AMD XC2V1000-6FFG896C

Overview

XC2V1000-6FFG896C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FF896) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 5,120 CLBs, 40 DCMs, 40 18-Kb Block SelectRAM™ modules (720 Kbits total), and 160 dedicated 18×18 multipliers. It delivers high-speed I/O up to 840 Mb/s LVDS and supports DDR memory interfaces for telecom and video processing systems.

For engineers reviewing the XC2V1000-6FFG896C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), clock management specs (DCM phase shift resolution, frequency synthesis), and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V1000-6FFG896C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by DCM-generated 180° phase-shifted clocks for precise timing alignment.

Each CLB contains four slices with dual 4-LUTs, two storage elements, carry chains, and horizontal cascade logic; each Block SelectRAM provides true dual-port synchronous RAM (16K×1 to 512×36) with three read-during-write modes. The 40 DCMs offer digital clock deskew, M/D ratio frequency synthesis, and 1/256-period fine-grained phase shifting.

Key Specifications

Pinout & Package

XC2V1000-6FFG896C uses the FF896 flip-chip fine-pitch BGA package (1.00 mm pitch, 31×31 mm body), optimized for thermal performance and high I/O density. It features 896 balls arranged in 32×32 array with corner missing, including 432 user I/Os, 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK–TDO, TMS, HSWAP_EN, DXN/DXP, RSVD), and power/ground balls distributed across the array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1000-6FFG896C, the -5 variant trades 40 MHz speed for lower cost without changing footprint or functionality, while the Virtex UltraScale+ offers orders-of-magnitude higher capacity and integrated interfaces-but requires full redesign due to incompatible architecture, toolchain, and packaging.

Availability

XC2V1000-6FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial control systems, and test instrumentation requiring stable component supply across extended product lifecycles.

Supply support for XC2V1000-6FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic and developed the Virtex family as high-performance FPGA platforms for demanding system-level applications.

The Virtex-II product line was engineered for high-speed communications, video processing, and DSP acceleration, combining dense logic, embedded memory, and advanced clock management in a single reconfigurable device.

FAQ

What is the maximum operating frequency of the XC2V1000-6FFG896C?

The XC2V1000-6FFG896C has a -6 speed grade, specifying a maximum internal clock speed of 420 MHz per Xilinx DS031 documentation. This applies to internal logic paths under typical conditions; actual achievable frequency depends on design complexity, routing, and temperature. The DCMs support output frequencies derived via M/D synthesis, enabling precise clock generation beyond the base 420 MHz limit for specific domains.

Does the XC2V1000-6FFG896C support DDR2 memory interfaces?

Yes, the XC2V1000-6FFG896C supports DDR2 memory interfaces through its SelectIO-Ultra I/O banks, which include dedicated DDR input and output registers, programmable drive strength (2–24 mA), and SSTL_18_I/II standards compliant with JEDEC DDR2 specifications. External termination and layout must meet DDR2 timing and impedance requirements, but the device provides all necessary on-die clocking and data capture logic.

How many Block SelectRAM modules does the XC2V1000-6FFG896C contain?

The XC2V1000-6FFG896C contains 40 Block SelectRAM™ modules, each providing 18 Kbits of true dual-port synchronous RAM. This yields 720 Kbits of block memory, configurable from 16K×1 to 512×36, with three read-during-write modes. These blocks are essential for implementing large FIFOs, frame buffers, and lookup tables without external memory.

Is the XC2V1000-6FFG896C RoHS compliant?

Yes, the XC2V1000-6FFG896C is RoHS compliant and available in Pb-free packaging. Xilinx explicitly states wire-bond packages (CSG, FGG, BGG) and flip-chip packages (FF, BF) meet RoHS requirements. The FF896 package used by XC2V1000-6FFG896C falls under this certification, with lead-free solder ball composition and halogen-free substrate materials per EU Directive 2011/65/EU.

Can the XC2V1000-6FFG896C perform partial reconfiguration?

Yes, the XC2V1000-6FFG896C supports partial reconfiguration as documented in the Virtex-II Functional Description module. This allows dynamic replacement of specific logic modules while the rest of the design remains operational-critical for adaptive radio, real-time protocol switching, or field-upgradable firmware. Implementation requires Xilinx ISE tools with Partial Reconfiguration license and careful floorplanning using modular design methodology.