?

Yes, XC2V1000-4BGG575I supports DDR2 memory interfaces through its SelectIO-Ultra I/O banks configured for SSTL_18_I or SSTL_18_II standards, with programmable drive strength and on-die termination (via DCI). The device's DCMs generate precisely phased clocks required for DDR2 timing closure, and its 328 I/Os allow full-width 32-bit or 64-bit data buses with address/control signals.

How many global clock lines does XC2V1000-4BGG575I provide?

XC2V1000-4BGG575I provides 16 global clock lines - eight per quadrant - routed through dedicated low-skew networks. Each of the eight DCMs can drive up to four of these global clock multiplexer buffers, enabling hierarchical clock distribution with minimal skew across large logic regions and I/O banks.

Can XC2V1000-4BGG575I perform partial reconfiguration?

Yes, XC2V1000-4BGG575I supports partial reconfiguration as defined in the Virtex-II architecture. This allows dynamic replacement of logic modules without resetting the entire device - critical for adaptive signal processing or hot-swappable protocol stacks. Implementation requires Xilinx ISE 6.3i or later and adherence to frame-based bitstream partitioning rules in UG071.

What configuration modes are supported by XC2V1000-4BGG575I?

XC2V1000-4BGG575I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). These modes enable flexible integration with microcontrollers, flash memory, JTAG programmers, or host processors - with fast SelectMAP achieving up to 264 Mbps configuration rate using parallel bus interface.