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AMD XC2V1000-4FG256I
- Part No.:
- XC2V1000-4FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2V1000-4FG256I.pdf
- Description:
- IC FPGA 172 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,204
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Product details
Overview
XC2V1000-4FG256I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FG256) package, rated for industrial temperature range (–40°C to +100°C), with 160 dedicated 18×18 multipliers, 40 Block SelectRAM™ modules (720 Kbits total), and 8 Digital Clock Managers (DCMs). It serves as a reconfigurable logic fabric for high-speed telecommunication line cards requiring PCI-X 133 MHz I/O and DDR memory interfacing.
For engineers reviewing the XC2V1000-4FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, confirmed I/O count (172 user I/Os), DCM timing parameters, DCI-compatible I/O standards, and validated alternatives for migration or second-sourcing in industrial embedded systems.
Technical Context
The XC2V1000-4FG256I implements a 0.15 µm/0.12 µm 8-layer metal CMOS architecture with 5,120 CLBs (each containing four slices), 16 global clock MUX buffers, and fourth-generation Active Interconnect routing. Its IOBs support dual-data-rate (DDR) registers per I/O path with 180° phase-shifted clocks generated by integrated DCMs.
It features Digitally Controlled Impedance (DCI) for on-die termination across LVCMOS, SSTL, HSTL, and GTL standards, and supports source-synchronous interfaces including LVDS (840 Mb/s), BLVDS, and LVPECL - all operating under 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 1 million system gates; enables complex protocol stacks (e.g., PCIe endpoint logic) within single device |
| User I/O Count | 172 pins; matches FG256 package footprint and supports full PCI-X 133 MHz bus (32-bit + parity) |
| Block RAM | 40 × 18-Kb dual-port SelectRAM™ blocks (720 Kbits); sufficient for 128×128 pixel frame buffer or FIR filter coefficient storage |
| Multiplier Blocks | 160 × 18-bit × 18-bit hard multipliers; enables real-time 16-channel QAM demodulator without LUT-based arithmetic |
| Digital Clock Managers | 8 × DCMs; each provides de-skewed clock outputs, ±1/256-cycle phase shift, and M/D frequency synthesis (e.g., 100 MHz → 125 MHz) |
| I/O Standards | 19 single-ended + 6 differential standards including LVDS, LVPECL, SSTL-2/3, HSTL-I/II, and PCI-X 133 MHz compliance at 3.3 V |
| DCI Support | On-chip series/split termination for LVCMOS, SSTL, HSTL, GTL; eliminates external resistors for impedance-matched DDR2 control signals |
Pinout & Package
XC2V1000-4FG256I uses the FG256 fine-pitch ball grid array package (1.00 mm pitch, 17 mm × 17 mm body), with 256 solder balls arranged in 16×16 array. Pin definitions follow Xilinx DS031 Module 4: Pinout Information - FG256/FGG256 package variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode; requires 0–50 MHz square wave |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream load; used for FPGA initialization sequencing |
| M0–M2 | Mode Selection Inputs | Set configuration mode (Slave Serial, Master Serial, Slave SelectMAP, etc.) at power-up; pulled high/low via external resistors |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts loading sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port; enables in-circuit programming and debug of internal logic states |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Port Block RAM | 720 Kbits distributed across 40 independent 18-Kb modules; supports simultaneous read/write at 200+ MHz for video line buffering |
| Digitally Controlled Impedance (DCI) | On-die series/split termination for 12 I/O standards; reduces PCB layer count by eliminating 50–75% of external termination resistors |
| DDR I/O Registers | Dedicated input/output DDR flip-flops per IOB; enables 400+ Mbps data capture without external DDR PHY IC |
| 18×18 Multiplier Blocks | 160 hard arithmetic units; achieves 3.2 GOPS at 200 MHz for real-time FFT processing in baseband modems |
| Digital Clock Manager (DCM) | 8 fully digital clock synthesizers with <±100 ps jitter; replaces external PLLs for clock domain crossing in multi-GHz serial links |
Applications
| Telecom Line Card | Industrial Motion Controller |
|---|---|
Use Scenario: High-density TDM over SONET/SDH framer with packet classification and traffic shaping. IC Role / Device Role / Timing Role: Reconfigurable logic fabric implementing HDLC controllers, CRC engines, and 10/100 Ethernet MACs with precise 8 kHz frame timing. Use Value: 172 I/Os support full E1/T1 interface (32 channels × 2.048 Mbps) plus management bus; DCMs lock to network reference clock with sub-nanosecond skew. | Use Scenario: Closed-loop servo drive with real-time position interpolation and field-oriented control (FOC). IC Role / Device Role / Timing Role: Real-time motor control processor executing PWM generation, ADC sampling synchronization, and PID loop closure at 20 kHz. Use Value: 160 multipliers enable simultaneous 16-axis FOC calculations; DCI ensures clean 50 MHz encoder signal integrity across 20 cm PCB traces. |
| Video Processing Engine | Test Equipment Platform |
