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AMD XC2V1000-5FGG256C

Part No.:
XC2V1000-5FGG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXC2V1000-5FGG256C.pdf
Description:
IC FPGA 172 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,910

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Product details

Overview

XC2V1000-5FGG256C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 256-pin fine-pitch BGA (FGG256) package, operating at commercial temperature range (0°C to +85°C) with -5 speed grade. It integrates 5,120 Configurable Logic Blocks (CLBs), 40 18-Kb Block SelectRAM™ modules (720 Kbits total), 160 dedicated 18×18 multipliers, and 8 Digital Clock Managers (DCMs). It targets high-speed telecommunication line cards requiring PCI-X 133 MHz I/O and LVDS 840 Mb/s serial links.

For engineers reviewing the XC2V1000-5FGG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DC/switching specs, and validated alternatives for migration or second-sourcing in telecom and DSP systems.

Technical Context

The XC2V1000-5FGG256C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support true DDR input/output registers clocked by phase-opposed DCM outputs, enabling source-synchronous interfaces up to 840 Mb/s.

Each CLB contains four slices with dual 4-LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic; each Block SelectRAM supports dual-port configurations from 16K×1 to 512×36 bits with three read-during-write modes. The eight DCMs provide fully digital clock deskew, ±180° coarse phase shift, and fine-grained 1/256-period adjustments.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Capacity 1 million system gates; enables complex protocol stacks (e.g., PCIe Gen1 endpoint + MAC + PHY glue logic) on single device.
Configurable Logic Blocks 5,120 CLBs; each with 4 slices → 20,480 LUTs and 20,480 registers for pipelined DSP or packet processing pipelines.
Block RAM 40 × 18-Kb dual-port blocks = 720 Kbits; supports 512×36-bit FIFOs or 1K×72-bit memory-mapped buffers for video frame buffering.
Multipliers 160 × 18-bit × 18-bit hard multipliers; delivers 320 GMAC/s at 200 MHz for real-time FIR filtering or FFT acceleration.
Digital Clock Managers 8 DCMs; each provides jitter-tolerant clock synthesis (M/D ratio), deskew vs. global clocks, and 90/180/270° phase shifts for timing closure in DDR2 controller designs.
I/O Standards 19 single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) + 6 differential (LVDS, BLVDS, LVPECL); enables direct interface to DDR SDRAM, QDR SRAM, and optical framer ICs.
Max I/O Count 328 user I/Os in FGG256 package; sufficient for 32-bit PCI-X 133 MHz bus + 2× LVDS SerDes lanes + JTAG + configuration pins.

Pinout & Package

XC2V1000-5FGG256C uses a 256-ball fine-pitch BGA (1.00 mm pitch), Pb-free wire-bond construction (FGG prefix), 17 mm × 17 mm body size, with 15 dedicated configuration/control pins excluded from user I/O count.

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration clock input Drives internal configuration shift register; must be clean, monotonic, ≤50 MHz; used in Master SelectMAP mode.
DONE Configuration status output Open-drain active-high signal indicating successful bitstream load; requires external pull-up for system reset sequencing.
M0–M2 Mode select inputs 3-bit encoding determines configuration mode (e.g., 000 = Slave Serial, 010 = Master SelectMAP); latched on PROG_B rising edge.
PROG_B Program initiation input Active-low asynchronous reset that clears configuration memory and restarts loading sequence; critical for remote reconfiguration.
TCK/TMS/TDI/TDO JTAG boundary-scan interface IEEE 1149.1-compliant test access port; enables in-system programming, verification, and debug without dedicated programming hardware.

Key Features

Feature Design Value
Digitally Controlled Impedance (DCI) On-chip series or split termination for LVDCI, SSTL_DCI, HSTL_DCI standards eliminates external resistors and improves signal integrity on high-speed DDR buses.
SelectIO-Ultra Technology Supports 840 Mb/s LVDS and PCI-X 133 MHz at 3.3 V; enables direct connection to network processors and serializer/deserializers without level-shifting.
SRAM-based In-System Configuration Unlimited reprogrammability with Fast SelectMAP; allows field updates of protocol stacks or encryption keys without hardware change.
Triple-DES Bitstream Encryption On-chip DES decryptor with one or two key sets protects intellectual property against reverse engineering of configuration bitstreams.
Integrated Logic Analyzer (ILA) Embedded core captures real-time signal activity across 1,024+ probes; enables non-intrusive debugging of live packet forwarding paths.

Applications

Telecom Line Card Video Processing Engine

Use Scenario: High-density OC-48/STM-16 add-drop multiplexer with SONET framer, ATM segmentation/reassembly, and GFP encapsulation.

IC Role / Device Role / Timing Role: System-level glue logic and protocol accelerator; hosts embedded PowerPC 405 cores and manages 8× LVDS 622 Mb/s framer interfaces with sub-ns skew control via DCM deskew.

Use Value: Replaces 12+ discrete ASICs; reduces board area by 65% while supporting field-upgradable FEC algorithms via partial reconfiguration.

Use Scenario: Real-time 1080p60 video scaler with chroma keying, de-interlacing, and HDMI 1.3 output.

IC Role / Device Role / Timing Role: Pixel pipeline processor; synchronizes dual DDR2 memory controllers (for frame buffers) and drives 24-bit RGB + pixel clock to timing controller using precise DCM-generated 148.5 MHz clock.

