AMD XC2V1000-5BGG575I

Overview

XC2V1000-5BGG575I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 575-ball standard BGA (1.27 mm pitch), rated for industrial temperature (–40°C to +100°C), with 328 user I/Os, 40 Configurable Logic Blocks (CLBs), and 40 Digital Clock Managers (DCMs). It delivers high-speed logic implementation for telecom infrastructure, video processing, and DDR memory interface designs.

For engineers reviewing the XC2V1000-5BGG575I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (328), DCM count (40), core voltage (1.5 V), supported differential standards (LVDS, LVPECL), and industrial-grade thermal reliability.

Technical Context

The XC2V1000-5BGG575I implements a hierarchical SRAM-based architecture with 5,120 CLB slices, 40 dedicated 18×18 multipliers, and 40 dual-port 18-Kb Block SelectRAM™ modules (totaling 432 Kb RAM). Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

It integrates 40 Digital Clock Managers (DCMs) supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period steps), plus 16 global clock multiplexer buffers. I/O subsystem supports 19 single-ended and 6 differential standards-including PCI-X (133 MHz), SSTL, HSTL, and LVDS-with Digitally Controlled Impedance (DCI) for on-chip termination.

Key Specifications

Pinout & Package

BGG575 is a 575-ball standard Ball Grid Array package with 1.27 mm pitch, 31 mm × 31 mm body size, and Pb-free construction compliant with RoHS. It supports wire-bond interconnect and accommodates 328 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, etc.).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2V1000-4BGG575I and XCV1000E-8BG560C, the XC2V1000-5BGG575I offers superior timing headroom, industrial temperature resilience, and integrated clock management-making it the preferred choice for new high-reliability telecom and video systems.

Availability

XC2V1000-5BGG575I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial motion control systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-5BGG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II family was engineered for high-performance, high-density system-level integration in telecom, video, and DSP applications-emphasizing clock management, memory hierarchy, and I/O flexibility.

FAQ

What is the maximum operating junction temperature for XC2V1000-5BGG575I?

The XC2V1000-5BGG575I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated under worst-case voltage, process, and ambient conditions per DS031-3 switching characteristics. Thermal design must maintain junction temperature ≤100°C using appropriate heatsinking and airflow, especially when operating at full I/O and logic utilization.

Does XC2V1000-5BGG575I support partial reconfiguration?

Yes, XC2V1000-5BGG575I fully supports partial reconfiguration as defined in the Virtex-II Functional Description (DS031-2). This capability allows dynamic replacement of specific logic regions while the rest of the design remains operational-enabling adaptive protocols, firmware updates, and runtime optimization without system reset.

What I/O standards with on-chip termination are supported by XC2V1000-5BGG575I?

XC2V1000-5BGG575I supports Digitally Controlled Impedance (DCI) for LVDCI, SSTL_DCI, HSTL_DCI, GTL_DCI, GTLP_DCI, and LVDS_DCI standards. These enable programmable series or split termination directly within the IOB, eliminating external resistors and improving signal integrity for high-speed interfaces like DDR2 and PCI-X.

How many global clock lines are available in XC2V1000-5BGG575I?

XC2V1000-5BGG575I provides 16 global clock lines, with eight available per quadrant. Each line connects to dedicated global clock multiplexer buffers, and each of the 40 DCMs can drive up to four of these buffers-ensuring low-skew distribution across large logic arrays and multi-clock domain designs.

Is XC2V1000-5BGG575I compatible with Xilinx ISE 14.7 design tools?

No-XC2V1000-5BGG575I requires Xilinx ISE Foundation or Alliance Series software (v6.3 or later), as documented in DS031-2. ISE 14.7 targets 7-series and newer devices; Virtex-II synthesis, place-and-route, and bitstream generation are only supported in legacy ISE versions up to v14.7's predecessor toolchain (v10.1–v13.4 with proper service packs).