AMD XC2V1500-4FF896I

Overview

XC2V1500-4FF896I from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a flip-chip fine-pitch BGA package (896 pins), featuring 7,680 CLBs, 240 dedicated 18×18 multipliers, 48 Digital Clock Managers (DCMs), and 528 user I/Os. It operates across –40°C to +100°C industrial temperature range with 1.5 V core supply (VCCINT), 3.3 V auxiliary supply (VCCAUX), and programmable I/O voltage (VCCO). It targets high-speed telecommunication, DSP, and video processing systems requiring LVDS, DDR, and PCI-X interfaces.

For engineers reviewing the XC2V1500-4FF896I datasheet, pinout, applications, or equivalent options, key selection criteria include verified DCM timing parameters, DCI-enabled I/O termination support for HSTL/SSTL/LVDS, dual-port Block SelectRAM configuration flexibility (up to 512 × 36), and compatibility with Xilinx Foundation/Alliance design tools for 10M-gate compilation.

Technical Context

The XC2V1500-4FF896I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support true DDR input/output registers clocked by phase-opposed DCM outputs, enabling precise source-synchronous data capture at up to 840 Mb/s.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), fast carry chains, and horizontal cascade logic. Block SelectRAM resources deliver 18 Kb dual-port RAM per block with three read-during-write modes, while integrated 18×18 multipliers operate independently or in conjunction with SelectRAM for efficient MAC operations.

Key Specifications

Pinout & Package

XC2V1500-4FF896I uses a 31 mm × 31 mm flip-chip fine-pitch BGA package (FF896) with 1.00 mm ball pitch and 896 solder balls. The package supports 528 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1500-4FF896I, the -5 speed grade offers verified timing headroom for aggressive clock rates, while XC2V2000-4FF896I provides scalable logic capacity within identical mechanical and thermal constraints-both retain full pin compatibility and toolchain support.

Availability

XC2V1500-4FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and embedded DSP applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XC2V1500-4FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and EDA toolchains for high-performance digital system design.

The Virtex-II family was engineered for high-bandwidth, low-latency applications in telecommunications, networking, and video processing-delivering platform-level integration of logic, memory, arithmetic, and clock management in a single die.

FAQ

What is the maximum guaranteed I/O count for XC2V1500-4FF896I?

XC2V1500-4FF896I supports 528 user I/O pins in its FF896 flip-chip BGA package, as confirmed in Table 2 and Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated configuration and JTAG pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. All 528 I/Os are fully programmable for single-ended or differential signaling standards including LVDS, SSTL, and HSTL.

Does XC2V1500-4FF896I support on-chip termination for memory interfaces?

Yes, XC2V1500-4FF896I supports Digitally Controlled Impedance (DCI) for on-chip series or split termination across multiple I/O standards including HSTL_I/II/III/IV, SSTL18/2/3, and LVDS_25_DCI. This eliminates external termination resistors for DDR SDRAM and QDR SRAM interfaces, reducing BOM cost and improving signal integrity at speeds up to 200 MHz.

Can XC2V1500-4FF896I be configured via JTAG boundary scan?

Yes, XC2V1500-4FF896I fully complies with IEEE 1149.1 and supports boundary-scan configuration via its TCK/TMS/TDI/TDO pins. It implements EXTEST, INTEST, and HIGHZ test instructions, and also supports IEEE 1532 for in-system programming. Configuration bitstream encryption remains active during JTAG loading if enabled.

What clock management resources does XC2V1500-4FF896I include?

XC2V1500-4FF896I integrates 48 Digital Clock Manager (DCM) modules. Each DCM provides de-skew, frequency synthesis (M/D ratio), coarse/fine phase shifting (±1/256 cycle resolution), and duty-cycle correction. Up to four DCM outputs can drive the 16 global clock multiplexer buffers, enabling robust multi-clock domain synchronization in XC2V1500-4FF896I-based systems.

Is XC2V1500-4FF896I compatible with Xilinx Alliance Series development tools?

Yes, XC2V1500-4FF896I is fully supported by Xilinx Alliance Series software (v4.2+), including synthesis, place-and-route, timing analysis, and bitstream generation. It also works with Foundation Series tools and supports VHDL/Verilog flows, partial reconfiguration, and readback debugging-all validated in DS031 documentation for the Virtex-II platform.