AMD XC2V1000-5FGG256I

Overview

XC2V1000-5FGG256I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, rated for industrial temperature range (–40°C to +100°C), with 160 dedicated 18×18 multipliers, 40 Block SelectRAM™ modules (720 Kbits total), and 12 Digital Clock Managers (DCMs). It serves as a reprogrammable logic fabric for high-speed telecommunication line cards requiring PCI-X 133 MHz I/O and LVDS 840 Mb/s serial links.

For engineers reviewing the XC2V1000-5FGG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (including DCI-enabled LVCMOS/LVDS/SSTL), DCM timing parameters, CLB resource mapping, and wire-bond BGA package constraints - all specific to the FGG256 footprint and -5 speed grade.

Technical Context

The XC2V1000-5FGG256I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its 5,120 CLBs each contain four slices with dual 4-LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic - enabling efficient implementation of wide arithmetic and shift-register functions.

Each of its 40 Block SelectRAM modules provides 18 Kb dual-port RAM configurable from 16K×1 to 512×36, with three read-during-write modes and direct association to a dedicated 18×18 multiplier for pipelined DSP operations. Twelve DCMs deliver jitter-tolerant clock synthesis, de-skew, and ±1/256-cycle phase resolution across up to 16 global clock nets.

Key Specifications

Pinout & Package

XC2V1000-5FGG256I uses a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.00 mm pitch, Pb-free finish, and wire-bond interconnect. The package supports 328 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic fabric applications.

Compared with XC2V1000-5FGG256I, XCV50-6PQ240I offers minimal logic and no clock management, limiting it to basic glue logic; XC2V1500-5FG456I extends capacity and I/O count while retaining identical DCM, SelectRAM, and multiplier architecture - making it a scalable upgrade path within the Virtex-II family.

Availability

XC2V1000-5FGG256I is available at Aetrix Electronics and suitable for industrial video processing, telecom line card development, medical imaging systems, and test & measurement instrumentation requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2V1000-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-II family was designed for high-bandwidth, low-latency applications in telecommunications, wireless infrastructure, and video processing - delivering platform-level integration of logic, memory, DSP, and I/O in a single reprogrammable device.

FAQ

What is the maximum operating junction temperature for XC2V1000-5FGG256I?

The XC2V1000-5FGG256I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is guaranteed across all speed grades and I/O configurations defined in DS031, and applies to continuous operation under specified voltage and thermal conditions.

Does XC2V1000-5FGG256I support LVDS I/O at 840 Mb/s?

Yes, XC2V1000-5FGG256I supports LVDS I/O at up to 840 Mb/s as confirmed in the Virtex-II DS031 Summary of Features. This performance is achievable using the dedicated current-mode LVDS drivers and matched routing in the FGG256 package, with proper PCB layout and termination.

How many Digital Clock Managers (DCMs) does XC2V1000-5FGG256I include?

XC2V1000-5FGG256I includes 12 Digital Clock Managers (DCMs), each capable of clock de-skew, multiplication/division (M/D ratio), and fine-grained phase shifting (±1/256 cycle resolution). These are fully documented in Module 2 of DS031 and used for multi-domain clock distribution.

Is XC2V1000-5FGG256I compatible with Pb-free soldering processes?

Yes, XC2V1000-5FGG256I uses a Pb-free FGG256 package compliant with JEDEC J-STD-020 moisture sensitivity level 3 and qualified for lead-free reflow profiles up to 260°C peak temperature, as specified in Xilinx's Pb-Free Packaging documentation.

Can XC2V1000-5FGG256I perform partial reconfiguration?

Yes, XC2V1000-5FGG256I supports partial reconfiguration as stated in DS031 Module 1. This allows dynamic modification of logic sections without resetting the entire device, enabling adaptive systems such as protocol-switching communication modules or runtime algorithm updates.