AMD XC2V1000-6BGG575C

Overview

XC2V1000-6BGG575C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 5,120 Configurable Logic Blocks (CLBs), 40 Digital Clock Managers (DCMs), 40 18-Kb Block SelectRAM™ modules, and supports up to 328 user I/Os. It is used in high-speed telecom and networking systems requiring PCI-X, LVDS, and DDR interfaces.

For engineers reviewing the XC2V1000-6BGG575C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), clock management specs, and real-world deployment context for FPGA-based system design and migration planning.

Technical Context

The XC2V1000-6BGG575C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-shifted clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, carry chains, and horizontal cascade logic; each Block SelectRAM provides synchronous dual-port RAM configurable from 16K×1 to 512×36 bits, with three read-during-write modes and dedicated 18×18 multipliers.

Key Specifications

Pinout & Package

XC2V1000-6BGG575C uses a 575-ball standard BGA (BGG575) package with 1.27 mm pitch, 31 mm × 31 mm body size, Pb-free construction, and wire-bond interconnect. Pin definitions are documented across 226 pages in DS031 Module 4, covering all ball positions, I/O standards per bank, and dedicated configuration/control signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2V1000-6BGG575C, XC2V1000-5FG456C trades I/O count and package size for reduced footprint, while XC2V1500-6FF896C extends gate count and I/O capacity using flip-chip packaging - both retain identical DCM, SelectRAM, and multiplier architecture for seamless IP reuse.

Availability

XC2V1000-6BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, high-speed test equipment, and network security appliances requiring stable component supply across extended production lifecycles.

Supply support for XC2V1000-6BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and globally recognized for FPGA, SoC, and adaptive compute solutions.

The Virtex-II family was designed for high-performance, IP-centric system integration in telecom, networking, and DSP applications - delivering scalable logic density, advanced clock management, and multi-standard I/O in a single platform.

FAQ

What is the maximum number of user I/Os supported by XC2V1000-6BGG575C?

XC2V1000-6BGG575C supports up to 328 user I/Os in the BGG575 package, as confirmed in Table 6 of DS031 Module 1. This excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The count reflects wire-bond BGA limitations - flip-chip variants like FF896 offer higher I/O counts but are not applicable to this specific part number.

Does XC2V1000-6BGG575C support LVDS signaling?

Yes, XC2V1000-6BGG575C supports LVDS signaling through its SelectIO-Ultra IOBs, with guaranteed 840 Mb/s operation per DS031 Module 1. It implements current-mode drivers and supports both LVDS_25 and LVDS_33 standards, requiring proper VCCO = 2.5 V or 3.3 V and differential pair routing per I/O bank constraints.

What clock management resources does XC2V1000-6BGG575C include?

XC2V1000-6BGG575C integrates 40 Digital Clock Manager (DCM) modules, each supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (±1/256 clock period). These DCMs feed 16 global clock multiplexer buffers, enabling robust multi-domain clock distribution essential for high-speed synchronous design in XC2V1000-6BGG575C implementations.

Is XC2V1000-6BGG575C compatible with PCI-X 133 MHz?

Yes, XC2V1000-6BGG575C is PCI-X 133 MHz compliant at 3.3 V, as explicitly stated in the "Summary of Virtex-II™ Features" section of DS031 Module 1. This compliance requires correct VCCO = 3.3 V, proper termination, and adherence to PCI-X timing parameters defined in Module 3 - all validated for the XC2V1000-6BGG575C speed grade and package combination.

What configuration modes are supported by XC2V1000-6BGG575C?

XC2V1000-6BGG575C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. These are implemented via M0–M2 pin states at power-up and enable flexible programming options including JTAG debugging, PROM-based boot, and in-system reconfiguration - all documented in DS031 Module 2.