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AMD XC2V1000-5FGG456I

Part No.:
XC2V1000-5FGG456I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXC2V1000-5FGG456I.pdf
Description:
IC FPGA 324 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,131

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Product details

Overview

XC2V1000-5FGG456I from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG456) package, rated for industrial temperature range (–40°C to +100°C), with 328 user I/Os, 5,120 CLBs, and 40 embedded 18-Kb Block SelectRAM™ modules. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive systems requiring PCI, LVDS, or DDR interfaces.

For engineers reviewing the XC2V1000-5FGG456I datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (guaranteed 420 MHz internal clock), dual-port RAM configuration flexibility (up to 512 × 36), DCM-based clock management (12 DCMs), and support for 19 single-ended and 6 differential I/O standards including LVDS and PCI-X at 3.3 V.

Technical Context

The XC2V1000-5FGG456I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs integrate DDR-capable input/output registers, programmable drive strength (2–24 mA), and Digitally Controlled Impedance (DCI) for on-chip termination across LVTTL, LVCMOS, SSTL, HSTL, and GTL families.

Internally, it features 40 configurable logic blocks (CLBs), each containing four slices with dual 4-input LUTs, dual flip-flops/latches, fast carry chains, and horizontal cascade logic. Each CLB connects to dedicated segmentable horizontal routing resources via BUFT buffers, while 40 Block SelectRAM modules and 160 18×18 multipliers provide tightly coupled memory and arithmetic acceleration.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates1 million - defines logic capacity for complex RTL synthesis and IP integration
Speed Grade-5 - guarantees 420 MHz internal clock operation and 840+ Mb/s I/O switching performance
User I/O Count328 - maximum routable signal pins in FGG456 package, excluding 15 control pins
Block RAM40 × 18 Kb dual-port - supports up to 512 × 36-bit configurations with three read-during-write modes
DCMs12 - fully digital clock managers enabling precise de-skew, M/D frequency synthesis, and ±1/256-cycle phase shift
I/O Standards19 single-ended + 6 differential - includes PCI-X (133 MHz), LVDS, SSTL-2/3, HSTL, and GTLP with DCI support
Core VoltageVCCINT = 1.5 V - low-power 0.15 µm/0.12 µm CMOS process with dedicated 3.3 V VCCAUX and VCCO supplies

Pinout & Package

XC2V1000-5FGG456I uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.00 mm pitch, Pb-free construction, and wire-bond interconnect. The package supports 328 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Pin/Terminal Circuit Role Design Meaning
CCLKConfiguration Clock InputDrives master serial or SelectMAP configuration; synchronous to bitstream loading
DONEConfiguration Status OutputOpen-drain active-high signal indicating successful configuration completion
M0–M2Mode Selection InputsSet configuration mode (slave/master serial/SelectMAP/boundary-scan) at power-up
PROG_BProgram Initiate InputActive-low asynchronous reset that clears configuration memory and restarts boot sequence
TCK/TDI/TDO/TMSJTAG Boundary-Scan InterfaceIEEE 1149.1-compliant test access port for programming, debugging, and verification

Key Features

Feature Design Value
Digitally Controlled Impedance (DCI)On-chip series or split termination for 14 I/O standards, eliminating external resistors and reducing board area
DDR I/O RegistersDual-edge-clocked input/output registers per IOB enable true double-data-rate signaling without external FIFOs
18×18 Multiplier Blocks160 dedicated hard multipliers accelerate FIR filters, FFTs, and other DSP algorithms with deterministic latency
Triple-DES Bitstream EncryptionOn-chip DES decryptor with one or two key sets secures configuration data against unauthorized readback or cloning
Readback & ILA SupportFull configuration memory, CLB register, and block RAM contents accessible for real-time debug via Integrated Logic Analyzer

Applications

Telecom Line Card Video Frame Buffer

Use Scenario: High-density packet processing and protocol translation in carrier-grade DSLAMs and optical edge routers.

IC Role / Device Role / Timing Role: Configurable logic fabric implementing SERDES interfaces, ATM cell assembly/disassembly, and QoS scheduling engines.

Use Value: 328 I/Os support multiple SDRAM, SRAM, and PCI-X buses; DCMs synchronize multi-clock domains across line-side and switch-fabric interfaces.

Use Scenario: Real-time buffering and format conversion between HDMI, SDI, and DisplayPort video streams in broadcast encoders.

IC Role / Device Role / Timing Role: Dual-port Block SelectRAM acts as pixel FIFO with independent read/write clocks; LVDS I/O drives high-speed parallel video buses.

Use Value: 40 × 18 Kb RAM blocks provide >700 KB of on-chip buffer space; -5 speed grade ensures sub-5 ns setup/hold timing for 148.5 MHz pixel clocks.

DSP Accelerator Module Industrial Motion Controller

Use Scenario: Offloading FFT, correlation, and filtering tasks from host processors in radar and software-defined radio platforms.

IC Role / Device Role / Timing Role: Hard 18×18 multipliers and distributed LUT-based arithmetic pipelines execute fixed-point DSP kernels at 420 MHz.

Use Value: 160 multipliers enable parallel 1024-point FFT execution in <1 µs; DCI-configured HSTL I/O interfaces directly to high-speed ADC/DACs.