Use Scenario: HD-SDI video scaler with chroma keying, color space conversion, and frame rate adaptation. IC Role / Device Role / Timing Role: Pixel-processing pipeline with dual-port RAM-based line buffers, 18×18 multipliers for YUV→RGB matrix math, and LVDS transmitter for panel interface. Use Value: 720 Kbits block RAM stores two full HD lines (1920×2 pixels × 24 bits); LVDS I/O drives 1.485 Gbps serial video link with <1 UI jitter. | Use Scenario: Modular ATE system with programmable pattern generator, high-speed digitizer, and DUT power sequencing. IC Role / Device Role / Timing Role: System-on-module controller managing JTAG chain, voltage rail sequencing, and 100 MHz digital stimulus waveform generation. Use Value: 8 DCMs generate synchronized clocks for stimulus (100 MHz), capture (100 MHz), and DUT power control (10 kHz PWM); PCI-X interface enables host PC communication at 1.06 GB/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic fabric applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V1000-5FG256I | Same architecture and package, but -5 speed grade (25% higher max clock frequency than -4) | Required for designs needing >200 MHz internal logic timing or >133 MHz PCI-X timing margin | Select when timing closure fails on XC2V1000-4FG256I due to critical path delays |
| XCVU9P-L2FLGA2104E | Virtex UltraScale+ device: 1.1M logic cells, 48.5 Mb BRAM, 600+ DSP slices, 25 Gb/s transceivers | Supports PCIe Gen4, DDR4, and 100G Ethernet - not drop-in compatible due to pinout, voltage, and toolchain differences | Choose for new designs requiring >10× logic density, hardened IP, or SerDes; requires full RTL and PCB redesign |
Compared with XC2V1000-5FG256I, the XC2V1000-4FG256I trades 25% lower timing margin for lower power consumption and cost; versus XCVU9P-L2FLGA2104E, it offers proven industrial reliability and legacy toolchain support but lacks transceivers and hardened memory controllers.
Availability
XC2V1000-4FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, broadcast video equipment, and automated test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC2V1000-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance reconfigurable computing in communications and aerospace.
The Virtex-II product line was engineered for wireline/wireless infrastructure and video processing systems demanding high I/O bandwidth, deterministic clocking, and large embedded memory - directly enabling the XC2V1000-4FG256I's role in PCI-X and DDR2 subsystems.
FAQ
What is the maximum number of user I/Os supported by XC2V1000-4FG256I?
The XC2V1000-4FG256I supports 172 user I/O pins in the FG256 package, as confirmed in Table 6 of Xilinx DS031 v3.5. This count excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The value is fixed for the FG256 footprint and applies to all XC2V1000 speed grades in that package.
Does XC2V1000-4FG256I support DDR2 memory interfaces?
Yes, XC2V1000-4FG256I supports DDR2 memory interfaces through its SelectIO-Ultra I/O banks with programmable VCCO and built-in DDR input/output registers. It complies with SSTL_18_I/II standards and supports 200–400 Mbps data rates per pin. External termination and board layout must meet JEDEC DDR2 specifications, but no external PHY is required.
What clocking resources are available on XC2V1000-4FG256I?
XC2V1000-4FG256I integrates 8 Digital Clock Managers (DCMs), each providing de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (±1/256 cycle). It also includes 16 global clock multiplexer buffers, with up to eight clock nets per quadrant. These resources enable synchronous multi-domain designs such as PCI-X + DDR2 + LVDS video clocking from a single 100 MHz reference.
Is XC2V1000-4FG256I RoHS compliant?
Yes, XC2V1000-4FG256I is RoHS compliant and available in Pb-free packaging. Per Xilinx documentation, the FGG256 variant denotes the Pb-free version of the FG256 package. The "I" suffix indicates industrial temperature grade (–40°C to +100°C), which includes full RoHS compliance per EU Directive 2011/65/EU.
Can XC2V1000-4FG256I be configured via JTAG only?
Yes, XC2V1000-4FG256I supports IEEE 1149.1 JTAG boundary-scan configuration (IEEE 1532 mode), allowing full bitstream loading, verification, and readback without external configuration PROMs. However, JTAG is typically used for development and debugging; production systems often use Master SelectMAP mode with external flash for faster startup and security.
XC2V1000-4FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1280
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 737280
- Number of I/O:
- 172
- Number of Gates:
- 1000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2V1000-4FG256I FAQ
1.How can I place an order for XC2V1000-4FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V1000-4FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V1000-4FG256I reliable?
The price and inventory of XC2V1000-4FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1000-4FG256I is usually 5 days.
3.What payment methods are accepted for XC2V1000-4FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1000-4FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V1000-4FG256I?
XC2V1000-4FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V1000-4FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V1000-4FG256I?
For technical support, including XC2V1000-4FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1000-4FG256I requirements.
6.How does Aetrix verify that XC2V1000-4FG256I is sourced from the original manufacturer or authorized distributors?
All XC2V1000-4FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1000-4FG256I meets industry standards.
7.What is the process for return or replacement of XC2V1000-4FG256I?
All XC2V1000-4FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1000-4FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V1000-4FG256I part is unused and in its original packaging.
Return procedure for XC2V1000-4FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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