AMD XC2V1000-4FF896I

Overview

XC2V1000-4FF896I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 1 million system gates, 5,120 Configurable Logic Blocks (CLBs), 40 embedded 18-Kb Block SelectRAM™ modules, 160 dedicated 18×18 multipliers, and 12 Digital Clock Managers (DCMs). It features 432 user I/Os in a flip-chip fine-pitch BGA package (FF896), supports LVDS, SSTL, HSTL, PCI-X, and DDR interfaces, and targets high-speed telecommunication, networking, and DSP systems.

For engineers reviewing the XC2V1000-4FF896I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (including DCI termination), DCM timing parameters, CLB resource mapping, and industrial-temperature (-40°C to +100°C) operation - all confirmed for the exact FF896 flip-chip variant.

Technical Context

The XC2V1000-4FF896I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with SRAM-based configuration, 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates IOBs with optional DDR registers, CLBs containing dual 4-input LUTs and flip-flops/latches, 18-Kb dual-port block RAM, and dedicated 18×18 multipliers tightly coupled to memory ports.

Routing uses Active Interconnect Technology with hierarchical segmented resources: 24 long lines per row/column, 120 hex lines, 40 double lines, and 16 direct-connect lines. Each of the 12 DCMs provides digital clock de-skew, M/D frequency synthesis, and ±1/256-cycle phase resolution - all fully self-calibrating without external components.

Key Specifications

Pinout & Package

XC2V1000-4FF896I is housed in a 31 mm × 31 mm flip-chip fine-pitch BGA package (FF896) with 896 balls, 432 user I/Os, and 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD). VBATT is reserved.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1000-4FF896I, the -5 speed grade delivers measurable timing margin gains without layout change, while XC2V1500-4FF896I expands logic capacity at the cost of board-level redesign - making the former a timing upgrade path and the latter a scalability option.

Availability

XC2V1000-4FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and high-reliability DSP applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XC2V1000-4FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and known for FPGA, adaptive SoC, and ACAP technologies serving aerospace, automotive, and communications markets.

The Virtex-II family was designed as a high-performance platform FPGA solution for system-level integration of IP cores, targeting wireline/wireless infrastructure, video processing, and high-end DSP - with emphasis on I/O flexibility, clock management, and embedded memory/multiplier resources.

FAQ

What is the maximum operating frequency of the XC2V1000-4FF896I internal logic?

The XC2V1000-4FF896I is rated for up to 420 MHz internal clock speed under industrial temperature conditions, as specified in DS031 Module 3. This applies to synchronous logic paths within the CLB array and is validated across the full -40°C to +100°C range. The actual achievable frequency depends on design placement, routing, and DCM configuration - but the -4 speed grade guarantees timing closure at this rate for typical utilization levels. XC2V1000-4FF896I performance is documented in the Virtex-II DC and Switching Characteristics module.

Does the XC2V1000-4FF896I support DDR2 SDRAM interfaces?

Yes, the XC2V1000-4FF896I supports DDR2 SDRAM through its SelectIO™-Ultra I/O banks with programmable drive strength, input delay tuning, and dedicated DDR input/output registers. It complies with JEDEC SSTL_18 Class II specifications and supports 2.5 V VCCO operation required for DDR2. The device's DCMs generate precisely phased clocks needed for source-synchronous DDR timing, and its 432 I/Os allow full-width data bus implementation. XC2V1000-4FF896I DDR2 compatibility is confirmed in DS031 Module 2.

How many configuration modes does the XC2V1000-4FF896I support?

The XC2V1000-4FF896I supports five distinct configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by the M0–M2 pins, and all modes use the same CCLK, DONE, and PROG_B signals. The device also supports partial reconfiguration and bitstream encryption via Triple-DES. These capabilities are fully documented for XC2V1000-4FF896I in DS031 Module 1 and Module 2.

Is the XC2V1000-4FF896I pin-compatible with other Virtex-II devices in FF896 packaging?

No, the XC2V1000-4FF896I is not pin-compatible with other Virtex-II devices in FF896 packaging. While FF896 is a shared package type across the Virtex-II family, Table 6 in DS031 confirms that only XC2V1000 and XC2V1500 are offered in FF896 - and their I/O counts differ (432 vs. 528). The ball map, power pin allocation, and I/O bank assignments are device-specific; therefore, XC2V1000-4FF896I cannot be substituted for XC2V1500-4FF896I without PCB revision. This applies specifically to XC2V1000-4FF896I.

What I/O standards with Digitally Controlled Impedance (DCI) are supported by the XC2V1000-4FF896I?

The XC2V1000-4FF896I supports DCI for LVCMOS (1.5 V, 1.8 V, 2.5 V, 3.3 V), SSTL (18_I, 18_II, 2_I, 2_II, 3_I, 3_II), HSTL (I–IV, including 18-V variants), GTL, GTLP, and LVDS/LVDSEXT standards - all confirmed in DS031 Module 2 Table 3. DCI provides on-die series or split termination, eliminating external resistors and improving signal integrity for point-to-point links. This capability is implemented per I/O bank and is fully functional across the industrial temperature range of XC2V1000-4FF896I.