AMD XC2V1000-5BGG575C

Overview

XC2V1000-5BGG575C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 5,120 Configurable Logic Blocks (CLBs), 40 18-Kb Block SelectRAM™ modules (totaling 720 Kb RAM), and 160 dedicated 18×18 multipliers. Used in high-speed telecom and networking systems requiring PCI-X 133 MHz I/O and DDR memory interfaces.

For engineers reviewing the XC2V1000-5BGG575C datasheet, pinout, applications, or equivalent options, key selection criteria include its 328-user-I/O count in BGG575 packaging, dual-port RAM configurability (up to 512×36), DCM-based clock management (12 DCMs), and support for LVDS, SSTL, and HSTL I/O standards - all critical for deterministic timing in packet-processing and video transport designs.

Technical Context

The XC2V1000-5BGG575C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and glitch-free global clock MUX buffers (16 total). Its IOBs support true DDR input/output registers with independent rising/falling-edge clocks generated by integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic; each Block SelectRAM supports three read-during-write modes and cascades to build larger memory blocks. The device uses a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO).

Key Specifications

Pinout & Package

XC2V1000-5BGG575C uses a 1.27 mm pitch, 31 mm × 31 mm standard BGA package (BGG575) with 575 balls, including 328 user I/Os, 15 dedicated configuration/control pins (e.g., CCLK, DONE, M0–M2, PROG_B), and power/ground balls distributed across the array for low-noise operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2V1000-5BGG575C, the -4 variant trades 10% clock speed for lower cost and power, while the XC2V1500-5FG456C increases logic capacity by 50% but reduces I/O count by 4 and shifts to a thermally demanding fine-pitch package - making each alternative optimal only under distinct board-level and performance constraints.

Availability

XC2V1000-5BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging subsystems, and industrial automation requiring stable component supply over extended production lifecycles.

Supply support for XC2V1000-5BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II family was designed for high-performance, IP-centric system integration in wireline/wireless infrastructure, video processing, and DSP-intensive applications - delivering scalable logic, memory, and I/O resources on a single die.

FAQ

What is the maximum number of user I/O pins supported by XC2V1000-5BGG575C?

XC2V1000-5BGG575C supports 328 user I/O pins in the BGG575 package, as confirmed in Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.) and power/ground balls. The value reflects wire-bond BGA limitations versus flip-chip variants like FF896, which offer 432 I/Os for the same XC2V1000 device.

Does XC2V1000-5BGG575C support DDR memory interfaces?

Yes, XC2V1000-5BGG575C natively supports DDR SDRAM interfaces via dedicated DDR input/output registers in its IOBs and compatible SSTL-2 I/O standards. Its DCMs generate precisely phased clocks required for DDR timing, and the 720 Kb of block RAM can serve as write buffers or command queues - all documented in Modules 2 and 3 of DS031.

What clock management resources are integrated into XC2V1000-5BGG575C?

XC2V1000-5BGG575C integrates 12 Digital Clock Manager (DCM) modules, each providing de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (±1/256 cycle). These feed 16 global clock MUX buffers, enabling glitch-free clock domain crossing - essential for synchronizing PCI-X, DDR, and LVDS interfaces within a single XC2V1000-5BGG575C design.

Is XC2V1000-5BGG575C compatible with 5V-tolerant I/O standards?

No, XC2V1000-5BGG575C is not 5V-tolerant. Its IOBs operate with VCCO ranging from 1.5 V to 3.3 V depending on I/O standard (e.g., 3.3 V for LVTTL, 1.8 V for LVCMOS18), and lack internal 5V clamping. External current-limiting resistors are required if interfacing with 5V signals, as noted in DS031-2 Section "5V Tolerant I/Os" Tech Topic.

What configuration modes does XC2V1000-5BGG575C support?

XC2V1000-5BGG575C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is SRAM-based and in-system reprogrammable; bitstream encryption via Triple-DES is optional. All modes are detailed in Module 2, Section "Configuration" of DS031-2.