AMD XC2V1000-5FFG896C

Overview

XC2V1000-5FFG896C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FF896) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 5,120 Configurable Logic Blocks (CLBs), 40 18-Kb Block SelectRAM™ modules (720 Kbits total), 160 dedicated 18×18 multipliers, and 8 Digital Clock Managers (DCMs), enabling high-performance telecommunication and DSP applications requiring DDR I/O, LVDS interfaces, and embedded memory.

For engineers reviewing the XC2V1000-5FFG896C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, DCM timing parameters, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V1000-5FFG896C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-data-rate (DDR) input/output paths with two independently clocked registers per path, driven by phase-shifted clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), fast carry chains, and horizontal cascade logic; each Block SelectRAM supports true dual-port operation (16K×1 to 512×36), three read-during-write modes, and direct association with a dedicated 18×18 multiplier for efficient DSP filtering.

Key Specifications

Pinout & Package

XC2V1000-5FFG896C uses the FF896 flip-chip fine-pitch BGA package (1.00 mm pitch, 31×31 mm body), offering 432 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic applications.

Compared with XC2V1000-5FFG896C, XCV50-6PQ240C lacks essential features for modern interface design (DCM, Block RAM, LVDS), while XC3S1000-4FG456C offers gate-equivalent density but sacrifices DCM-based phase control, DCI termination, and true dual-port memory-critical for telecom and video systems.

Availability

XC2V1000-5FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial embedded controllers requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-5FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-end programmable logic applications demanding performance, density, and system integration.

The Virtex-II product line was engineered specifically for high-bandwidth, low-latency applications in telecommunications, networking, and digital signal processing-emphasizing clock management, memory hierarchy, and I/O flexibility.

FAQ

What is the maximum user I/O count for XC2V1000-5FFG896C?

The XC2V1000-5FFG896C supports 432 user I/Os in its FF896 flip-chip BGA package. This count excludes 15 dedicated configuration and JTAG pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The FF896 package enables higher I/O density than wire-bond alternatives like BG575 (328 I/Os) due to flip-chip interconnect efficiency.

Does XC2V1000-5FFG896C support DDR memory interfaces?

Yes, XC2V1000-5FFG896C natively supports DDR SDRAM and DDR SRAM interfaces through dedicated input and output registers in its IOBs, combined with DCM-generated 180° phase-shifted clocks. It meets JEDEC timing requirements for DDR-200/266 operation when used with appropriate PCB layout and termination.

What clock management resources does XC2V1000-5FFG896C include?

XC2V1000-5FFG896C integrates 8 Digital Clock Managers (DCMs), each providing de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (±1/256 cycle resolution). These DCMs drive up to 16 global clock multiplexer buffers, enabling robust multi-domain clock distribution for complex synchronous designs.

Is XC2V1000-5FFG896C compatible with PCI-X 133 MHz?

Yes, XC2V1000-5FFG896C is PCI-X 133 MHz compliant at 3.3V. Its IOBs support PCI-X signaling directly, and Digitally Controlled Impedance (DCI) allows on-die series termination to meet PCI-X impedance and timing specifications without external resistors.

Can XC2V1000-5FFG896C perform bitstream encryption?

Yes, XC2V1000-5FFG896C includes an on-chip Triple-DES decryptor supporting one or two 168-bit key sets. When enabled, it decrypts encrypted configuration bitstreams loaded via SelectMAP or JTAG, protecting intellectual property against unauthorized readback or cloning.