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AMD XC2V1000-5FGG456C

Part No.:
XC2V1000-5FGG456C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXC2V1000-5FGG456C.pdf
Description:
IC FPGA 324 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,095

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Product details

Overview

XC2V1000-5FGG456C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG456) package, operating at commercial temperature range (0°C to +85°C) with -5 speed grade. It integrates 5,120 Configurable Logic Blocks (CLBs), 40 Digital Clock Managers (DCMs), 40 Block SelectRAM™ modules (720 Kbits total), and supports up to 328 user I/Os. It is used in high-speed telecommunication line cards requiring PCI-X 133 MHz interfaces and DDR SDRAM controllers.

For engineers reviewing the XC2V1000-5FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (328), DCM count (40), CLB density (5,120), core voltage (1.5 V), and support for LVDS/PCI-X/SSTL-2 I/O standards - all confirmed for this exact FGG456-packaged variant.

Technical Context

The XC2V1000-5FGG456C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, two storage elements, carry chains, and horizontal cascade logic; each Block SelectRAM provides 18 Kb dual-port RAM configurable from 16K×1 to 512×36, with three read-during-write modes and dedicated 18×18 multipliers.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates1 million - defines logic capacity for complex RTL synthesis targeting telecom and video processing.
Configurable Logic Blocks (CLBs)5,120 - provides 20,480 LUTs and 20,480 flip-flops for synchronous logic implementation.
User I/O Pins328 - maximum available in FGG456 package; supports mixed single-ended and differential standards.
Digital Clock Managers (DCMs)40 - enables precise clock de-skew, frequency synthesis (M/D ratio), and ±180° phase shifting per DCM.
Block SelectRAM™ Capacity720 Kbits - 40 × 18-Kb dual-port blocks usable as FIFOs, buffers, or memory-mapped storage.
Core Supply Voltage (VCCINT)1.5 V - requires low-noise, tightly regulated power delivery; impacts dynamic power and thermal design.
Speed Grade-5 - guarantees timing closure for designs meeting 200 MHz system clock and 420 MHz internal logic paths.

Pinout & Package

XC2V1000-5FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.00 mm pitch, Pb-free construction, and wire-bond interconnect. Package dimensions are 23 mm × 23 mm. It shares footprint compatibility with FG456 variants.

Pin/Terminal Circuit Role Design Meaning
CCLKConfiguration Clock InputDrives master serial or SelectMAP configuration; must be clean, monotonic, and stable during bitstream load.
DONEConfiguration Status OutputOpen-drain signal pulled high externally; indicates successful configuration completion and device readiness.
M0–M2Mode Selection InputsSet configuration mode (slave-serial, master-serial, slave SelectMAP, etc.) at power-up; latched on PROG_B release.
PROG_BProgram Initiate InputActive-low asynchronous reset that clears configuration memory and restarts configuration sequence.
TCK/TMS/TDI/TDOJTAG Boundary-Scan InterfaceIEEE 1149.1-compliant test access port for programming, debugging, and in-system verification.
VCCINTCore Power Supply1.5 V supply for CLBs, DCMs, and routing; requires local decoupling and <10 mV ripple for timing stability.
VCCAUXAuxiliary Power Supply3.3 V supply for DCMs, configuration logic, and JTAG interface; shared across multiple functions.
VCCOI/O Bank Power SupplyBank-specific voltage (1.5 V to 3.3 V) setting I/O standard compliance; each bank independently configurable.

Key Features

Feature Design Value
Digitally Controlled Impedance (DCI)On-chip series or split termination for HSTL/SSTL/LVDCI standards eliminates external resistors and improves signal integrity.
DDR I/O RegistersDual-register per I/O path enables true double-data-rate capture/transmission without external PHY, reducing board area and skew.
18×18 Multiplier Blocks160 dedicated hard multipliers accelerate DSP filtering, FFT, and modulation algorithms with deterministic latency.
Triple-DES Bitstream EncryptionOn-chip decryptor secures configuration data using one or two DES key sets, preventing IP theft in field-deployed systems.
Readback & Integrated Logic Analyzer (ILA)Full configuration memory and register state readback enables real-time debug and in-system validation without external probes.

Applications

Telecom Line Card Video Processing Engine

Use Scenario: High-density OC-48/STM-16 packet forwarding with SERDES-to-parallel conversion and header parsing.

IC Role / Device Role / Timing Role: System-level programmable logic fabric implementing MAC, traffic manager, and PCIe-to-AXI bridge.

Use Value: 328 I/Os enable parallel 32-bit DDR2 SDRAM interface and 8-lane PCI-X 133 MHz host link; 40 DCMs manage clock domain crossing between line rate and system clocks.

Use Scenario: Real-time 1080p60 video scaling, color space conversion, and HDMI output generation in broadcast equipment.

IC Role / Device Role / Timing Role: Reconfigurable video pipeline accelerator with embedded block RAM frame buffers and pixel-rate arithmetic units.

Use Value: 720 Kbits of dual-port Block SelectRAM supports simultaneous read/write of two 1920×1080 frames; 160 multipliers enable real-time 2D convolution kernels.

