AMD XC2V1500-4BGG575C

Overview

XC2V1500-4BGG575C from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 7,680 CLBs, 240 dedicated 18×18 multipliers, 48 Block SelectRAM™ modules (528 Kbits total), and 8 DCMs. It supports high-speed I/O up to 840 Mb/s LVDS and DDR interfaces for telecom and networking systems.

For engineers reviewing the XC2V1500-4BGG575C datasheet, pinout, applications, or equivalent options, key selection factors include its 392 user I/O count in BGG575 packaging, 1.5V core voltage, dual-port RAM configuration flexibility, DCI-enabled on-die termination, and compatibility with PCI-X/PCI/DDR/SSTL/HSTL standards.

Technical Context

The XC2V1500-4BGG575C implements a hierarchical SRAM-based architecture with four primary logic resources: Configurable Logic Blocks (CLBs), Block SelectRAM™ memory, 18×18 multipliers, and Digital Clock Managers (DCMs). Its Active Interconnect routing provides predictable delay independent of fanout, supported by 16 global clock lines and 24 long-line routing tracks per row/column.

Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, GTL) and differential (LVDS, BLVDS, LVPECL, LDT) signaling, with Digitally Controlled Impedance (DCI) enabling on-chip series or split termination for 15+ I/O standards. The device uses a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5V VCCINT, 3.3V VCCAUX, and programmable VCCO per bank.

Key Specifications

Pinout & Package

XC2V1500-4BGG575C is housed in a Pb-free 575-ball standard BGA (BGG575) package with 1.27 mm pitch, 31 mm × 31 mm body size, and wire-bond interconnect. It supports 392 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1500-5BGG575C, the XC2V1500-4BGG575C trades speed margin for lower power and cost; compared with XC2V2000-4FF896C, it offers identical speed grade but significantly smaller footprint and lower I/O count - making it optimal for space-constrained, mid-complexity embedded systems where pin compatibility and thermal manageability are prioritized.

Availability

XC2V1500-4BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and broadcast video equipment requiring stable component supply over extended production lifecycles.

Supply support for XC2V1500-4BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for high-bandwidth, low-latency programmable logic in telecom, networking, and DSP applications - delivering scalable gate density, integrated memory/multiplier resources, and advanced I/O with DCI and DCM technology.

FAQ

What is the maximum number of user I/Os supported by XC2V1500-4BGG575C?

The XC2V1500-4BGG575C supports 392 user I/Os in the BGG575 package, as confirmed in Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The I/O count is fixed for this device/package combination and does not vary with speed grade or temperature range.

Does XC2V1500-4BGG575C support DDR memory interfaces?

Yes, XC2V1500-4BGG575C natively supports DDR SDRAM and DDR SRAM interfaces through its SelectIO™-Ultra I/O banks. Each IOB includes dedicated DDR input and output registers, and the device supports SSTL2_I/II and SSTL3_I/II standards with programmable VCCO per bank - enabling direct connection to DDR memory without external level-shifting circuitry.

What clock management resources are integrated into XC2V1500-4BGG575C?

XC2V1500-4BGG575C integrates 8 Digital Clock Manager (DCM) modules. Each DCM provides fully digital clock de-skew, frequency synthesis (M/D ratio), coarse and fine phase shifting (down to ±1/256 of period), and jitter-free clock distribution. These replace external PLLs and simplify clock tree design for multi-domain synchronous systems.

Is XC2V1500-4BGG575C compatible with PCI-X 133 MHz?

Yes, XC2V1500-4BGG575C is PCI-X 133 MHz compliant at 3.3V, as explicitly stated in the "SelectIO™-Ultra Technology" feature summary of DS031-1 (v3.5). It meets timing and electrical requirements for PCI-X 133 MHz signaling when configured with appropriate IOSTANDARD attributes and VCCO = 3.3V in relevant I/O banks.

What is the core voltage requirement for XC2V1500-4BGG575C?

XC2V1500-4BGG575C requires a nominal 1.5V core supply (VCCINT) with ±3% tolerance, as specified in Module 3 (DC Characteristics) of DS031. It also requires a dedicated 3.3V auxiliary supply (VCCAUX) and programmable I/O supply voltages (VCCO) ranging from 1.5V to 3.3V depending on I/O standard selection.