AMD XC2V1000-6FGG256C

Overview

XC2V1000-6FGG256C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 5,120 Configurable Logic Blocks (CLBs), 40 18-Kb Block SelectRAM™ modules (720 Kbits total RAM), and 160 dedicated 18×18 multipliers. It delivers high-speed I/O up to 840 Mb/s LVDS and supports PCI-X/PCI/DDR interfaces for telecom and networking systems.

For engineers reviewing the XC2V1000-6FGG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its 328-user-I/O count in FGG256 packaging, DCM-based clock management (12 DCMs), DCI-enabled on-die termination, dual-port block RAM configuration flexibility, and 1.5V core / 3.3V I/O supply architecture.

Technical Context

The XC2V1000-6FGG256C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support DDR input/output registers with 180° phase-shifted clocks generated by integrated Digital Clock Managers (DCMs), enabling precise source-synchronous timing for high-speed memory and serial interfaces.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic; each Block SelectRAM supports independent synchronous dual-port access (e.g., 512×36-bit) with three read-during-write modes. The device uses a 0.15 µm/0.12 µm 8-layer metal CMOS process and requires VCCINT = 1.5 V, VCCAUX = 3.3 V, and programmable VCCO per bank.

Key Specifications

Pinout & Package

XC2V1000-6FGG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.00 mm pitch, Pb-free construction, and wire-bond interconnect. The package supports 328 user I/Os distributed across 16 I/O banks, plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC2V1000-5FGG256C and XC2V1000-6FGG456C, the XC2V1000-6FGG256C uniquely balances maximum I/O count (328) in the smallest FGG-package footprint while guaranteeing -6 speed performance - making it optimal for space-constrained, high-bandwidth embedded systems requiring PCI-X or DDR2 interfaces without board re-spin.

Availability

XC2V1000-6FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging acquisition, and defense radar signal processing requiring stable component supply across extended production lifecycles.

Supply support for XC2V1000-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as high-performance, system-level FPGAs targeting demanding compute and interface applications.

The Virtex-II product line was engineered for high-density, high-speed digital systems in telecommunications, wireless infrastructure, and video processing - emphasizing clock management precision, memory integration, and I/O flexibility over cost-optimized logic density.

FAQ

What is the maximum number of user I/O pins supported by XC2V1000-6FGG256C?

The XC2V1000-6FGG256C supports 328 user I/O pins in the FGG256 package, distributed across 16 I/O banks. This count excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The value is confirmed in Table 6 of DS031-1 (v3.5) for XC2V1000 in FG/FGG256 packaging.

Does XC2V1000-6FGG256C support on-chip termination for memory interfaces?

Yes, XC2V1000-6FGG256C supports Digitally Controlled Impedance (DCI) for on-chip series or split termination on compatible I/O standards including SSTL, HSTL, and LVDS. DCI eliminates external termination resistors and maintains impedance matching across voltage/temperature variations - critical for reliable DDR SDRAM and QDR SRAM interfaces.

What clock management resources are integrated into XC2V1000-6FGG256C?

XC2V1000-6FGG256C integrates 12 Digital Clock Manager (DCM) modules and 16 global clock multiplexer buffers. Each DCM provides jitter-reduced clock synthesis, de-skew, coarse/fine phase shifting (down to 1/256 clock period), and frequency multiplication/division - enabling robust clock domain crossing and high-speed source-synchronous I/O timing in the XC2V1000-6FGG256C.

Can XC2V1000-6FGG256C be configured via JTAG boundary scan?

Yes, XC2V1000-6FGG256C fully supports IEEE 1149.1 boundary-scan testing and configuration via its dedicated TCK, TMS, TDI, and TDO pins. It implements BYPASS, SAMPLE, EXTEST, INTEST, and HIGHZ instructions, and also complies with IEEE 1532 for in-system programming - allowing both debug access and secure bitstream loading without requiring dedicated configuration pins.

What is the core voltage requirement for XC2V1000-6FGG256C?

XC2V1000-6FGG256C requires VCCINT = 1.5 V ± 3% for the core logic array, VCCAUX = 3.3 V ± 5% for auxiliary circuitry (including DCMs and configuration logic), and programmable VCCO per I/O bank (1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on IOSTANDARD). These values are specified in Module 3 (DC Characteristics) of DS031.