AMD XC2V1500-4BGG575I

Overview

XC2V1500-4BGG575I from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, rated for industrial temperature range (–40°C to +100°C), with 392 user I/Os, 7,680 CLBs, and 48 Digital Clock Manager (DCM) modules. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring DDR, LVDS, and PCI-X interfaces.

For engineers reviewing the XC2V1500-4BGG575I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (including LVDS, SSTL, HSTL, DCI), timing parameters for –4 speed grade, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V1500-4BGG575I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core supply (VCCINT) and dedicated 3.3 V auxiliary (VCCAUX) and I/O (VCCO) supplies. Its architecture integrates Configurable Logic Blocks (CLBs), 18-Kb Block SelectRAM™, 18×18 multipliers, and DCMs for precise clock de-skew and phase shifting.

It supports 19 single-ended and 6 differential I/O standards-including LVDS, BLVDS, LVPECL, SSTL-2/3, HSTL-I/II/III/IV-with Digitally Controlled Impedance (DCI) for on-chip termination. The –4 speed grade guarantees 420 MHz internal clock speed and 840+ Mb/s I/O performance under industrial conditions.

Key Specifications

Pinout & Package

XC2V1500-4BGG575I uses a 575-ball standard BGA (BGG575) package with 1.27 mm pitch, 31 mm × 31 mm body size, and Pb-free construction. Pin definitions follow Xilinx DS031 Module 4, with dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG TAP signals (TCK/TMS/TDI/TDO), and 392 user-configurable I/Os grouped in banks with independent VCCO and VREF.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1500-4BGG575I, the XC2V1500-5FG676C offers more I/Os in a smaller footprint but lacks industrial temperature support, while the XCVU3P-2FFVB2104I delivers orders-of-magnitude higher logic capacity and modern interfaces but requires full RTL and PCB redesign.

Availability

XC2V1500-4BGG575I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and industrial video encoders requiring stable component supply across extended product lifecycles.

Supply support for XC2V1500-4BGG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance, system-level FPGAs for demanding compute and interface applications.

The Virtex-II product line was designed for high-density, high-speed embedded systems in telecommunications, aerospace, and digital signal processing-emphasizing I/O flexibility, clock management, and memory-rich architectures.

FAQ

What is the maximum operating junction temperature for XC2V1500-4BGG575I?

The XC2V1500-4BGG575I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is guaranteed across all operating conditions and voltage rails, enabling deployment in fanless enclosures or high-ambient environments typical in base station radios and factory automation controllers. Thermal design must maintain junction temperature ≤100°C using appropriate PCB copper pour and heatsinking.

Does XC2V1500-4BGG575I support DDR2 memory interfaces?

Yes, XC2V1500-4BGG575I supports DDR2 SDRAM interfaces through its SelectIO-Ultra I/O banks configured for SSTL_18_I/II standards and precise DCM-controlled clocking. The device provides dedicated DDR input/output registers per IOB, enabling single-cycle capture and launch aligned to DQS strobes. Verified reference designs exist for 400–800 Mbps DDR2 operation with controlled impedance routing.

Can XC2V1500-4BGG575I be configured via JTAG only?

No-XC2V1500-4BGG575I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 JTAG. While JTAG enables boundary-scan testing and partial reconfiguration, full initial configuration requires either a PROM (master-serial/SelectMAP) or external processor (slave modes). JTAG alone cannot load the complete bitstream at power-on.

What is the purpose of the Digitally Controlled Impedance (DCI) feature in XC2V1500-4BGG575I?

The DCI feature in XC2V1500-4BGG575I provides on-die series or parallel termination resistors for supported I/O standards (e.g., LVDCI, SSTL_DCI, HSTL_DCI), eliminating the need for external resistors and reducing PCB area and signal reflections. It dynamically calibrates against an external 50 Ω reference resistor to maintain impedance accuracy within ±10%, improving signal integrity for high-speed parallel buses like DDR and QDR SRAM.

Is XC2V1500-4BGG575I pin-compatible with other Virtex-II devices in the BGG575 package?

Yes-XC2V1500-4BGG575I shares identical pinout and footprint with all other Virtex-II devices offered in the BG575/BGG575 package (e.g., XC2V1000-4BGG575I, XC2V2000-4BGG575I), as confirmed in Table 6 of DS031. This allows hardware reuse across density points, though I/O bank voltage assignments and configuration settings must be validated per device's specific resource map and timing requirements.