AMD XC2V1000-6FGG456C

Overview

XC2V1000-6FGG456C from Xilinx is a 1-million-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 5,120 Configurable Logic Blocks (CLBs), 40 Digital Clock Managers (DCMs), 40 Block SelectRAM™ modules (432 Kbits total), and supports up to 328 user I/Os. It is used in high-speed telecom and networking systems requiring PCI-X, LVDS, and DDR interfaces.

For engineers reviewing the XC2V1000-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (328), DCM count (40), CLB density (5,120), core voltage (1.5 V), and support for DCI-enabled single-ended standards including LVDCI_33 and HSTL_I_DCI.

Technical Context

The XC2V1000-6FGG456C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-shifted clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, two flip-flops/latches, carry chains, and horizontal cascade logic. Block SelectRAM resources provide true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with read-during-write capability and dedicated 18×18 multipliers adjacent to each block.

Key Specifications

Pinout & Package

XC2V1000-6FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG) package with 1.00 mm pitch, Pb-free construction, and 328 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1000-6FGG456C, the -5 variant trades timing margin for cost, while the XC2V1500-6FGG456C offers direct pin-compatible upgrade path with +50% CLBs and +20% DCMs-enabling expanded functionality without layout revision.

Availability

XC2V1000-6FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, PCI-X peripheral bridging, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for XC2V1000-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, specializing in FPGA, SoC, and adaptive compute acceleration platforms for high-performance digital systems.

The Virtex-II family was designed for high-bandwidth, low-latency applications in telecommunications, networking, and video processing-emphasizing I/O flexibility, clock management, and embedded memory integration.

FAQ

What is the maximum number of user I/Os supported by XC2V1000-6FGG456C?

XC2V1000-6FGG456C supports 328 user I/Os in the FGG456 package. This count excludes 15 dedicated configuration and JTAG pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD). The I/O count is fixed for this device/package combination and confirmed in Table 6 of DS031-1 (v3.5).

Does XC2V1000-6FGG456C support LVDS signaling?

Yes, XC2V1000-6FGG456C supports LVDS signaling at up to 840 Mb/s through its SelectIO-Ultra I/O banks. It implements LVDS_25 and LVDS_33 standards with dedicated current-mode drivers, and also supports LVDS with DCI (LVDS_25_DCI) for on-die termination. Differential pairs require adjacent pins and shared clock routing as defined in the IOB architecture.

What clock management resources does XC2V1000-6FGG456C include?

XC2V1000-6FGG456C includes 40 Digital Clock Manager (DCM) modules. Each DCM provides clock de-skew, frequency synthesis (M/D ratio), coarse and fine phase shifting (down to 1/256 of period), and duty cycle correction. Up to 16 global clock multiplexer buffers distribute clock signals across the device with glitch-free switching.

Is XC2V1000-6FGG456C compatible with Pb-free assembly processes?

Yes, XC2V1000-6FGG456C uses a Pb-free FGG456 package (1.00 mm pitch) compliant with RoHS requirements. The "G" in FGG denotes Pb-free construction, and the device supports standard lead-free reflow profiles per IPC/JEDEC J-STD-020. No special handling or underfill is required beyond standard BGA assembly guidelines.

Can XC2V1000-6FGG456C perform partial reconfiguration?

Yes, XC2V1000-6FGG456C supports partial reconfiguration as specified in the Virtex-II architecture. Configuration frames can be rewritten dynamically to modify functional blocks without resetting the entire device. This capability requires use of Xilinx ISE tools with partial reconfiguration flow and adherence to frame-boundary alignment rules defined in UG071.