AMD XC2V1000-5FG256C

Overview

XC2V1000-5FG256C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FG256) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 5,120 Configurable Logic Blocks (CLBs), 40 Digital Clock Managers (DCMs), 40 Block SelectRAM™ modules (720 Kbits total), and supports up to 172 user I/Os. It is used in high-speed telecommunication line cards requiring LVDS interface synchronization and DDR memory controller logic.

For engineers reviewing the XC2V1000-5FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (172), DCM count (40), block RAM capacity (720 Kbits), and support for PCI-X 133 MHz and LVDS 840 Mb/s signaling - all confirmed for this exact FG256-packaged variant.

Technical Context

The XC2V1000-5FG256C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-data-rate (DDR) input/output registers clocked by phase-opposed DCM outputs, enabling precise source-synchronous timing for interfaces like DDR SDRAM and LVDS.

Each CLB contains four slices with dual 4-input LUTs, two storage elements, and fast carry chains; each Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36. The -5 speed grade specifies maximum internal clock frequency of 420 MHz and I/O toggle rate up to 840 Mb/s under defined conditions.

Key Specifications

Pinout & Package

XC2V1000-5FG256C uses the FG256 fine-pitch ball grid array package (1.00 mm pitch, 17 mm × 17 mm body), wire-bond construction with Pb-free FGG256 option available. Pin definitions follow Xilinx DS031 Module 4, with 172 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1000-4FG256C and XC2V1000-5FG456C, the XC2V1000-5FG256C uniquely balances high-speed performance (-5 grade), moderate I/O count (172), and compact 17×17 mm footprint - making it optimal for space-constrained, timing-critical embedded control and interface bridging applications where pin count is bounded.

Availability

XC2V1000-5FG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and medical imaging systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2V1000-5FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered the FPGA architecture and tools ecosystem for high-performance digital system design.

The Virtex-II family was designed for high-density, high-speed applications in telecommunications, networking, and video processing - delivering platform-level integration of logic, memory, DSP, and clock management in a single device.

FAQ

What is the maximum number of user I/Os supported by XC2V1000-5FG256C?

The XC2V1000-5FG256C supports exactly 172 user I/Os, as specified in Table 6 of DS031 for the XC2V1000 device in the FG256/FGG256 package. This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. No additional I/Os are enabled beyond this limit in this package variant.

Does XC2V1000-5FG256C support LVDS signaling?

Yes, XC2V1000-5FG256C supports LVDS signaling at up to 840 Mb/s per differential pair, as confirmed in the "SelectIO™-Ultra Technology" section of DS031. Each LVDS pair uses two adjacent I/O pins and requires proper termination; the FPGA's DCI feature can configure on-die termination for compatible standards.

What clock management resources are integrated into XC2V1000-5FG256C?

The XC2V1000-5FG256C integrates 40 Digital Clock Manager (DCM) modules, each providing de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 cycle resolution). These DCMs drive 16 global clock multiplexer buffers and support source-synchronous DDR I/O timing through 180° phase-split clock generation.

Is XC2V1000-5FG256C compatible with PCI-X 133 MHz interfaces?

Yes, XC2V1000-5FG256C is explicitly listed as PCI-X compatible (133 MHz and 66 MHz) at 3.3 V in the "SelectIO™-Ultra Technology" summary. Its IOBs meet PCI-X electrical specifications when configured with appropriate VCCO = 3.3 V and termination, and its -5 speed grade ensures sufficient timing margin for 133 MHz operation.

What is the block RAM capacity of XC2V1000-5FG256C?

The XC2V1000-5FG256C contains 40 Block SelectRAM™ modules, each 18 Kb, totaling 720 Kbits of true dual-port RAM. Configurations range from 16K×1 to 512×36 bits per block, with three read-during-write modes supported - enabling robust FIFO, buffer, and lookup table implementations without external memory.