AMD XC2V1000-5FF896I

Overview

XC2V1000-5FF896I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FF896) package, operating at industrial temperature (–40°C to +100°C) with –5 speed grade. It integrates 5,120 Configurable Logic Blocks (CLBs), 40 Digital Clock Managers (DCMs), 40 18-Kb Block SelectRAM™ modules (720 Kbits total), and supports 432 user I/Os. It is used in high-speed telecom line cards requiring LVDS interface timing closure and DDR memory controller logic.

For engineers reviewing the XC2V1000-5FF896I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource mapping, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V1000-5FF896I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, two storage elements (DFF/latch), carry chains, and horizontal cascade logic. Block SelectRAM resources are true dual-port (16K×1 to 512×36), with three read-during-write modes and dedicated 18×18 multipliers adjacent to each RAM block.

Key Specifications

Pinout & Package

XC2V1000-5FF896I uses a 31 mm × 31 mm flip-chip fine-pitch BGA (FF896) with 1.00 mm pitch, 896 balls, and 432 user I/Os. Control pins (CCLK, DONE, M0–M2, PROG_B, TCK/TDI/TDO/TMS) occupy dedicated locations per DS031 Module 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1000-5FF896I, XCV50-6PQ240I lacks essential resources for modern interface logic, while XC3S1000-4FG456C offers gate count parity but sacrifices I/O speed, clock management depth, and signal integrity features critical for infrastructure-grade designs.

Availability

XC2V1000-5FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-5FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered platform FPGA architectures for high-performance digital systems.

The Virtex-II family was designed for demanding infrastructure applications-telecom, networking, and video-where high I/O bandwidth, precise clock control, and embedded memory are essential.

FAQ

What is the maximum supported LVDS data rate for XC2V1000-5FF896I?

The XC2V1000-5FF896I supports up to 840 Mb/s LVDS signaling, as confirmed in DS031 Module 1 Summary of Features. This is achieved using dedicated current-mode drivers and matched trace routing; actual achievable rate depends on PCB layout, termination, and DCM-configured clock phase alignment. The XC2V1000-5FF896I datasheet specifies timing margins for 840 Mb/s under industrial temperature conditions.

Does XC2V1000-5FF896I support DDR SDRAM interfaces?

Yes, XC2V1000-5FF896I supports DDR SDRAM interfaces through dedicated DDR-capable IOBs with double-data-rate input/output registers, as documented in DS031 Module 2. These registers are clocked by DCM-generated 180°-phase-shifted clocks, enabling reliable capture of DQS-strobed data. The XC2V1000-5FF896I also supports SSTL-2 and SSTL-3 I/O standards required for DDR/DDR2 compatibility.

How many Digital Clock Managers (DCMs) does XC2V1000-5FF896I include?

The XC2V1000-5FF896I includes 40 Digital Clock Managers (DCMs), as specified in Table 1 of DS031 Module 1. Each DCM provides fully digital clock deskew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period steps). This enables precise multi-domain clocking for complex systems like video pipelines or packet processors in the XC2V1000-5FF896I.

Is XC2V1000-5FF896I compatible with Pb-free soldering processes?

No - XC2V1000-5FF896I is not Pb-free. Per DS031 Module 1, Pb-free packaging applies only to wire-bond packages (CSG, FGG, BGG) and specific flip-chip variants like FF1152/FF1517. The FF896 package used by XC2V1000-5FF896I is leaded; its datasheet revision history and ordering examples confirm no Pb-free variant was released for this package option.

Can XC2V1000-5FF896I perform partial reconfiguration?

Yes, XC2V1000-5FF896I supports partial reconfiguration, as stated in DS031 Module 1 under "SRAM-Based In-System Configuration." This feature allows dynamic replacement of logic modules (e.g., communication protocol engines) without resetting the entire device. Partial reconfiguration requires Xilinx ISE tools and proper floorplanning; it is a verified capability of the XC2V1000-5FF896I architecture.