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AMD XC2V1000-5BG575I

Part No.:
XC2V1000-5BG575I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
575-BBGA
Datasheet:
AetrixXC2V1000-5BG575I.pdf
Description:
IC FPGA 328 I/O 575BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,623

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Product details

Overview

XC2V1000-5BG575I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (1.27 mm pitch), designed for high-performance telecommunication, networking, and DSP systems requiring embedded memory, dedicated multipliers, and precise clock management. It delivers 432 user I/Os, supports LVDS/PCI-X/DDR interfaces, and operates across –40°C to +100°C industrial temperature range.

For engineers reviewing the XC2V1000-5BG575I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (including DCI and LVDS), DCM timing parameters, CLB resource count, and package-specific I/O mapping - all confirmed against DS031 (v3.5) November 2007.

Technical Context

The XC2V1000-5BG575I implements a hierarchical SRAM-based architecture with 5,120 Configurable Logic Blocks (CLBs), each containing four slices with dual 4-input LUTs and flip-flops/latches. Its routing uses Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

It integrates 40 Block SelectRAM™ modules (18 Kb dual-port RAM each), 160 dedicated 18×18 multipliers, and 8 Digital Clock Manager (DCM) modules supporting phase shifting (1/256-clock-period resolution), frequency synthesis (M/D ratio), and de-skew. All I/Os support Digitally Controlled Impedance (DCI) for on-chip termination.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 1 million - defines logic density for complex IP-core integration in telecom baseband processing.
Configurable Logic Blocks (CLBs) 5,120 - each contains 4 slices with dual LUTs and storage elements; enables large synchronous state machines.
User I/O Pins 328 - confirmed for BG575/BGG575 package; supports up to 19 single-ended and 6 differential standards.
Block SelectRAM™ 40 × 18 Kb dual-port blocks - provides 720 Kb embedded RAM; configurable from 16K×1 to 512×36 for FIFO/buffering.
Digital Clock Managers (DCMs) 8 - deliver jitter-free clock multiplication/division, 90/180/270° phase shifts, and input-to-output de-skew.
Multiplier Blocks 160 × 18-bit × 18-bit - enables parallel MAC operations for FIR filters and FFT acceleration without LUT overhead.
Operating Temperature –40°C to +100°C - validated for industrial environments including base station RF units and industrial control PLCs.
Core Voltage (VCCINT) 1.5 V - low-power CMOS process reduces dynamic power in high-clock-rate DSP pipelines.

Pinout & Package

XC2V1000-5BG575I uses the BG575 standard BGA package (1.27 mm pitch, 31 mm × 31 mm), with 328 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration Clock Input Drives internal configuration shift register; must be stable during master/slave serial or SelectMAP programming.
DONE Configuration Status Output Open-drain signal pulled high when configuration completes successfully; used for system boot sequencing.
M0–M2 Mode Selection Inputs Set configuration mode at power-up (e.g., Slave Serial, Master SelectMAP); latched on PROG_B rising edge.
PROG_B Program Initiate Input Active-low asynchronous reset that clears configuration memory and restarts loading sequence.
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface IEEE 1149.1-compliant test access port for in-system verification, debugging, and bitstream readback.

Key Features

Feature Design Value
SelectIO™-Ultra I/O Architecture Supports 19 single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and 6 differential (LVDS, BLVDS, LVPECL) standards with programmable drive strength (2–24 mA).
Digitally Controlled Impedance (DCI) On-chip series or split termination resistors auto-calibrated to external reference resistor; eliminates external termination components for SSTL/HSTL/LVDS.
Embedded Memory Hierarchy 720 Kb block RAM + distributed RAM; enables dual-port FIFOs, coefficient tables, and frame buffers without external memory latency.
High-Speed Clock Management 8 DCMs provide sub-nanosecond clock de-skew, fine-grained phase adjustment, and flexible M/D synthesis - critical for source-synchronous DDR interfaces.
SRAM-Based In-System Reconfiguration Unlimited reprogramming via SelectMAP or JTAG; supports partial reconfiguration for dynamic function swapping in radar or protocol gateways.

Applications

Wireless Baseband Processing High-Speed Network Line Cards

Use Scenario: Real-time channel coding/decoding (Turbo, LDPC) and modulation/demodulation in 3G/4G LTE base stations.

IC Role / Device Role / Timing Role: Programmable fabric executing custom DSP pipelines with synchronized data flow between DCM-managed clocks and block RAM buffers.

Use Value: 160 dedicated multipliers and 720 Kb RAM enable parallel filter banks and symbol-level processing at >100 MSPS without off-chip memory bottlenecks.

Use Scenario: Packet classification, header parsing, and traffic shaping in 10 GbE line cards with PCI-X host interface.

IC Role / Device Role / Timing Role: Interface bridge and packet processor handling 133 MHz PCI-X transactions while managing SERDES-aligned data streams.

Use Value: 328 I/Os with PCI-X 133 MHz compliance and LVDS I/O support allow direct attachment to PHYs and host controllers without level-shifting logic.

Industrial Video Surveillance Systems DSP-Accelerated Test Equipment

Use Scenario: Multi-channel HD video encoding (H.264), motion detection, and metadata tagging in edge AI cameras.

