AMD XC2V1000-5FG256I

Overview

XC2V1000-5FG256I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FG256) package, rated for industrial temperature range (–40°C to +100°C), with 160 dedicated 18×18 multipliers, 40 Digital Clock Manager (DCM) modules, and 328 user I/Os. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring deterministic clock management and DDR-capable I/O.

For engineers reviewing the XC2V1000-5FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its 1.5 V core supply, support for LVDS/PCI-X/DDR I/O standards, DCM-based phase-shifting and frequency synthesis, and wire-bond BGA packaging with verified FG256 footprint compatibility across Virtex-II family members.

Technical Context

The XC2V1000-5FG256I implements a hierarchical SRAM-based architecture with 5,120 Configurable Logic Blocks (CLBs), each containing four slices with dual 4-input LUTs and flip-flops, enabling flexible combinatorial and synchronous logic. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

It integrates 40 × 18-Kb Block SelectRAM dual-port memory blocks (totaling 720 Kb), 160 dedicated 18×18 multipliers tightly coupled to memory ports for efficient read-multiply-accumulate operations, and 16 global clock multiplexer buffers driven by up to 12 DCMs - though only 40 DCMs are instantiated in this density grade - supporting precise de-skew, ±1/256-cycle phase adjustment, and M/D ratio frequency synthesis.

Key Specifications

Pinout & Package

XC2V1000-5FG256I uses the FG256 fine-pitch ball grid array package (1.00 mm pitch, 17 mm × 17 mm body), wire-bond construction, with 256 solder balls arranged in a 16×16 array. Pin definitions follow Xilinx's standardized Virtex-II IOB layout, with dedicated configuration, clock, and I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1000-4FG256I, the XC2V1000-5FG256I offers guaranteed 420 MHz internal operation and tighter hold-time margins; compared with XC2V1000-5FG456I, it trades I/O count and bank count for compact 256-ball layout and lower assembly cost - ideal for space-constrained industrial controllers.

Availability

XC2V1000-5FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging equipment, and avionics subsystems requiring stable component supply, long-term lifecycle support, and industrial-temperature-rated programmable logic.

Supply support for XC2V1000-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered the FPGA architecture and tools ecosystem for high-performance digital system design.

The Virtex-II product line was engineered for high-density, high-speed applications in telecommunications, video, and DSP - delivering scalable logic, memory, and clock resources with silicon-proven reliability in industrial and commercial environments.

FAQ

What is the maximum operating junction temperature for XC2V1000-5FG256I?

The XC2V1000-5FG256I is specified for industrial temperature range with a maximum junction temperature of +100°C. This rating is validated under worst-case power dissipation and ambient conditions defined in DS031 Module 3, and requires adherence to thermal pad layout guidelines and recommended PCB copper pour for the FG256 package.

Does XC2V1000-5FG256I support JTAG boundary scan for in-system testing?

Yes, XC2V1000-5FG256I fully complies with IEEE 1149.1 (JTAG) and supports BYPASS, SAMPLE, EXTEST, INTEST, and HIGHZ instructions. The Test Access Port (TAP) enables board-level interconnect testing, configuration verification, and real-time debugging without requiring additional test fixtures or probe points.

Can XC2V1000-5FG256I interface directly with DDR2 SDRAM at 400 MT/s?

XC2V1000-5FG256I supports DDR SDRAM interfaces up to 400 MT/s using its SelectIO-Ultra I/O banks with programmable drive strength and DCI termination. However, achieving 400 MT/s requires careful PCB layout, matched trace lengths, and use of DCM-generated phase-aligned clocks - not all I/O banks support SSTL_2 or SSTL_18 simultaneously.

How many 18-Kb Block SelectRAM modules does XC2V1000-5FG256I contain?

XC2V1000-5FG256I contains 40 × 18-Kb Block SelectRAM modules, totaling 720 Kb of embedded dual-port RAM. Each block is independently configurable from 16K×1 to 512×36, and supports three read-during-write modes - essential for pipelined DSP buffers and asynchronous FIFOs.

Is bitstream encryption supported on XC2V1000-5FG256I?

Yes, XC2V1000-5FG256I includes on-chip Triple-DES decryption hardware. When enabled, it secures configuration bitstreams against unauthorized readback or cloning - a requirement for protecting proprietary algorithm implementations in deployed systems.