AMD XC2V1000-4FG456I

Overview

XC2V1000-4FG456I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FG456) package, rated for industrial temperature range (–40°C to +100°C), with 328 user I/Os, 160 dedicated 18×18 multipliers, and eight Digital Clock Managers (DCMs). It serves as a reprogrammable logic fabric for high-speed telecommunication, networking, and DSP systems requiring PCI, LVDS, and DDR interfaces.

For engineers reviewing the XC2V1000-4FG456I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, SelectRAM memory configurations, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V1000-4FG456I implements a SRAM-based, 0.15 µm/0.12 µm 8-layer metal FPGA architecture with Configurable Logic Blocks (CLBs), 18-Kb Block SelectRAM™, and Digitally Controlled Impedance (DCI) I/O. Its 40×32 CLB array delivers 5,120 slices, each with dual 4-input LUTs, dual flip-flops, carry chains, and horizontal cascading.

It integrates eight independent DCM modules supporting precise clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution), alongside 16 global clock multiplexer buffers and Active Interconnect routing with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2V1000-4FG456I uses the FG456 (Fine-Pitch BGA, 1.00 mm pitch, 23 mm × 23 mm) wire-bond package with 456 balls. Pin definitions follow Xilinx DS031 Module 4, including 328 user I/Os, 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD), and power/ground distribution optimized for signal integrity and thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1000-4FG456I, the -5 speed grade offers tighter timing margins without layout changes, while the Virtex UltraScale+ XCVU9P enables architectural upgrades but demands complete hardware and toolchain revision.

Availability

XC2V1000-4FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, medical electronics, and test instrumentation requiring stable component supply over extended product lifecycles.

Supply support for XC2V1000-4FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance, SRAM-based FPGAs for demanding system-level applications.

The Virtex-II product line was designed for high-speed, high-density logic implementation in telecommunications, networking, and DSP systems, emphasizing clock management, memory hierarchy, and I/O flexibility.

FAQ

What is the maximum operating temperature range for XC2V1000-4FG456I?

The XC2V1000-4FG456I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is confirmed in DS031 Module 1, Figure 2 (Ordering Example), where the "I" suffix explicitly denotes the industrial grade. The device's 1.5V core supply (VCCINT) and 3.3V auxiliary supply (VCCAUX) are validated across this full range, and thermal derating curves are provided in Module 3's DC characteristics section.

Does XC2V1000-4FG456I support LVDS I/O natively?

Yes, XC2V1000-4FG456I supports LVDS I/O natively through its SelectIO-Ultra technology. As documented in DS031 Module 2, Table 2, it implements LVDS_33 and LVDS_25 standards with differential output voltage (VOD) of 0.25–0.40 V and on-die termination compatibility. Each LVDS pair uses two adjacent I/O pads and connects to the same switch matrix, enabling 840 Mb/s operation without external biasing or termination components.

How many block RAM resources does XC2V1000-4FG456I provide?

XC2V1000-4FG456I provides 432 Kb of block RAM, implemented as 40 × 18-Kb dual-port SelectRAM™ modules. Per DS031 Module 1, Table 1, this allows flexible configurations from 16K × 1-bit to 512 × 36-bit per block, with independent synchronous read/write ports and three "read-during-write" modes. These blocks are fully cascaded and accessible via four switch matrices for high-bandwidth dataflow.

Is XC2V1000-4FG456I pin-compatible with other Virtex-II devices in FG456 packaging?

Yes, all Virtex-II devices offered in the FG456/FGG456 package are pinout compatible, as stated in DS031 Module 1, Table 6 Notes. This includes XC2V500-4FG456I, XC2V1000-4FG456I, and XC2V1500-4FG456I. Shared footprint enables hardware reuse across density tiers, though I/O count varies: XC2V500 supports 264 user I/Os, XC2V1000 supports 328, and XC2V1500 supports 392 - all within the same 456-ball grid.

What configuration modes are supported by XC2V1000-4FG456I?

XC2V1000-4FG456I supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. These are detailed in DS031 Module 1, "Configuration" section. Mode selection is controlled by M0–M2 pins at power-up, and the device includes an on-chip DES decryptor for bitstream encryption, supporting secure field updates and IP protection.