IC Role / Device Role / Timing Role: Real-time pixel pipeline controller with DDR SDRAM interface and embedded frame buffers using block SelectRAM.

Use Value: Dual-port RAM blocks operate at full speed for simultaneous read/write of video frames, eliminating external FIFOs and reducing board area.

Use Scenario: High-precision waveform generation and real-time FFT analysis in automated test equipment (ATE) for RF IC validation.

IC Role / Device Role / Timing Role: Deterministic signal generator core synchronized to ultra-stable reference clocks via DCM phase alignment.

Use Value: 8 DCMs enable simultaneous generation of multiple phase-coherent clocks for DAC sampling, trigger timing, and acquisition windows - critical for <1 ps jitter tolerance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital signal processing applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2V1000-4BG575I Slower speed grade (-4 vs. -5); 12% lower maximum internal clock frequency (380 MHz vs. 420 MHz). Suitable for cost-sensitive designs where timing closure is achievable at reduced clock rates. Select when design meets timing with margin and thermal/power constraints favor lower-speed bin.
XC2V1500-5FG456I Higher density (1.5M gates), finer-pitch FG456 package (1.00 mm), 324 user I/Os, but requires PCB redesign. Better suited for next-generation upgrades needing more CLBs and multiplier resources without changing architecture. Choose for scalability paths where additional logic and memory justify package migration and layout revision.

Compared with XC2V1000-5BG575I, the -4 speed grade trades performance for cost and power, while the XC2V1500-5FG456I offers higher capacity in a smaller footprint but demands new PCB layout - neither is pin-compatible, making XC2V1000-5BG575I optimal for stable industrial deployments requiring proven BG575 mechanical compatibility.

Availability

XC2V1000-5BG575I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial video analytics, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-5BG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering FPGA and adaptive computing solutions provider, acquired by AMD in 2022, with decades of leadership in programmable logic architecture and EDA toolchains.

The Virtex-II family was engineered for high-bandwidth, low-latency digital signal processing in telecom and networking - delivering scalable logic density, embedded memory, and deterministic clocking before mainstream ASIC alternatives existed.

FAQ

What is the maximum number of user I/Os supported by XC2V1000-5BG575I?

XC2V1000-5BG575I supports 328 user I/Os in the BG575 package, as confirmed in Table 6 of DS031 (v3.5). This excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, etc.) and VBATT. The count is specific to wire-bond BG575/BGG575 packages and differs from flip-chip variants like FF896 (432 I/Os).

Does XC2V1000-5BG575I support LVDS signaling?

Yes, XC2V1000-5BG575I supports LVDS I/O with 840 Mb/s capability, as documented in the "SelectIO™-Ultra Technology" section of DS031. It implements current-mode drivers and supports both LVDS_33 and LVDS_25 standards, with differential pairs requiring adjacent pads and shared switch matrix access.

What clock management resources does XC2V1000-5BG575I include?

XC2V1000-5BG575I integrates 8 Digital Clock Manager (DCM) modules, each providing de-skew, frequency synthesis (M/D ratio), and phase shifting in 1/256-clock-period increments. These DCMs drive up to 16 global clock multiplexer buffers and support source-synchronous timing for DDR and LVDS interfaces.

Is XC2V1000-5BG575I compatible with PCI-X 133 MHz interfaces?

Yes, XC2V1000-5BG575I is explicitly PCI-X 133 MHz compliant at 3.3 V, as stated in the "Summary of Virtex-II™ Features" and "Supported Single-Ended I/O Standards" sections of DS031. This compliance applies to its LVCMOS33 I/O banks with appropriate VCCO and board termination.

What is the core voltage requirement for XC2V1000-5BG575I?

XC2V1000-5BG575I requires a 1.5 V ±3% core supply (VCCINT), as specified in the "Electrical Characteristics" section of Module 3 in DS031. This voltage powers the CLB logic array and is separate from VCCAUX (3.3 V) and I/O bank supplies (VCCO, configurable per bank).

XC2V1000-5BG575I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II
Package/Case:
575-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1280
Number of Logic Elements/Cells:
-
Total RAM Bits:
737280
Number of I/O:
328
Number of Gates:
1000000
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
575-BGA (31x31)

XC2V1000-5BG575I FAQ

1.How can I place an order for XC2V1000-5BG575I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V1000-5BG575I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V1000-5BG575I reliable?

The price and inventory of XC2V1000-5BG575I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1000-5BG575I is usually 5 days.

3.What payment methods are accepted for XC2V1000-5BG575I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1000-5BG575I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V1000-5BG575I?

XC2V1000-5BG575I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V1000-5BG575I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V1000-5BG575I?

For technical support, including XC2V1000-5BG575I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1000-5BG575I requirements.

6.How does Aetrix verify that XC2V1000-5BG575I is sourced from the original manufacturer or authorized distributors?

All XC2V1000-5BG575I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1000-5BG575I meets industry standards.

7.What is the process for return or replacement of XC2V1000-5BG575I?

All XC2V1000-5BG575I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1000-5BG575I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V1000-5BG575I part is unused and in its original packaging.

Return procedure for XC2V1000-5BG575I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2V1000-5BG575I Tags

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