AMD XC2V1000-4FFG896I

Overview

XC2V1000-4FFG896I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 1 million system gates, 5,120 CLBs, 40 18-Kb Block SelectRAM™ modules (720 Kbits total), 160 dedicated 18×18 multipliers, and 8 Digital Clock Managers (DCMs). It features 432 user I/Os in an 896-pin flip-chip fine-pitch BGA (FF896) package and supports LVDS, SSTL, HSTL, PCI-X, and DDR interfaces for telecom and networking systems.

For engineers reviewing the XC2V1000-4FFG896I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (including DCI termination), DCM timing parameters, CLB slice configuration, and package-specific routing constraints - all critical for high-speed synchronous design, partial reconfiguration, and bitstream encryption implementation.

Technical Context

The XC2V1000-4FFG896I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and 40 double lines - enabling predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-opposed clocks from integrated DCMs.

Each CLB contains four slices with dual 4-LUTs, two storage elements (DFF/latch), carry chains, and horizontal cascade logic; each Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with three read-during-write modes and direct association to a dedicated 18×18 multiplier for efficient DSP filtering.

Key Specifications

Pinout & Package

XC2V1000-4FFG896I uses the FF896 flip-chip fine-pitch BGA package (1.00 mm pitch, 31 mm × 31 mm body), optimized for thermal performance and high I/O count. It includes 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) excluded from user I/O count.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XC2V1000-4FFG896I, the XC2V1000-5FG456C trades I/O count and industrial reliability for lower cost and simpler assembly, while the XCVU3P-2FFVA2104I delivers architectural scalability and protocol integration at the expense of legacy toolchain compatibility and higher power consumption.

Availability

XC2V1000-4FFG896I is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed networking, video compression acceleration, and industrial motion control applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-4FFG896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding communications and computing applications.

The Virtex-II product line was engineered for telecom, wireless, and video systems requiring high gate density, embedded memory, dedicated arithmetic resources, and advanced clock management - delivering ASIC-like performance with FPGA flexibility.

FAQ

What is the maximum number of user I/Os supported by XC2V1000-4FFG896I?

The XC2V1000-4FFG896I supports 432 user I/Os in its FF896 flip-chip BGA package, as confirmed in Table 2 and Table 6 of DS031 Module 1. This exceeds the 328 I/Os available in wire-bond BG575 packages for the same XC2V1000 device, due to flip-chip interconnect density advantages. All 432 I/Os are fully programmable for single-ended or differential signaling standards.

Does XC2V1000-4FFG896I support on-chip termination for I/O standards?

Yes, XC2V1000-4FFG896I implements Digitally Controlled Impedance (DCI) for on-chip series or split termination across multiple I/O standards including LVDCI, HSTL_DCI, SSTL_DCI, GTL_DCI, and GTLP_DCI. This feature eliminates external termination resistors and improves signal integrity for high-speed interfaces like DDR and PCI-X, as detailed in DS031 Module 2 Table 3.

What clock management resources are integrated into XC2V1000-4FFG896I?

XC2V1000-4FFG896I integrates 8 Digital Clock Managers (DCMs), each providing precise clock de-skew, flexible M/D frequency synthesis, and high-resolution phase shifting in increments of 1/256 of the input clock period. These DCMs drive up to 16 global clock multiplexer buffers and support DDR I/O timing, as specified in DS031 Module 1 and Module 2.

Can XC2V1000-4FFG896I perform partial reconfiguration?

Yes, XC2V1000-4FFG896I supports partial reconfiguration, allowing dynamic swapping of functional modules without resetting the entire device. This capability is enabled by its SRAM-based configuration architecture and documented in DS031 Module 1 under "SRAM-Based In-System Configuration", making it suitable for adaptive radio protocols and runtime firmware updates.

What is the core voltage requirement for XC2V1000-4FFG896I?

XC2V1000-4FFG896I requires a 1.5 V ±3% core supply (VCCINT) per DS031 Module 3 Electrical Characteristics. It also mandates a dedicated 3.3 V auxiliary supply (VCCAUX) for configuration logic and I/O bank supplies (VCCO) scaled to selected I/O standards (e.g., 3.3 V for LVTTL, 1.8 V for LVCMOS18).