Use Scenario: Closed-loop servo control with synchronized PWM generation, encoder feedback decoding, and safety monitoring in CNC machines.

IC Role / Device Role / Timing Role: Deterministic logic fabric implements PID controllers, pulse-width modulators, and quadrature decoder state machines.

Use Value: 12 DCMs generate jitter-free 200 kHz PWM carriers with 1 ns resolution; 328 I/Os route encoder A/B/Z signals, analog inputs, and isolated digital outputs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2V1000-4FGG456ISlower -4 speed grade (380 MHz max internal clock); identical logic resources, I/O count, and packageSuitable for cost-sensitive designs where timing closure is achievable at lower frequencySelect when design meets timing with margin and thermal/power budget is constrained
XC2V1500-5FGG456IHigher density (1.5M gates), 392 I/Os, same -5 speed grade and FGG456 footprint; requires PCB redesign for extra I/OsRequired for larger logic implementations needing >1M gates or additional I/Os beyond 328Choose only if XC2V1000-5FGG456I fails timing or resource utilization exceeds 90%

Compared with XC2V1000-5FGG456I, the -4 variant trades performance for lower power and cost in timing-margin-rich designs, while the XC2V1500-5FGG456I provides headroom for future scalability but demands layout revision due to increased I/O count.

Availability

XC2V1000-5FGG456I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial motion control systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-5FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-II family was designed for high-speed, high-density applications in telecommunications, networking, and video processing, emphasizing I/O flexibility, embedded memory, and deterministic clock management.

FAQ

What is the operating temperature range for XC2V1000-5FGG456I?

The XC2V1000-5FGG456I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is guaranteed across all speed grades and I/O configurations, and applies to both configuration and user logic operation. The device uses dedicated 3.3 V VCCAUX and VCCO supplies alongside 1.5 V VCCINT, with thermal derating defined in DS031 Module 3. XC2V1000-5FGG456I must be mounted on PCBs with adequate copper pour and airflow to maintain junction temperature within limits during sustained 420 MHz operation.

Does XC2V1000-5FGG456I support JTAG boundary-scan testing?

Yes, XC2V1000-5FGG456I fully complies with IEEE 1149.1 (JTAG) and IEEE 1532 standards. Its Test Access Port (TAP) supports BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions. Boundary-scan testing can verify interconnect integrity, configure the device, or perform readback of configuration memory and CLB states. XC2V1000-5FGG456I allows concurrent system operation and non-test boundary-scan instructions, enabling in-system debug without halting user logic.

How many Block SelectRAM modules does XC2V1000-5FGG456I contain?

XC2V1000-5FGG456I contains 40 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. These modules support configurable widths from 16K × 1 to 512 × 36 bits, with three read-during-write modes and independent synchronous clocks per port. Cascading is supported to build larger memory blocks. XC2V1000-5FGG456I's total embedded RAM capacity is 720 Kb, and each module pairs with a dedicated 18×18 multiplier for optimized DSP operations.

Can XC2V1000-5FGG456I interface directly with DDR SDRAM?

Yes, XC2V1000-5FGG456I supports DDR SDRAM interfacing through its SelectIO-Ultra I/O banks using SSTL_2 or SSTL_3 I/O standards. Each IOB includes dedicated DDR input and output registers, and DCMs generate phase-aligned clocks for command/address and data strobes. XC2V1000-5FGG456I's 328 I/Os allow full x32 or x64 DDR bus implementation with DQS capture, and DCI enables on-die termination matching for signal integrity. External PHY is not required.

Is XC2V1000-5FGG456I compatible with Xilinx ISE design tools?

Yes, XC2V1000-5FGG456I is fully supported by Xilinx ISE Foundation and Alliance Series development tools (v14.7 and earlier). Synthesis, place-and-route, timing analysis, and bitstream generation are validated for this device. XC2V1000-5FGG456I requires ISE 14.7 or earlier - it is not supported in Vivado, as Virtex-II architecture predates that toolchain. Device-specific constraints, DCM wizards, and IP cores (e.g., PCI, DDR, UART) are included in the ISE distribution for XC2V1000-5FGG456I.

XC2V1000-5FGG456I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1280
Number of Logic Elements/Cells:
-
Total RAM Bits:
737280
Number of I/O:
324
Number of Gates:
1000000
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XC2V1000-5FGG456I FAQ

1.How can I place an order for XC2V1000-5FGG456I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V1000-5FGG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V1000-5FGG456I reliable?

The price and inventory of XC2V1000-5FGG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1000-5FGG456I is usually 5 days.

3.What payment methods are accepted for XC2V1000-5FGG456I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1000-5FGG456I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V1000-5FGG456I?

XC2V1000-5FGG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V1000-5FGG456I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V1000-5FGG456I?

For technical support, including XC2V1000-5FGG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1000-5FGG456I requirements.

6.How does Aetrix verify that XC2V1000-5FGG456I is sourced from the original manufacturer or authorized distributors?

All XC2V1000-5FGG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1000-5FGG456I meets industry standards.

7.What is the process for return or replacement of XC2V1000-5FGG456I?

All XC2V1000-5FGG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1000-5FGG456I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V1000-5FGG456I part is unused and in its original packaging.

Return procedure for XC2V1000-5FGG456I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2V1000-5FGG456I Tags

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