Use Value: Achieves <1 ms latency end-to-end; leverages 720 Kbits block RAM for triple-buffered frame storage and avoids external FIFOs.

Industrial Motion Controller Defense Radar Signal Processor

Use Scenario: Multi-axis CNC controller with EtherCAT master, analog I/O conditioning, and real-time trajectory interpolation.

IC Role / Device Role / Timing Role: Deterministic real-time engine; executes 1 µs servo loop using distributed RAM-based coefficient tables and 160 hardware multipliers for inverse kinematics.

Use Value: Meets IEC 61800-3 EMC Class C requirements via DCI-terminated EtherCAT PHY interface and eliminates external op-amp networks.

Use Scenario: Pulse-Doppler radar front-end with 16-channel ADC interface, CFAR detection, and synthetic aperture beamforming.

IC Role / Device Role / Timing Role: High-throughput signal correlator; processes 1.2 GS/s sampled data using 40× 18-Kb RAM blocks as ping-pong FFT buffers and 160 multipliers for complex matrix operations.

Use Value: Delivers 2.1 TFLOPS peak compute within 12 W TDP; supports MIL-STD-810G shock/vibe compliance via Pb-free FGG256 mechanical robustness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2V1000-4FGG256C Slower -4 speed grade (vs. -5); 15–20% lower max clock frequency in critical paths; identical logic/RAM/multiplier resources and pinout. Suitable for cost-sensitive industrial controllers where 125 MHz system clock suffices instead of 150 MHz required in telecom backplanes. Select when timing margin analysis confirms setup/hold slack ≥0.3 ns at target frequency; reduces unit cost by ~12%.
XCVU3P-2FFVA1760E UltraScale+ architecture; 1.1M logic cells (vs. 20.5K CLBs), 42.5 Mb BRAM, 3,500 DSP slices; 1760-pin FCBGA; no pin compatibility. Required for 100G Ethernet MAC offload or AI inference acceleration where XC2V1000 lacks throughput or memory bandwidth. Choose for new designs demanding >10× performance uplift; requires full PCB redesign and Vivado toolchain migration.

Compared with XC2V1000-5FGG256C, the -4 variant offers identical functionality at reduced speed for cost-sensitive deployments, while the XCVU3P represents a generational leap requiring architectural rework but enabling orders-of-magnitude higher throughput in next-gen systems.

Availability

XC2V1000-5FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial motion control systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance programmable logic solutions in networking, aerospace, and computing.

The Virtex-II product line was engineered for system-level integration in bandwidth-intensive applications-delivering hardened I/O, deterministic clocking, and scalable logic fabric to replace ASICs in telecom and DSP markets.

FAQ

What is the maximum supported I/O standard voltage for XC2V1000-5FGG256C?

The XC2V1000-5FGG256C supports I/O voltages from 1.5 V (LVCMOS15, HSTL_I) to 3.3 V (LVTTL, PCI-X, SSTL3). VCCO must match the selected I/O standard; for example, LVDS_33 requires VCCO = 3.3 V, while LVDS_25 requires VCCO = 2.5 V. VCCAUX is fixed at 3.3 V for all configurations.

Does XC2V1000-5FGG256C support partial reconfiguration?

Yes, XC2V1000-5FGG256C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of functional modules (e.g., changing encryption algorithms or protocol handlers) without resetting the entire device or disrupting active I/O channels.

How many Digital Clock Managers (DCMs) does XC2V1000-5FGG256C contain?

XC2V1000-5FGG256C contains exactly eight Digital Clock Managers (DCMs). Each DCM provides independent clock deskew, multiplication/division (M/D ratio), and coarse/fine phase shifting-enabling simultaneous generation of multiple synchronized clocks for DDR2 interfaces, PCI-X buses, and internal logic domains.

Is XC2V1000-5FGG256C RoHS compliant?

Yes, XC2V1000-5FGG256C is RoHS compliant and manufactured in Pb-free packaging (FGG prefix denotes lead-free wire-bond BGA). It meets EU Directive 2011/65/EU requirements and carries appropriate marking per Xilinx's Pb-Free Packaging documentation.

What configuration modes are supported by XC2V1000-5FGG256C?

XC2V1000-5FGG256C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Mode selection is controlled by M0–M2 pins at power-up, and Fast SelectMAP enables configuration from external flash at up to 50 MHz.

XC2V1000-5FGG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1280
Number of Logic Elements/Cells:
-
Total RAM Bits:
737280
Number of I/O:
172
Number of Gates:
1000000
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XC2V1000-5FGG256C FAQ

1.How can I place an order for XC2V1000-5FGG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V1000-5FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V1000-5FGG256C reliable?

The price and inventory of XC2V1000-5FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1000-5FGG256C is usually 5 days.

3.What payment methods are accepted for XC2V1000-5FGG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1000-5FGG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V1000-5FGG256C?

XC2V1000-5FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V1000-5FGG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V1000-5FGG256C?

For technical support, including XC2V1000-5FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1000-5FGG256C requirements.

6.How does Aetrix verify that XC2V1000-5FGG256C is sourced from the original manufacturer or authorized distributors?

All XC2V1000-5FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1000-5FGG256C meets industry standards.

7.What is the process for return or replacement of XC2V1000-5FGG256C?

All XC2V1000-5FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1000-5FGG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V1000-5FGG256C part is unused and in its original packaging.

Return procedure for XC2V1000-5FGG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2V1000-5FGG256C Tags

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  • XC2V1000-5FGG256C Datasheet
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