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AMD XC2V1000-4FGG456I
- Part No.:
- XC2V1000-4FGG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2V1000-4FGG456I.pdf
- Description:
- IC FPGA 324 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,288
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Product details
Overview
XC2V1000-4FGG456I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG456) package, rated for industrial temperature range (–40°C to +100°C), with 328 user I/Os, 160 dedicated 18×18 multipliers, and eight Digital Clock Managers (DCMs). It serves as a high-performance reconfigurable logic fabric for telecom infrastructure, video processing, and DDR-based memory interface designs.
For engineers reviewing the XC2V1000-4FGG456I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DC/switching characteristics, and validated alternative FPGAs - all grounded in DS031 (v3.5) November 2007 specification data.
Technical Context
The XC2V1000-4FGG456I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 40×32 CLB array (5,120 slices), each containing dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascading logic. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.
It integrates 40 Block SelectRAM™ modules (18 Kb dual-port RAM each, totaling 720 Kb), 160 dedicated 18×18 multipliers, and eight DCMs supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution). All I/Os support Digitally Controlled Impedance (DCI) for on-chip termination across 19 single-ended and 6 differential standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1 million - defines logic capacity for complex RTL synthesis and IP integration |
| User I/O Count | 328 - maximum routable signal pins in FGG456 package, excluding 15 control pins |
| CLB Slices | 5,120 - base unit for combinatorial logic and registered functions; each contains two LUTs and two storage elements |
| Block RAM | 40 × 18 Kb dual-port blocks (720 Kb total) - supports synchronous read-during-write and cascading for large FIFOs or buffers |
| Multiplier Blocks | 160 × 18-bit × 18-bit - enables high-throughput DSP operations without LUT resource consumption |
| Digital Clock Managers | 8 × DCM - provides fully digital clock de-skew, multiplication/division, and ±180° phase shift for timing-critical interfaces |
| I/O Standards | LVTTL, LVCMOS (1.5V–3.3V), SSTL, HSTL, PCI-X (133 MHz), LVDS (840 Mb/s) - ensures interoperability with DDR SDRAM, QDR SRAM, and serial backplanes |
Pinout & Package
XC2V1000-4FGG456I uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.00 mm pitch, Pb-free construction, and wire-bond interconnect. The package supports 328 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master/slave serial or SelectMAP mode; requires stable 0–100 MHz clock |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream loading and initialization completion |
| M0–M2 | Mode Selection Inputs | Three-pin binary encoding selects one of five configuration modes (slave-serial, master-serial, slave/master SelectMAP, JTAG) |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port enabling in-system programming, verification, and debug |
| VCCINT | Core Power Supply | 1.5 V ±3% supply for CLBs, RAM, and multipliers; decoupling critical for signal integrity and timing closure |
| VCCAUX | Auxiliary Power Supply | 3.3 V ±5% supply powering DCMs, IOBs, and configuration logic; shared across all I/O banks |
| VCCO | I/O Output Driver Supply | Bank-specific voltage (1.5V–3.3V) setting output swing and drive strength; must match IOSTANDARD attribute |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO-Ultra I/O Architecture | Supports 19 single-ended and 6 differential standards (LVDS, BLVDS, LVPECL, LDT) with programmable drive strength (2–24 mA) and on-die termination via DCI |
| Dual-Port Block SelectRAM | 40 × 18 Kb RAM blocks configurable from 16K×1 to 512×36, with three read-during-write modes and cascading capability for >1 Mb embedded memory |
| Digital Clock Manager (DCM) | Eight fully digital DCMs offering jitter-free clock multiplication/division, precise phase alignment (±1/256 period), and automatic input-to-output de-skew compensation |
| Active Interconnect Routing | Predictable, low-skew interconnect with 24 long lines per row/column and hierarchical switch matrices - enables timing closure at >420 MHz internal clock speeds |
| SRAM-Based In-System Configuration | Fast SelectMAP parallel configuration (up to 100+ Mb/s), IEEE 1532 compliance, partial reconfiguration, and Triple-DES bitstream encryption for IP protection |
Applications
| Telecom Line Cards | Video Frame Processing |
|---|---|
|
Use Scenario: High-speed packet forwarding and protocol translation in OC-192/STM-64 line cards with multiple SerDes lanes and DDR2 memory buffers. IC Role / Device Role / Timing Role: Reconfigurable logic fabric implementing MAC, framer, and traffic management engines with synchronized DDR2 controller and LVDS backplane I/O. Use Value: 328 user I/Os enable full-width DDR2 x72 interface plus 16-lane LVDS SerDes; eight DCMs ensure sub-nanosecond clock alignment across memory and serial domains. |
Use Scenario: Real-time 1080p60 video scaling, color space conversion, and overlay compositing in broadcast encoders and medical imaging systems. IC Role / Device Role / Timing Role: Programmable pixel pipeline engine with dual-port block RAM for line buffers and 160 multipliers for 2D FIR filtering and motion estimation. Use Value: 720 Kb embedded RAM eliminates external frame buffers; 18×18 multipliers execute 16-tap filters in single cycle; LVDS I/O drives panel timing controllers at 840 Mb/s. |
| PCI-X Host Adapters | Industrial Motion Control |
|
Use Scenario: High-bandwidth data acquisition and real-time DMA engines for PCIe-to-PCI-X bridge cards in test equipment and server add-in modules. IC Role / Device Role / Timing Role: PCI-X 133 MHz compliant interface logic with 64-bit address/data multiplexing, burst arbitration, and integrated DMA controller. Use Value: Native PCI-X 133 MHz support at 3.3 V; 19 I/O standards include PCI-X and PCI 66/33; DCMs generate precise 133.33 MHz clock with <100 ps jitter. |
Use Scenario: Multi-axis servo drive coordination with synchronized PWM generation, encoder feedback decoding, and safety monitoring in CNC machines. IC Role / Device Role / Timing Role: Deterministic real-time controller implementing PID loops, quadrature decoder, and isolated gate driver timing with nanosecond-level PWM edge placement. Use Value: 5,120 CLB slices provide >100 concurrent PID channels; DCM phase-shift capability aligns PWM edges across axes; HSTL I/O interfaces with absolute encoders at 200 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V1000-5FGG456I | Higher speed grade (–5 vs –4): guarantees 12% faster internal timing (e.g., 420 MHz vs ~375 MHz max clock), tighter setup/hold margins | Suitable for designs requiring higher fMAX or margin-critical DDR2/PCI-X timing closure | Select when timing closure fails at –4 grade or when future-proofing for higher-frequency derivatives |
| XC3S1000-4FGG456C | Spartan-3 generation; lower density (1M logic cells vs 1M system gates), no DCMs (only DLL), no DCI, 256 user I/Os, commercial temp only | Cost-sensitive, non-precision timing applications (e.g., simple glue logic, basic video pipelines) | Choose only if design fits Spartan-3 resources and does not require DCM-based clock synthesis or DCI termination |
Compared with XC2V1000-4FGG456I, the –5 speed grade offers guaranteed higher performance for timing-critical paths, while the XC3S1000-4FGG456C trades clock management, I/O flexibility, and industrial rating for lower cost and power - making it unsuitable as a drop-in replacement but viable for simplified logic-only roles.
