AMD XC2V1500-4FGG676C

Overview

XC2V1500-4FGG676C from Xilinx is a 1.5-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 7,680 CLBs, 240 dedicated 18×18 multipliers, 48 Block SelectRAM™ modules (528 Kbits total), and 12 Digital Clock Managers (DCMs). It targets high-speed telecommunication line cards requiring PCI-X 133 MHz I/O, LVDS 840 Mb/s serial links, and embedded DSP acceleration.

For engineers reviewing the XC2V1500-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include verified 392-user-I/O count in FGG676, DCI-enabled on-die termination for HSTL/SSTL/LVCMOS standards, DCM-based sub-100 ps clock deskew, and support for partial reconfiguration in deployed systems.

Technical Context

The XC2V1500-4FGG676C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-locked DCM outputs with 1/256-cycle resolution.

Internally, it uses a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO) ranging from 1.5 V to 3.3 V. Configuration occurs via Slave SelectMAP mode with optional Triple-DES bitstream encryption and readback capability for real-time debugging.

Key Specifications

Pinout & Package

XC2V1500-4FGG676C is housed in a Pb-free wire-bond Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch, 27 mm × 27 mm body size, and 676 solder balls. The package supports 392 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1500-4FGG676C, the -5 variant improves timing margin without changing footprint or power envelope, while the XC2V2000-4FF896C expands capacity at the cost of package incompatibility and increased thermal management complexity.

Availability

XC2V1500-4FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, and video processing applications requiring stable component supply and long-term obsolescence management.

Supply support for XC2V1500-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGA, adaptive SoC, and ACAP technologies for high-performance computing and embedded systems.

The Virtex-II family was designed for high-density, high-speed applications including telecommunications infrastructure, wireless base stations, and digital signal processing systems demanding advanced clock management and memory bandwidth.

FAQ

What is the maximum number of user I/Os supported by XC2V1500-4FGG676C?

XC2V1500-4FGG676C supports exactly 392 user I/Os, as confirmed in Table 6 of DS031-1 (v3.5) for the XC2V1500 device in the FGG676 package. This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The FGG676 package itself has 676 balls, with the remainder allocated to power, ground, and configuration functions.

Does XC2V1500-4FGG676C support PCI-X 133 MHz operation?

Yes, XC2V1500-4FGG676C supports PCI-X 133 MHz at 3.3 V, as explicitly listed under "SelectIO™-Ultra Technology" in the Summary of Features (DS031-1 p.1). This capability is implemented in its IOBs and validated for wire-bond packages including FGG676, enabling direct interface to enterprise server expansion slots without level-shifting.

What clock management resources are integrated into XC2V1500-4FGG676C?

XC2V1500-4FGG676C integrates 12 Digital Clock Manager (DCM) modules and 16 global clock multiplexer buffers. Each DCM provides precise clock deskew, flexible frequency synthesis (M/D ratio), and high-resolution phase shifting (1/256 cycle steps), enabling robust clock distribution across the 392 I/Os and internal logic array.

Is XC2V1500-4FGG676C compatible with DDR memory interfaces?

Yes, XC2V1500-4FGG676C supports DDR memory interfaces through dedicated DDR input and output registers in its IOBs, along with DCI termination for SSTL and HSTL standards. It is documented for SDR/DDR SDRAM and QDR SRAM interfaces, with source-synchronous timing guidelines provided in Module 3 of DS031.

What configuration modes does XC2V1500-4FGG676C support?

XC2V1500-4FGG676C supports five configuration modes: Slave-serial, Master-serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Slave SelectMAP is commonly used for high-speed parallel loading from microcontrollers or flash memory, while Boundary-Scan enables in-system programming and JTAG verification.