AMD XC2V1000-4FGG256I

Overview

XC2V1000-4FGG256I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, rated for industrial temperature range (–40°C to +100°C), with 160 dedicated 18×18 multipliers, 40 Block SelectRAM™ modules (720 Kbits total), and 8 Digital Clock Managers (DCMs). It serves as a high-density reprogrammable logic fabric for telecom line cards requiring PCI-X 133 MHz I/O and DDR2 memory interface co-processing.

For engineers reviewing the XC2V1000-4FGG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its 328-user-I/O count in FGG256 packaging, -4 speed grade timing (max internal clock 420 MHz), dual-port 18-Kb RAM block configurability, DCI-enabled on-die termination for HSTL/SSTL interfaces, and IEEE 1149.1 boundary-scan compliance for production testability.

Technical Context

The XC2V1000-4FGG256I implements a segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its 5,120 CLBs each contain four slices with dual 4-LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic - enabling efficient arithmetic and wide-function synthesis.

Digital Clock Manager (DCM) blocks provide fully digital, self-calibrating clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution). Each DCM drives up to four global clock MUX buffers, supporting glitch-free clock switching and 90°/180°/270° phase-shifted outputs for source-synchronous DDR signaling.

Key Specifications

Pinout & Package

XC2V1000-4FGG256I uses a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.00 mm pitch, Pb-free construction, and 17 mm × 17 mm body size. The package supports wire-bond interconnect and provides 328 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density programmable logic applications.

Compared with XC2V1000-4FGG256I, the -5 variant offers improved timing margin for legacy 133 MHz PCI-X systems under worst-case voltage/temperature, while the XCVU3P targets next-generation infrastructure where hardened transceivers and DDR4 memory controllers outweigh legacy compatibility requirements.

Availability

XC2V1000-4FGG256I is available at Aetrix Electronics and suitable for telecom infrastructure, wireless baseband processing, broadcast video equipment, and industrial motion control systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-4FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance, system-level integration.

The Virtex-II family was designed for high-speed, high-density applications in telecommunications, networking, and DSP - delivering platform-level features like DCMs, SelectIO-Ultra, and SelectRAM hierarchy before industry-standardization of those capabilities.

FAQ

What is the maximum operating junction temperature for XC2V1000-4FGG256I?

The XC2V1000-4FGG256I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is guaranteed under continuous operation with proper thermal management - including adequate PCB copper pour, heatsinking if required, and airflow per Xilinx Thermal Management Guidelines for Virtex-II devices. The 'I' suffix explicitly denotes this industrial rating.

Does XC2V1000-4FGG256I support 5V-tolerant I/Os?

No, XC2V1000-4FGG256I does not support native 5V-tolerant I/Os. Its IOBs are designed for 1.5V–3.3V standards only. As inputs, they can interface with 5V logic only when external current-limiting resistors are used per Xilinx Tech Topic "5V Tolerant I/Os"; as outputs, they are incompatible with 5V buses. The device requires VCCO matching the target I/O standard voltage (e.g., 3.3V for LVTTL).

How many Digital Clock Managers (DCMs) are available in XC2V1000-4FGG256I?

XC2V1000-4FGG256I contains eight Digital Clock Managers (DCMs). Each DCM provides fully digital clock de-skew, frequency synthesis (M/D ratio), coarse and fine phase shifting, and jitter reduction - enabling precise clock domain crossing and source-synchronous interface timing for protocols like DDR SDRAM and PCI-X.

What configuration modes does XC2V1000-4FGG256I support?

XC2V1000-4FGG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is SRAM-based and in-system reprogrammable. The device also supports bitstream encryption using Triple-DES keys and readback for verification and debugging.

Is XC2V1000-4FGG256I pin-compatible with other Virtex-II devices in the FGG256 package?

Yes, all Virtex-II devices offered in the FGG256 package - including XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 - share identical pinouts and footprint. This allows hardware reuse across density points during design iteration or cost optimization, provided I/O banking constraints and power delivery are verified per device-specific electrical characteristics.