AMD XC2V1500-4FG676I

Overview

XC2V1500-4FG676I from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FG676) package, rated for industrial temperature range (–40°C to +100°C), with 392 user I/Os, 48 Configurable Logic Blocks (CLBs), and 48 Digital Clock Managers (DCMs). It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring deterministic clock management and multi-standard I/O.

For engineers reviewing the XC2V1500-4FG676I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource count, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V1500-4FG676I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core supply (VCCINT), 3.3 V auxiliary supply (VCCAUX), and programmable I/O voltage (VCCO). Its architecture integrates 7,680 CLB slices, 240 dedicated 18×18 multipliers, and 48 dual-port 18-Kb Block SelectRAM modules - each configurable from 16K×1 to 512×36 bits with three read-during-write modes.

It features 48 Digital Clock Manager (DCM) blocks supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution), plus 16 global clock multiplexer buffers. I/O subsystem supports 19 single-ended and 6 differential standards including LVDS (840 Mb/s), PCI-X (133 MHz), and HSTL/SSTL with Digitally Controlled Impedance (DCI) for on-chip termination.

Key Specifications

Pinout & Package

XC2V1500-4FG676I uses a 676-ball Fine-Pitch Ball Grid Array (FG676) package with 1.00 mm pitch, 27 mm × 27 mm body size, and wire-bond interconnect. The package supports 392 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1500-4FG676I, the -5 variant improves timing headroom while retaining full pin and logic compatibility, whereas XC3S1600E-4FG484I trades clock precision and I/O flexibility for lower unit cost and power - making it viable only where DCM-dependent functions are absent.

Availability

XC2V1500-4FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial motion control systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V1500-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-first platform FPGAs with integrated IP and hardened peripherals.

The Virtex-II family was designed for high-performance, system-level integration in telecommunications, wireless infrastructure, and video processing - emphasizing clock management, memory hierarchy, and multi-standard I/O interoperability.

FAQ

What is the maximum operating junction temperature for XC2V1500-4FG676I?

The XC2V1500-4FG676I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification is guaranteed under continuous operation with proper PCB thermal design, including adequate copper pour and airflow. The device's 1.5 V core supply and 0.15 µm process contribute to manageable thermal dissipation even at full utilization. Always verify thermal performance using Xilinx's XPower Analyzer with your specific design netlist and constraints.

Does XC2V1500-4FG676I support JTAG boundary-scan testing?

Yes, XC2V1500-4FG676I fully supports IEEE 1149.1 boundary-scan testing via its dedicated TCK, TMS, TDI, and TDO pins. The device implements BYPASS, SAMPLE, PRELOAD, EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect testing and in-system programming. Configuration through JTAG (IEEE 1532) is also supported, allowing secure bitstream loading and readback verification without external configuration PROMs.

Can XC2V1500-4FG676I interface directly with DDR SDRAM?

Yes, XC2V1500-4FG676I supports DDR SDRAM interfaces through its SelectIO-Ultra I/O banks configured for SSTL_2_I or SSTL_2_II standards, with programmable output drive strength and input termination. The device includes dedicated DDR input/output registers in IOBs and DCMs for precise clock forwarding and phase alignment - enabling reliable 200+ MHz data rates. External resistors may be needed for VREF stability depending on memory module specifications.

How many 18-Kb Block SelectRAM modules does XC2V1500-4FG676I contain?

XC2V1500-4FG676I contains 48 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. These blocks are independently configurable from 16K×1 to 512×36 bits and support three read-during-write modes. Total embedded RAM capacity is 528 Kbits, usable for FIFOs, frame buffers, lookup tables, or coefficient storage - eliminating need for external memory in many compute-intensive applications.

Is XC2V1500-4FG676I pin-compatible with other Virtex-II devices in FG676 packaging?

Yes, all Virtex-II devices offered in FG676/FGG676 packages - including XC2V1000, XC2V1500, and XC2V2000 - share identical pinouts and footprint compatibility. This enables scalable design reuse: a board designed for XC2V1500-4FG676I can accommodate XC2V1000 or XC2V2000 without layout changes, provided I/O banking and voltage requirements are observed. However, logic resource count and DCM availability differ between densities.