Availability
XC2V1000-4FGG456I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video systems, industrial motion control, and PCI-X host adapter designs requiring stable component supply across extended lifecycle programs.
Supply support for XC2V1000-4FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering FPGA and adaptive computing solutions provider, acquired by AMD in 2022, with foundational IP in reconfigurable logic, high-speed I/O, and clock management architectures.
The Virtex-II family was engineered for high-performance, high-density system-on-chip implementations in telecom, networking, and video - delivering scalable logic, memory, and DSP resources with deterministic timing and industrial-grade reliability.
FAQ
What is the maximum operating junction temperature for XC2V1000-4FGG456I?
The XC2V1000-4FGG456I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is defined by its "I" suffix and validated under DS031 (v3.5) thermal derating curves. Operation beyond this limit risks configuration loss, timing violation, or permanent damage. Thermal design must ensure adequate PCB copper pour, airflow, and heatsinking to maintain Tj ≤ 100°C under worst-case power dissipation.
Does XC2V1000-4FGG456I support DDR2 SDRAM interfaces?
Yes, XC2V1000-4FGG456I supports DDR2 SDRAM interfaces through its SelectIO-Ultra I/O banks configured for SSTL_18_I or SSTL_18_II standards, combined with DCM-generated source-synchronous clocks and IDELAY/ODELAY primitives (available in later toolchains). The device's 328 user I/Os allow full x64 or x72 data bus widths, and its eight DCMs enable precise phase alignment between command/address and data strobes - meeting JEDEC DDR2 timing requirements up to 400 MT/s.
Can XC2V1000-4FGG456I be configured via JTAG only, without external configuration PROM?
Yes, XC2V1000-4FGG456I supports IEEE 1532 boundary-scan configuration mode, allowing full bitstream loading and verification through the JTAG TAP (TCK/TMS/TDI/TDO) without external PROM. This mode is used for prototyping, debugging, and field updates. However, for production boot-up, external PROM or processor-controlled SelectMAP is required unless a persistent configuration source is implemented - JTAG alone does not retain configuration after power cycle.
What is the role of VCCAUX in XC2V1000-4FGG456I, and what happens if it is unpowered?
VCCAUX supplies 3.3 V to the XC2V1000-4FGG456I's Digital Clock Managers (DCMs), Input/Output Blocks (IOBs), configuration logic, and JTAG circuitry. If VCCAUX is unpowered while VCCINT is active, the device will fail to configure, DCMs will not lock, I/Os will be tristated or undefined, and JTAG communication will be impossible. DS031 specifies that VCCAUX must be powered within ±5% of 3.3 V and ramped before or simultaneously with VCCINT to ensure reliable startup.
How many Block SelectRAM modules does XC2V1000-4FGG456I contain, and what are their addressing capabilities?
XC2V1000-4FGG456I contains 40 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. Each block supports configurable depths and widths including 16K×1, 8K×2, 4K×4, 2K×9, 1K×18, and 512×36. Both ports operate synchronously and independently, with three read-during-write modes (WRITE_FIRST, READ_FIRST, NO_CHANGE) - enabling efficient FIFO, dual-ported buffer, and coefficient table implementations without external memory.
XC2V1000-4FGG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1280
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 737280
- Number of I/O:
- 324
- Number of Gates:
- 1000000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2V1000-4FGG456I FAQ
1.How can I place an order for XC2V1000-4FGG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V1000-4FGG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V1000-4FGG456I reliable?
The price and inventory of XC2V1000-4FGG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1000-4FGG456I is usually 5 days.
3.What payment methods are accepted for XC2V1000-4FGG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1000-4FGG456I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V1000-4FGG456I?
XC2V1000-4FGG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V1000-4FGG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V1000-4FGG456I?
For technical support, including XC2V1000-4FGG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1000-4FGG456I requirements.
6.How does Aetrix verify that XC2V1000-4FGG456I is sourced from the original manufacturer or authorized distributors?
All XC2V1000-4FGG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1000-4FGG456I meets industry standards.
7.What is the process for return or replacement of XC2V1000-4FGG456I?
All XC2V1000-4FGG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1000-4FGG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V1000-4FGG456I part is unused and in its original packaging.
Return procedure for XC2V1000-4FGG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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