AMD XC2V1500-4BG575I

Overview

XC2V1500-4BG575I from Xilinx is a 1.5-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (1.27 mm pitch), designed for high-performance telecommunication, networking, and DSP applications. It features 7,680 CLB slices, 48 Digital Clock Manager (DCM) modules, 48 × 18-Kb Block SelectRAM™ memory blocks (528 Kb total), and supports up to 392 user I/Os with SelectIO™-Ultra technology including LVDS, SSTL, HSTL, and PCI-X compliance.

For engineers reviewing the XC2V1500-4BG575I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, industrial-grade (-40°C to +100°C) timing parameters, I/O standard support matrix, DCM phase-shifting capability, and wire-bond BGA package constraints - all critical for DDR interface design, clock domain crossing, and high-speed memory controller implementation.

Technical Context

The XC2V1500-4BG575I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its 48 DCM modules provide fully digital, self-calibrating clock management - including precise de-skew, M/D frequency synthesis, and fine-grained ±1/256-period phase shifting - enabling deterministic timing closure in multi-clock-domain systems.

Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) for on-chip series or split termination. The 7,680 CLB slices each contain two 4-input LUTs, dual storage elements, carry chains, and horizontal cascade logic - optimized for synchronous logic, distributed RAM, and 16-bit shift register functions.

Key Specifications

Pinout & Package

BG575 is a 575-ball standard Ball Grid Array package with 1.27 mm pitch, wire-bond interconnect, and thermal pad-compatible footprint. It supports industrial temperature operation (-40°C to +100°C) and Pb-free assembly (BGG575 variant).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC2V1500-4BG575I, the XC2V1500-5FG676C offers more I/Os in a smaller footprint but sacrifices industrial temperature operation, while the XC2V2000-4FF896I delivers 33% more logic and 59% more I/Os at the cost of flip-chip packaging complexity and higher BOM cost - making XC2V1500-4BG575I optimal for cost-sensitive, thermally demanding embedded control applications requiring proven wire-bond reliability.

Availability

XC2V1500-4BG575I is available at Aetrix Electronics and suitable for telecom line card development, industrial video encoder production, and PCI-X embedded server deployment requiring stable component supply across extended lifecycle programs.

Supply support for XC2V1500-4BG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms.

The Virtex-II family was engineered for high-performance, system-level integration in wireline/wireless infrastructure, where deterministic timing, multi-standard I/O, and embedded memory/multiplier resources reduce reliance on external ASICs and ASSPs.

FAQ

What is the maximum operating junction temperature for XC2V1500-4BG575I?

The XC2V1500-4BG575I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is guaranteed under worst-case voltage (VCCINT = 1.5 V ±3%, VCCAUX = 3.3 V ±5%) and thermal loading conditions defined in DS031 Module 3. Thermal design must ensure θ_JA remains within limits for the BG575 package to maintain reliable operation at full utilization.

Does XC2V1500-4BG575I support DDR2 SDRAM interfaces?

Yes, XC2V1500-4BG575I supports DDR2 SDRAM interfaces through its SelectIO™-Ultra I/O banks configured for SSTL_18_I or SSTL_18_II standards, combined with dedicated DDR input/output registers per IOB and DCM-controlled phase-aligned clocks. The device's 392 user I/Os allow full x32 data bus plus address/control lines, and its 528 Kb block RAM can buffer command queues or calibration data.

How many DCMs are available in XC2V1500-4BG575I and what clocking functions do they support?

XC2V1500-4BG575I contains 48 Digital Clock Manager (DCM) modules. Each supports precise input clock de-skew, integer/non-integer frequency synthesis (M/D ratio), coarse (90°/180°/270°) and fine-grained (±1/256 period) phase shifting, and duty cycle correction - enabling robust clock domain crossing, source-synchronous interface timing, and jitter reduction in multi-clock systems.

Is XC2V1500-4BG575I compatible with Pb-free soldering processes?

Yes, the XC2V1500-4BG575I is available in Pb-free packaging as BGG575, which uses lead-free solder spheres and complies with JEDEC J-STD-020 moisture sensitivity level (MSL) 3. Standard reflow profiles for SnAgCu (SAC305) apply, with peak temperature ≤260°C. Refer to Xilinx document DS031 Module 1 for full Pb-free handling and assembly guidelines.

Can XC2V1500-4BG575I perform partial reconfiguration?

Yes, XC2V1500-4BG575I supports partial reconfiguration as specified in Xilinx documentation DS031. This allows dynamic swapping of logic modules (e.g., changing modulation schemes in a software-defined radio) without resetting the entire device. Implementation requires use of Xilinx ISE tools with partial bitstream generation and careful floorplanning to isolate reconfigurable regions.