AMD XC2V1000-4FGG256C

Overview

XC2V1000-4FGG256C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FGG256) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 5,120 Configurable Logic Blocks (CLBs), 40 Digital Clock Managers (DCMs), 40 Block SelectRAM™ modules (18 Kb each), and supports LVDS, SSTL, HSTL, and PCI-X I/O standards for high-speed interface design in telecom and DSP systems.

For engineers reviewing the XC2V1000-4FGG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability per package, DCM timing parameters, CLB resource count, and confirmed wire-bond BGA footprint compatibility - all essential for FPGA selection, PCB layout, and clock domain planning.

Technical Context

The XC2V1000-4FGG256C implements Xilinx's IP-Immersion architecture with a 0.15 µm / 0.12 µm 8-layer metal CMOS process, 1.5 V core supply (VCCINT), and dedicated 3.3 V auxiliary (VCCAUX) and I/O (VCCO) supplies. Its routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) for on-chip termination. The device includes 160 dedicated 18×18 multipliers and up to 432 user I/Os in FGG256 packaging - though actual usable I/O count is 172 due to package constraints and control pin allocation.

Key Specifications

Pinout & Package

XC2V1000-4FGG256C uses a 256-ball fine-pitch ball grid array (FGG256) package with 1.00 mm pitch, Pb-free wire-bond construction, and standard BGA footprint compatible with FG256/FGG256 family devices. Pin definitions follow Xilinx DS031 Module 4, with 172 user I/Os distributed across four quadrants and 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Compared with XC2V1000-4FGG256C, the -5 speed grade offers margin for timing-critical paths without changing layout, while XC2V1500-4FGG456C provides scalable logic density at the cost of package migration and increased power consumption.

Availability

XC2V1000-4FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial data acquisition, and embedded video processing applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XC2V1000-4FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-II family - including XC2V1000-4FGG256C - was designed for high-density, high-speed applications in telecommunications, wireless infrastructure, networking, video, and DSP, emphasizing I/O flexibility, clock management, and embedded memory.

FAQ

What is the maximum number of user I/Os supported by XC2V1000-4FGG256C?

XC2V1000-4FGG256C supports 172 user I/Os in the FGG256 package. This figure excludes 15 dedicated configuration and JTAG pins (CCLK, DONE, M0–M2, PROG_B, etc.) and reflects the maximum routable I/O count defined in Xilinx DS031 Table 4 and Table 6 for wire-bond FG/FGG256 packages.

Does XC2V1000-4FGG256C support LVDS signaling?

Yes, XC2V1000-4FGG256C supports LVDS signaling through its SelectIO™-Ultra I/O blocks. It delivers 840 Mb/s LVDS performance with current-mode drivers and supports both standard LVDS_33/LVDS_25 and extended variants (LVDSEXT), as documented in DS031 Module 2.

What clock management resources does XC2V1000-4FGG256C include?

XC2V1000-4FGG256C includes 40 Digital Clock Manager (DCM) modules. Each DCM provides de-skew, frequency synthesis (M/D ratio), coarse/fine phase shifting (down to ±1/256 cycle), and jitter reduction - critical for synchronizing multiple I/O banks and internal logic domains.

Is XC2V1000-4FGG256C pin-compatible with other Virtex-II FGG256 devices?

Yes, all Virtex-II devices in the FGG256 package - including XC2V500-4FGG256C, XC2V1000-4FGG256C, and XC2V1000-5FGG256C - share identical pinouts and footprint. This allows direct substitution within the same package family without PCB changes, provided timing and resource requirements are met.

What is the core voltage requirement for XC2V1000-4FGG256C?

XC2V1000-4FGG256C requires a 1.5 V ±3% core supply (VCCINT) for the FPGA logic fabric. It also mandates a dedicated 3.3 V auxiliary supply (VCCAUX) and programmable I/O supply voltages (VCCO) ranging from 1.5 V to 3.3 V depending on selected I/O standard.