Industrial Motion Controller Medical Imaging Subsystem

Use Scenario: Multi-axis servo control with synchronized PWM generation, encoder feedback processing, and EtherCAT master stack.

IC Role / Device Role / Timing Role: Deterministic real-time logic engine executing closed-loop PID and trajectory planning in hardware.

Use Value: -5 speed grade ensures sub-10 ns combinational delay for 200 kHz PWM update; DCI-enabled HSTL I/Os interface directly to high-speed ADCs and DACs.

Use Scenario: Ultrasound beamforming with 128-channel digital receive processing and real-time Doppler FFT.

IC Role / Device Role / Timing Role: High-throughput signal processor implementing channel calibration, FIR filtering, and FFT acceleration.

Use Value: 160 × 18×18 multipliers execute 128-point complex FFT in <500 ns; LVDS I/Os connect to 128-channel analog front-end ASIC with 840 Mb/s aggregate bandwidth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2V1000-4FGG456CSlower -4 speed grade; lower max internal clock (380 MHz vs. 420 MHz); same CLB count, I/O, and features.Suitable for cost-sensitive designs with relaxed timing margins; not recommended for 200+ MHz system clocks.Select when timing closure is achievable at -4 grade and BOM cost reduction is prioritized over performance headroom.
XC2V1500-5FGG456CHigher density (1.5M gates), more CLBs (7,680), DCMs (48), and I/Os (392); identical -5 speed grade and FGG456 package.Required for designs exceeding XC2V1000 resource limits but needing same footprint and thermal profile.Choose when logic utilization exceeds 90% on XC2V1000-5FGG456C and future scalability is needed without PCB redesign.

Compared with XC2V1000-5FGG456C, the -4 variant trades timing margin for cost, while the XC2V1500-5FGG456C offers direct scalability within the same package - enabling pin-compatible upgrades for evolving logic requirements without layout changes.

Availability

XC2V1000-5FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and medical imaging systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2V1000-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design toolchains.

The Virtex-II family was engineered for high-performance, system-level integration in telecommunications, networking, and DSP applications - delivering scalable logic density, hardened I/O, and clock management for complex embedded systems.

FAQ

What is the maximum number of user I/O pins supported by XC2V1000-5FGG456C?

XC2V1000-5FGG456C supports 328 user I/O pins in its FGG456 package. This count excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT. The value is confirmed in Table 6 of DS031-1 (v3.5) for XC2V1000 in FG456/FGG456 packages.

Does XC2V1000-5FGG456C support LVDS I/O standards?

Yes, XC2V1000-5FGG456C supports LVDS_25 and LVDS_33 differential I/O standards with 250–400 mV output differential voltage (VOD), as documented in Table 2 of DS031-2 (v3.5). Each differential pair uses two adjacent I/O pads and requires matching PCB trace lengths for signal integrity.

What is the core voltage requirement for XC2V1000-5FGG456C?

XC2V1000-5FGG456C requires a 1.5 V ±3% core supply (VCCINT) for its CLBs, DCMs, and internal routing. This low-voltage rail demands tight regulation and localized decoupling to maintain timing stability under dynamic switching loads, as specified in Module 3 of DS031.

How many Digital Clock Managers (DCMs) does XC2V1000-5FGG456C include?

XC2V1000-5FGG456C includes 40 Digital Clock Managers (DCMs), as stated in Table 1 of DS031-1 (v3.5). Each DCM provides de-skew, frequency synthesis, and fine-grained phase shifting - critical for managing multiple clock domains in high-speed designs.

Is XC2V1000-5FGG456C compatible with Pb-free assembly processes?

Yes, XC2V1000-5FGG456C uses a Pb-free FGG456 package (Fine-Pitch BGA, 1.00 mm pitch), explicitly designated in Xilinx ordering nomenclature and compliant with JEDEC J-STD-020 reflow profiles. The "G" in FGG456 denotes Pb-free wire-bond construction.

XC2V1000-5FGG456C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1280
Number of Logic Elements/Cells:
-
Total RAM Bits:
737280
Number of I/O:
324
Number of Gates:
1000000
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XC2V1000-5FGG456C FAQ

1.How can I place an order for XC2V1000-5FGG456C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V1000-5FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V1000-5FGG456C reliable?

The price and inventory of XC2V1000-5FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1000-5FGG456C is usually 5 days.

3.What payment methods are accepted for XC2V1000-5FGG456C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1000-5FGG456C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V1000-5FGG456C?

XC2V1000-5FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V1000-5FGG456C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V1000-5FGG456C?

For technical support, including XC2V1000-5FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1000-5FGG456C requirements.

6.How does Aetrix verify that XC2V1000-5FGG456C is sourced from the original manufacturer or authorized distributors?

All XC2V1000-5FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1000-5FGG456C meets industry standards.

7.What is the process for return or replacement of XC2V1000-5FGG456C?

All XC2V1000-5FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1000-5FGG456C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V1000-5FGG456C part is unused and in its original packaging.

Return procedure for XC2V1000-5FGG456C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2V1000-5FGG456C Tags

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